The Large-Area Psec Photo-detector Collaboration

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The Large-Area Psec Photo-detector Collaboration
Henry Frisch Enrico Fermi Institute and Argonne
National Laboratory
4 National Labs, 5 Divisions at Argonne, 3 US
small companies electronics expertise at
Universities of Chicago and Hawaii Goal of
3-year RD- commercializable modules.
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The Development of Large-area Detectors With
Space and Time Resolution

• OUTLINE
• Application Space Four frontiers- time
  resolution, area, QE, and cost (different
  applications sit at different points in this 4D
  space, but not separated by large amounts of
  development effort- all 4 are fertile.)
• The LAPPD Collaboration present status, and
  introduction to the posters and breakout session
• Challenges and Surprises (e.g., funding has been
  available at ANL for only 1 month- not yet
  available at SSL, Hawaii, UC, Arradiance,
  Minotech, Muons,Inc, Synkera,)

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Motivationand Requirements
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Application 1-Energy Frontier
At colliders we measure the 3-momenta of
hadrons, but cant follow the flavor-flow of
quarks, the primary objects that are colliding.
2-orders-of-magnitude in time resolution would
all us to measure ALL the informationgtgreatly
enhanced discovery potential.
Specs Signal 50-10,000 photons Space
resolution 1 mm Time resolution 1 psec Cost
lt100K/m2
t-tbar -gt WbW-bbar
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Application 2- Lepton Flavor Physics
(Howard Nicholson)

• Example- DUSEL detector with 100 coverage and 3D
  photon vertex reconstruction.
• Need gt10,000 square meters (!) (100 ps
  resolution)
• Spec signal single photon, 100 ps time, 1 cm
  space, low cost/m2 (5-10K/m2)

Hermetic DUSEL specs TBD
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Application 3- Medical Imaging (PET)
Reminder- mention new iniative in France for PET
and Hadron Therapy using these ideas- US should
not have to follow..
Depth of interaction measurement 375 ps
resolution (H. Kim, UC). (note distinguished
ANL/UC history in medical imaging, esp. PET)
Spec signal 10,000 photons,30 ps time, 1 mm
space, 30K/m2, MD-proof
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Application 4- Nuclear Non-proliferation

1. MCPs loaded with Boron or Gadolinium are used as
   neutron detectors with good gamma separation
   (Nova Scientific).
2. Large-area means could scan trucks, containers
3. Time resolution corresponds to space resolution
   out of the detector plane IF one has a t_0 i.e
   can do 3D tomography of objects

Specs Unknown An area for possible applications-
need a counterpart to form an application group.
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SUMMARYCharacteristics in common we need

• Small feature size ltlt 300 microns
• Homogeneity the ability to make uniform
  large-areas (think solar-panels, floor tiles,
  50-HDTV sets)
• Intrinsic low cost although application
  specific, all need low-cost materials and robust
  batch fabrication. Need to be simple.

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Parallel Efforts on Specific Applications

• .

Explicit strategy for staying on task
LAPD Detector Development
ANL,Arradiance,Chicago,Fermilab,
Hawaii,Muons,Inc,SLAC,SSL/UCB, Synkera, U. Wash.
Drawing Not To Scale (!)
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Using New Technologies to Exploit Fundamentally
Simple Ideas
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Detector Development- 3 Prongs

• MCP development- use modern fab processes to
  control emissivities, resistivities, out-gassing
• Use Atomic Layer Deposition for emissive
  material
• (amplification) on cheap inert substrates
  (glass capillary arrays, AAO). Scalable to large
  sizes economical pure i.e. chemically robust
  and stable.
• Readout Use transmission lines and modern chip
  technologies for high speed cheap low-power
  high-density readout.
• Anode is a 50-ohm stripline. Scalable up
  to many feet in length readout 2 ends CMOS
  sampling onto capacitors- fast, cheap, low-power.
  
• Use computational advances -simulation as basis
  for design
• Modern computing tools allow simulation at level
  of basic processes- validate with data.

