AP 5301 / 8301 Instrumental Methods of Analysis

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AP 5301 / 8301 Instrumental Methods of Analysis

• Course Coordinator Prof. Paul K. Chu
• Electronic mail paul.chu_at_cityu.edu.hk
• Tel [phone]

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Reference Books

• Encyclopedia of Materials Characterization, C.
  Richard Brundle, Charles A. Evans, Jr., and Shaun
  Wilson (Editors), Butterworth-Heinemann (1992)
• X-Ray Microanalysis in the Electron Microscopy
  (4th Edition), J. A. Chandler, North Holland
  (1987)
• Methods of Surface Analysis Techniques and
  Applications, J. M. E. Walls (Editor), Cambridge
  University Press (1990)
• Secondary Ion Mass Spectrometry, Benninghoven,
  Rudenauer, and Werner, John Wiley Sons (1987)
• Surface Analytical Techniques, J. C. Riviere,
  Oxford University Press (1990)
• Modern Techniques of Surface Science, D. P.
  Woodruff and T. A. Delchar, Cambridge University
  Press (1994)
• Analysis of Microelectronic Material Devices, M.
  Grasserbauer and H. W. Werner (Editors), John
  Wiley Sons (1991)
• Scanning Electron Microscopy and X-Ray Analysis
  (3rd Edition), J. Goldstein, D. Newbury, D. Joy,
  C. Lyman, P. Echlin, E. Lifshin, L. Sawyer, and
  J. Michael, Kluwer (2003)

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COURSE OBJECTIVES
Course Objectives

• Basic understanding of materials characterization
  techniques
• Emphasis on applications

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Classification of Characterization Techniques

• Microscopic techniques
• Surface techniques
• Depth profiling techniques
• Spectroscopic techniques
• Electrical techniques

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Microscopy and Related Techniques

• Optical Microscopy
• Scanning Electron Microscopy (SEM) /
  Energy-Dispersive X-Ray Spectroscopy (EDS) /
  Wavelength-Dispersive X-Ray Spectroscopy (WDS) /
  X-ray Diffraction (XRD)
• Transmission Electron Microscopy (TEM) / Scanning
  Transmission Electron Microscopy (STEM) /
  Electron Diffraction (ED)

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Surface Characterization Techniques

• Auger Electron Spectroscopy (AES)
• X-ray Photoelectron Spectroscopy (XPS)
• Scanning Probe Microscopy (SPM) Scanning
  Tunneling Microscopy (STM), Atomic Force
  Microscopy (AFM),

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Depth Profiling Techniques

• Auger Electron Spectroscopy (AES)
• X-Ray Photoelectron Spectroscopy XPS)
• Secondary Ion Mass Spectrometry (SIMS)
• Rutherford Backscattering Spectrometry (RBS)
• Capacitance-Voltage (CV) Measurement

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Optical Spectroscopic Techniques

• Spectrophotometry
• Photoluminescence (PL)
• Spectroscopic ellipsometry
• Modulation spectroscopy

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Electrical Techniques

• Four-Point Probe
• Hall Measurement
• Capacitance-Voltage (CV) Measurement
• Thermal Probe
• Minority Carrier Lifetime Measurement

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Ion Beam Techniques

• Rutherford Backscattering Spectroscopy (RBS)
• Proton-Induced X-Ray Emission (PIXE)
• Channeling

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Product Yield Enhancement

• Understand via modeling and simulation which
  parameters can improve product yields
• Systematically identify these parameters within
  the process
• Control and eliminate these parameters by
  identifying their root causes
• Monitor these parameters to assess the
  effectiveness of the contamination control efforts

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Surface Contaminant Identification

• Particles Optical Microscopy, SEM/EDS, AES,
  XPS, SPM
• Residues SEM/EDS, AES, XPS, SIMS
• Stain, discoloration, haze SPM, SEM, XPS, AES,
  SEM/EDS
• General surface and near-surface contamination
  XPS, AES, SEM/EDS, SIMS, RBS, PIXE

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TiN Grains (SPM)
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Residues on Integrated Circuit (SEM)
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Integrated Circuit (SEM)
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Hard Disk Defects (AES)
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Depth Profiling
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Gate Oxide Breakdown (SIMS)