Title: Active MEMS for Wireless and Optical Space Communications
1Active MEMS for Wireless and Optical Space
Communications
NASA SpaceCommunications Symposium
- Principal Investigators Frank Merat, Stephen
Phillips - Task Number NAG3-2578
- Case Western Reserve University
- September 18, 2002
2Active MEMS for Communications
3Active MEMS for Communications
- Enterprise Relevance and Impact
4Active MEMS for Communications
- Milestones - Technical Accomplishments and
Schedules
Due Date Milestone Description Tech Accomplishments
1 April 2002 Characterize MultiPoly for mirror design 1mm radius of curvature achieveable
1 April 2002 Schedule Status Schedule Deviation
1 April 2002 Completed none
Film Stress (MPa)
615 C
570 C
Film Thickness (µm, from SiO2 interface)
5Active MEMS for Communications
- Milestones - Technical Accomplishments and
Schedules
Due Date Milestone Description Tech Accomplishments
2 June 2002 Verify MultiPoly fabrication for device fabrication Multilayers with prescribed curvatures demonstrated
2 June 2002 Schedule Status Schedule Deviation
2 June 2002 Completed none
6Active MEMS for Communications
- Milestones - Technical Accomplishments and
Schedules
Due Date Milestone Description Tech Accomplishments
3 September 2002 Develop deposition and etch processes for doped Multipoly Wafers processed, Verification in progress
3 September 2002 Schedule Status Schedule Deviation
3 September 2002 In progress Near schedule
Due Date Milestone Description Tech Accomplishments
4 December 2002 Verify actuated devices with electrodes and doped structures Devices in process
4 December 2002 Schedule Status Schedule Deviation
4 December 2002 In progress none
7Active MEMS for Communications
Risk Impact Resolution Plan
1 Poor doped device etching Delays schedule Delays demonstration Modify etch process. Process new wafers
2 Unexpected doped device curvature Delays schedule Delays demonstration Modify device design Process new wafers
3 Doped devices do not actuate Delays demonstration Isolate failure source Redesign devices/processes Process new wafers
8Active MEMS for Communications
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Event Goals
1 Doped device verification Successful release of devices Achieve desired curvature
2 Active device demonstration Electrical actuation demonstration Achieve desired steering angles
10Active MEMS for Communications