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Micro-channel Plates PMTs

• Satisfies small feature size and homogeneity

Photon and electron paths are short- few mm to
micronsgtfast, uniform Planar geometrygtscalable
to large areas
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Simplifying MCP Construction
Conventional Pb-glass MCP OLD
Incom Glass Substrate NEW

• Chemically produced and treated Pb-glass does
  3-functions
• Provide pores
• Resistive layer supplies electric field in the
  pore
• Pb-oxide layer provides secondary electron
  emission

• Separate the three functions
• Hard glass substrate provides pores
• Tuned Resistive Layer (ALD) provides current for
  electric field (possible NTC?)
• Specific Emitting layer provides SEE

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Glass Substrate Status
ANL, Chicago, Incom, Minotech, SSL

• Have received multiple samples of 10-micron,
  20-micron, 40-micron glass substrates from Incom
  in 3/4-sq and 33 mm round formats (latter the
  SSL/ANL development format)
• Incom has ordered 8x8 shell- they are sharing
  development cost (largely paying for it, in fact)
• Incom is refining 8x8 process- changes to
  draw, grinding, polishing. Very responsive to our
  needs, very flexible.

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Self-Assembled Passive Substrates
AAO Group Hau Wang (ANL), Dmitry Routkevitch
(Synkera)postdoc, Synkera

• Alternative to glass capillary substrate-
  parallel path.
• Some advantages batch production (could be very
  cheap), inherent purity, low radioactivity
• May naturally allow funnel geometry with
  reflection photocathode (could be very very fast
  and cheap)
• Longer development path, at present glass is
  priority

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Functionalization- ALD

• ALD Group Jeff Elam, Anil Mane, Qing Peng,
  Thomas Proslier
• (ANLESD/HEP), Neal Sullivan (Arradiance), Anton
  Tremsin (Arradiance, SSL)

Jeff Elam, Thomas Proslier
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Functionalizing Incom samples
ALD Group Jeff Elam, Anil Mane, Qing Peng,
Thomas Proslier (ANLESD/HEP), Neal Sullivan
(Arradiance), Anton Tremsin (Arradiance, SSL)
ALD film
Cross-sectional EDAZ of JE1401a ALD ZnO and AL203
extend into pores Sputtered Au only on edge of
pores
SEM from Middle of JE1401a 100 nm ALD film
visible in middle of MCP

• Jeff Elam, Thomas Proslier (ESD)

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ALD-Functionalized substrates
Picture is seam between blocks
Jeff Elam, Thomas Prolier (ESD)
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First measurements of gain in an ALD SEE layer at
the APS laser test setup (Bernhard Adams,
Matthieu Cholet, and Matt Wetstein)
MCP and Photocathode Testing
Testing Group Bernhard Adams, Matthieu Cholet,
and Matt Wetstein at the APS, Ossy Siegmunds
group at SSL
LAPPD Preliminary (very)
N. B.!
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Characterization of Secondary Emission,
Photo-Emission of Materials
Characterization Group Igor Veryovkin, Thomas
Proslier, Alexander Zinovev (MSD), postdoc
(meets biweekly, joint with photocathode group-
perhaps ALD gp too in the future.)

1. Constructing dedicated setup for low-energy SEE
   and PE measurements of ALD materials- parts on
   order. (will see on tour in Bld 200).
   Goal is
   systematic exploration of best SEE materials
2. Has parts-per-trillion capability for
   characterizing photocathodes after exposure to
   Argon, MCPs beforeafter scrubbing, aging.
   Goal is to avoid
   having to scrub, aging- it is essential to
   measure and understand the surface chemistry.
3. Planning interfaces to SSL, APS vacuum systems,
   common sample database
4. Has close ties/overlap with ALD and testing groups

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Photocathode Group Klaus Attenkofer(APS), Sharon
Jelinsky(SSL), Jason McPhate(SSL), Mike Pellin
(MSD), Ossy Siegmund (SSL), Thomas Proslier(MSD),
Zikri Yusof(HEP), postdoc (meets biweekly,
joint with characterization group)
Photocathode Group

• Work is going on on multiple fronts- the
  photo-cathode is probably the most complex area
  we are dealing with.
• Bialkali photocathodes are not hard to make, have
  good QE and a spectral response well matched to
  water cherenkov counters and most optical
  applications. We (will) have a strong effort on
  them at SSL, which has the experience and a long
  track record. This will ensure having a solution
  as good as typical commercial tubes.
• At the same time, there is a strong case to be
  made that there can be substantial improvements
  in QE (see Townsends paper), spectral matching,
  and possibly chemical robustness. In addition,
  MCPs may allow reflection rather than
  transmission cathodes, with big gains in speed
  (sub-psec) and QE.
• There may be new ideas based on ALD, e.g., (see
  Mike Pellins, Greg Engels talks at Photocathode
  workshop) that are feasible and disruptive. We
  are reaching out to university groups to access
  high-end facilities and young talent- UIUC, UIC,
  and WashU.

