Wafer Dicing

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Wafer Dicing

• Cutting the antenna wafer into individual antenna

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Wafer Dicing uses a Microautomation 1100 dicing
saw
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Uses a water cooled diamond blade
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A video camera shows the location of the saw cut
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When complete, the wafer will be cut into
individual antenna
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• Now is the time to start working on your
  PowerPoint presentation slides