IC????

1
IC????
2
IC??????
?IC???? ?????? ????????? ????.??.????? ?IC???
????? ?IC??????? a.CMOS.BI-POLAR.BI-CMOS??
b.IC ?????
3
IC??????
IC?????? 1.????????? 2.????? 3.???????????????????
????? ???????????? 4.?????. 5.??(?????)???(???
?) 6.?????????????????1 ?2?3?4?
?????.4?5??????.
4
???????
?????????????????
1.?? 2.???? 3.?? 4.?? 5.??(?? ) 6.??
???????????????????????? ????????????.
5
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1.????? ???? ???????????
?????? 2???(?????????????????.
???????????? (1)???
(2)????? (3)?????
(4)?????? ??????? (1)????
(2)????
6
IC??????
IC??????????????? 1.CMOS????
2.BIPOLAR?? 3.BI-CMOS??
7
???????????
???????????????,N??????? ?????,?????????????????,
?????????,??,R-R?????????? ????.
8
??????????????? (??)???
(??)???? ?????????????????????
9
??????-?????-???PN?????
???(??????????)
10
Failure analysis flow
Receive test fail
Failure history Check (FT/QCtest failed item
Electrical problem
no
fail
Is device Failure parmetric?
Is device failure Function?
Verify reject_at_ Room temperature
fail
yes
Verify reject_at_ High temperature
Determin fail mode (bitmap)
Curve trace (by HP4145)
fail
Verify reject_at_ Low temperature
determine temp/volt sensitivity
pass
no
Deprocesses and Om/sem/eds
1.probing 2.hot spot (emmi/liquid crystal
Decap and Om/sem
Sat/x-ray Package problem?
Fae check Application environment
yes
Made engineering decision
Bake reject 150c,24hrs