(Yes, risky, but high payoff- if not us, who? see
Chu, Koonin)
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Sharon Jelinsky(SSL), Jason McPhate(SSL), Ossy
Siegmund (SSL),
SSL Photocathode Group

• Sealed tubes with up to 5 format havebeen
  processedwith multialkaliphotocathodes
• MCPs and delayline readout

• From Ossy Siegmunds talk at the First
  Photocathode Workshop, July 20-21, Univ. of
  Chicago/ANL

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MCP Simulation- use to make informed decisions on
materials, geometry, field,

• Simulation Group Zikri Yusov, Valentin Ivanov
  (Muons,Inc), Sergey Antipov (HEP), Zeke Insepov
  (MCSD) , Anton Tremsin (SSL/Arradiance ), Neal
  Sullivan (Arradiance)

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MCP Simulation

• Zeke Insepov (MCSD) and Valentin Ivanov
  (Muons,Inc)

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MCP Simulation

• Zeke Insepov (MCSD) and Valentin Ivanov
  (Muons,Inc)

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MCP Simulation

• Zeke Insepov (MCSD) and Valentin Ivanov
  (Muons,Inc)

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Front-end Electronics/Readout Waveform sampling
ASIC
Electronics Group Jean-Francois Genat, Gary
Varner, Mircea Bogdan, Michael Baumer, Michael
Cooney, Zhongtian Dai, Herve Grabas, Mary Heintz,
James Kennedy, Sam Meehan, Kurtis Nishimura, Eric
Oberla, Larry Ruckman, Fukun Tang (meets weekly)
First have to understand signal and noise in the
frequency domain
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Front-end Electronics
Resolution depends on 3 parameters Number of
PhotoElectrons, Analog Bandwidth, and
Signal-to-Noise
See J-F Genat, G. Varner, F. Tang, and HF arXiv
0810.5590v1 (Oct. 2008)- now published in Nucl.
Instr. Meth.

• Wave-form sampling is best, and can be
  implemented in low-power widely available CMOS
  processes (e.g. IBM 8RF). Low cost per channel.

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Front-end Electronics/Readout Waveform sampling
ASIC prototype

• Varner, Ritt, DeLanges, and Breton have
  pioneered waveformsampling onto an array of
  CMOS capacitors.

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First 0.13micron ASIC due back Oct. 20
The chip submitted to MOSIS -- IBM 8RF (0.13
micron CMOS)- 4-channel prototype. Plan on 16
channels/chip- possibly 32 later (??).
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Get position AND timeAnode Design and
Simulation(Fukun Tang)

• Transmission Line- readout both endsgt pos and
  time
• Cover large areas with much reduced channel
  account.
• US Patent

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Photonis Planicon on Transmission Line Board

• Couple 1024 pads to strip-lines with
  silver-loaded epoxy (Greg Sellberg, Fermilab).

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Comparison of measurements (Ed May and
Jean-Francois Genat and simulation (Fukun Tang)

• Transmission Line- simulation shows 3.5GHz
  bandwidth- 100 psec rise (well-matched to MCP)
• Measurements in Bld362 laser teststand match
  velocity and time/space resolution very well

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Scaling Performance to Large AreaAnode
Simulation(Fukun Tang)

• 48-inch Transmission Line- simulation shows 1.1
  GHz bandwidth- still better than present
  electronics.
• KEY POINT- READOUT FOR A 4-FOOT-WIDE DETECTOR IS
  THE SAME AS FOR A LITTLE ONE- HAS POTENTIAL

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ANL Test-stand Measurements
Jean-Francois Genat, Ed May, Eugene Yurtsev

• Sample both ends of transmission line with
  Photonis MCP (not optimum)

2 picoseconds 100 microns measured
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Test Fixture for integration of ASIC and
transmission-line anode being designed
Both parts are completely routed and ready for
submission after pinout check etc.
Test fixture for OptionE glass anode interface to
first proto-type sampling ASIC test bandwidth,
reflections, cross-talk.

