Folie quer

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MINAEST-NET Partnering Workshop _at_ TU
Berlin/FhG-IZM, Berlin, Germany - 22 April 2005
Nano Technology for Microelectronics
Packaging Karl-Friedrich Becker, Rolf
Aschenbrenner BECAP - TU Berlin / Fraunhofer
IZM Gustav-Meyer-Allee 25 / 13355
Berlinkarl-friedrich.becker_at_izm.fraunhofer.de
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Hetero System Integration on Organic Substrate
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Possible Applications for Nanotechnology within
Electronic-Packaging
Transparent Encapsulation / Provide diffusion
barriers for OLEDs
Module protection by planar encapsulation /
functional layers
Self Assembly of Components
Low temperature inter-connection technology for
low cost applications / for (bio-)sensors
DISPLAY
BATTERY
R-NET

• IC

OSCILLATOR
COIL
TAPE
SAW-Filter
Sensor Devices with Nano Functionality
Base material with optimized mechanical, optical
and electrical properties and geometrical
functionality
Advanced thin film technology for RF integration
(self assembly)
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Nano Materials for Packaging IZM Focus
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Interconnects for NanoSystems Aims

• Interconnect Targets
• Fine pitchdue to increasing no. of interconnects
  per die
• Low profilefor improved high frequency
  performance
• Low temperature potentialto allow heterogeneous
  integration with temp sensitive bio and
  polytronic devices
• Low cost potentialby WL processing and
  infrastructural embedding
• Interconnect Challenges
• Planarity and Homogeneity of Fine Pitch
  Interconnects
• Surface Effects Dominate Over Bulk Effects
• Yield optimum combination of LowTemperature
  Interconnection for Bio Packaging, Low Cost
  Packaging, ... and High Temperature Stability
• Low Profile Interconnects Need Stress Compensation

40 µm Flip Chip Pitch and 60 Wire Bond Pitch
eGrain
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Interconnection Technology from Micro to Nano
Molecular Modeling
Continuum Approach FEM Simulation
Potential for Low Temperature Interconnects
/ Reactive Interconnects
Complexity
NanoVelcro / NanoLawn
Nickel Bump / UT Solder Bump
Solder Bump / Wire Bond
100 µm
10 nm
100 nm
1 µm
10 µm
1000 µm
Interconnect Pitch
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Nano-Reliability at IZM
Structure - Property Correlation by Combined
Simulation Experiment
Contact B. Wunderle Department Mechanical
Reliability Micro Materials
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Outlook - Nano Technology Potential for Packaging
Applications

• Advanced Devices as carbon nano tubes, molecule
  transistors, -sensors, -actuators
• Effective Interconnection Technologies as thin,
  elastic, reactive interconnects, vertical and
  horizontal orientation, additive structure
  generation and low temperature interconnection
  technologies
• Improved Materials e.g. low cost thermal
  management, tailor made materials, super
  materials
• Cost Efficient Assembly zero-force, high
  precision component assembly, handling of
  smallest geometries, self-assembly resolving the
  handling issues of state of the art technology
• System Integration Sensors, Actuators and MOEMS