• Illustration of how we operate- close Hawaii/UC
  collaboration on ASIC, system design. Larry
  Ruckman (Hawaii)- From our electronics blog (open
  to all- go to http//hep.uchicago.edu/psec)

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Mechanical Assembly
Mechanical Group Dean Walters (NE), Rich
Northrop (UC), Henry Frisch (UC), Michael Minot
(Minotech Eng.), Greg Sellberg (Fermilab) Ossy
Siegmund (SSL), Anton Tremsin (SSL/Arradiance),
R. Wagner (HEP)0.5postdoc, Sam Asare (UC), Rahul
Barwhani (UCB) Group meets weekly

• Ongoing work on
• Sealing- tray options A,C,E window seal
• Anode fabrication, testing
• Sealed-tube considerations- outgassing, getters,
  surface-physicsAssembly-
• Vacuum assembly/Alternatives
• Cost (a driver for everything)

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Cartoon of the Frugal MCP

• Put all ingredients together- flat glass case
  (think TVs), capillary/ALD amplification,
  transmission line anodes, waveform sampling

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In principle, can dial size for occupancy,
resolution- e.g. neutrinos 4by 2
This is not what we will do first.
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Mechanical Assembly

• 8 proto-type stack
• Design sketch

8 proto-type mock-up
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Mechanical Assembly
Luckily we have access to the worlds most
sophisticated test facilities at Argonne and UC

• 8 proto-type- stresses

Lead bricks
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Moreover, we have Ossy and his group

• This talk has focused on Argonne- however we are
  lucky to have Ossy Siegmunds group at SSL
  working in parallel (on a subcontract- still
  trying to get him the funds!!) on using his
  proven technologies to make bialkali
  photocathodes and ceramic-body MCPs.
• Ossy has a wealth of knowledge and experience,
  and brings a healthy skepticism to our trying to
  be faster, better and cheaper (pick any 3 is
  the old engineering adage, pace Dan Goldberg).
• In parallel we are trying to develop what Paul
  Horn (IBM) calls a disruptive technology-higher
  risk, but high payoff. Cheap glass envelope/anode
  , possibly pure gas assembly, mass production
  with no burn-in.

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Administration Transparency/Dissemination
Administration Group Karen Byrum (co-PI), Henry
Frisch (co-PI), Bob Wagner (Project Physicist),
Dean Walters (Project Engineer)

• Weekly all-subgroup meeting (Tues at 10 am)
• Web site has Blogs used for weekly meeting- open
  to the world. Has played a significant role in
  interfacing to small technical companies (both
  reassuring and also interesting them). See
  http//hep.uchicago.edu/psec/
• Web site has Library of our talks, papers,
  internal notes, documents, backup materials,etc,-
  again, goal is to be transparent and accountable.
• We have been running gt 2 workshops/year, 1 in
  Chicago, 1 in France. Very influential on a wide
  community-we benefit from contacts

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Internal Review Panels
(open to additional suggestions).

• Introduced on CDF- worked very very well.

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First Collaboration Meeting
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First Year Milestones
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Challenges and Surprises(Places we need
help)(note this is personal list from HJF with
UC/EFI hat on- not a criticism of ANL-on the
contrary, Im blown away by the breadth, depth,
and quality at ANL)

• SSL, Hawaii, UC, Arradiance, Minotech,
  Muons,Inc, Synkera have not gotten a single dime
  yet. Folks are working, but not getting paid-
  purchase orders are waiting. (systemic problem-
  not a complaint about personnel or any office).
  We had not counted on its being Oct. or later to
  start. Ossys operation on photocathodes and
  ceramic-based anodes is the biggest schedule
  risk.
• We had thought we would have access to a fully
  functioning glass shop at ANL. Being worked on
  by management, but delay and risk in schedule.
  Alternatives in local industries being developed,
  but in-house is much more flexible and effective
  for RD.
• Subcontracts cost a 15 overhead bite right off
  the top. Ossys budget in particular got hit by
  an 84K cut. Perhaps in later years one could go
  directly to SSL? (can this be made up in some
  way?)

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The End-
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