E-mail: [e-mail]

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?????????

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• E-mail garyyu_at_mxic.com.tw

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Agenda

• ???????
• ??????
• ???????????
• 300mm(12?) FAB ??
• IE background???????
• ??????

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???????

• ??????????????1950???????????????, 2000
  WW???2000???
• ?????????1982????????2000??????160???,???????????
• ??????????????????????????????????????????????????
  ??

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?????????????
In Billions of Dollars
-8.6
-8.4
-33
-17
Source IDC, December 2001
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???????????

• Wafer capacity increases rapidly.
• Leading manufacturing effectiveness and
  efficiency.
• Fast technology implementation
• License and development
• Co-operate with equipment vendors.
• 3 types of IC manufactures Foundry, DRAM, IDM(
  Integrated Device Manufacturing) .

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Infrastructure of Taiwan IC Industry
Our focus
SourceEROS/ITRI IT IS Project (Mar. 2001)
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?????????
MOS Memory
Non-volatile Memory
Volatile Memory
Mask ROM
EPROM
EEPROM
OTP ROM
MTP ROM
Flash
NVRAM
DRAM
SRAM
OTP One Time ProgramMTP Multiple Time
Program(1k cycles) FLASH means that
electrical erasure in the system is for either
the whole memory array or for blocks of
it.
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IC ????????

• IC FAB ??
• ???, ??? 70-80 ?????
• ??????
• ????, ??????????????
• ????????

?ROI Income/ Invested Capital
Income/Sales Revenue Sales Revenue/Invested
Capital
Sales Margin
CapitalTurnover
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????????
10
??????????
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???????
??
??
????
????
??
????
????
????
??
????
????
????
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????(1/2)

• ??(cleaning)
• ????????????? ?
• ??(Oxidation)???(Deposition)?????(Metallization)
• 1.?????????
• 2.??????????????(PECVD)????????,??
  ?????????,??????????
• 3.???????????????
• ????(Lithography)
• ?????????????????????????????????,?????????????
  ????,???????????
• ????(Etching)
• ?????????????????IC????????

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????(2/2)

• ????(Ion Implantation)
• ????????????????????????????,??(set
  up)?????????? ?
• ????(Photoresist Strip)
• ????????,????????????????
• ????(Inspection and Measurement)
• ?????????
• ??(Testing)
• ???????????????????,???IC???????

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??????????
Bai and Gershwin (1990)4?Hughes and
Short(1986)36

• ???????(Complex Product Flows)
• ??????? (Random Yields)
• ????????(Diverse Equipment Characteristics)
• ??????(Equipment Downtime)
• ??????????????? (Production and Development in
  Share Facilities)
• ???????(Data Availability and Maintenance)

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Wafer ??
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?????IC ??
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CMOS Cross- Section Profile Structure
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IC FAB ??
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????????

• Performance indices of a manufacturing system
• Quality
• Cost
• Delivery

QCD
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?????????????

• Quality Yield
• Cost
• Utilization Rate
• Efficiency
• Wafer Out
• Delivery
• Wafer Out
• CIP/CVP
• Turn Ratio(Days/Layer)

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??????????

• ????
• ????
• ????

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?????- ???????

• Multi-Criteria
• Workload(WL)
• Machine waiting timewait for labor (WFL)

Semiconductor Industry
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?????- ???????
100
Down
80
Other 3
GAP
No product 10
No operator 7
60
Why No operator? - Not enough operator -
Assisting other tools
Production
0
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????

• ??
• ?? or ???What is your management style?
• ???????????
• ??????
• ??18-38(?)?
• ????????(07-19),????
• ?????
• ??? ??? ????
• ????????
• ???????
• ????or ???????????(Do the thing right or do the
  right thing?)
• ????

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?????

• ????????
• Safety Safety is No. 1
• Quality????,????,????,????..
• Cost????,????,????..
• Efficiency???,??,???,????,?????..
• Mis-operation????,??..
• Control???,????,????,?????,????..
• Training????,????..
• Environment????,????????..
• Morale????,????,????..
• Development????,??,????..

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??????????

• ???????? -- ?????????????
• ?????(Re-entry)?? -- ????????? loading?
• ??????????,????
• Efficiency ??
• Machine limitation
• Back up machine arrangement
• Bonding production request
• ???????????
• Wafer start/Order arrangement
• ????????? loading
• ?? control ?? product ? cycle time
• ??????????

27
????
?? ?????????,??????????? ??????
?????????? ???????????? ??????????????????? ?????
?? Just in Time ?????????????????? ?? ??????????
??????(really?)
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????

• ??...
• ???????????
• ???????
• ???????????
• ??????????
• Cycle Time ??
• ?????????
• ???????????????? 100 ??
• ??????????????

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????-???????

• ?????????-?(Utilization)???(Cycle Time)
• UtilizationCost ???
• Cycle Time ????????
• ????????
• ?????????
• ?? wafer inventory cost
• ?????????
• ?????
• ????

Util
C/T
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IC ????????

• ????
• ????

31
????

• ????????????????????,???????10????????????,???
  ??????????,????????????????35-40? Wein?1988?

Littles Law L?? L average inventory ?arrival
rate ?cycle time
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????

• ? Littles Law ????? cycle time ???
• ?? inventory????,JIT,?? lot size,????
• ?? capacity
• ?? up time/efficiency/utilization,foundry
• ????
• ?? loading????,?? rework,

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????
??????????
????
??????

??????????
????
?????????
????
?????
?? Cycle Time
????
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TOC

• TOC(Theory Of Constrain)

Bottleneck
?? ?????????,??????????????? ?? CCR Capacity
Constraint Resource NCCR Non Capacity
Constraint Resource Drum ???? Buffer Time
Buffer to protect CCR Rope ????
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TOC ?????

• ?????????
• ????????
• ??????????????
• ???????????
• ??????????????????????

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TOC ????

• 1.??CCR???
• 2.Time Buffer ???
• Keep CCR WIP ?????
• 3.??DRUM
• 4.??????(Rope)

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?????????????

• ????????
• ????????????
• ?????????????
• ????? buffer WIP ??
• ?? wafer flow buffer size

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????

• Question
• ?? capacity ???????? wafer start 10 , ??? cycle
  time ???????
• A.??,????? 10
• B.??,????? 10
• C.??,????? 10
• D.??,????? 10-20 ??
• E.??,?????20

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Cycle Time vs. Utilization

• Simulation
• Queuing Theory
• f(x)x/(1-x)
• utilizationarrival_r/service_r
• Experiment

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Production Control Structure
Supply Chain
CIM include MES( Manufacturing Execution
System) MCS( Material
Control System) AMHS(
Automatic Material Handling System )
OHT( Overhead Hoist Transport)
AGV( Automatic Guided Vehicle)
.
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?????????
Architecture
Production Database
Order
Reporting DB
Reporting
EQ data WIP data Route data
Schedule DB
Scheduling/ Dispatching
FAB Capacity Model
Throughput
Simulation
MES DB
Tool Capacity Model
MES
TCS
Repository
Forecast System
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Real Time Dispatching Objective

• Real time compute What Is Next
• Rule designed by user
• Achieve production target and delivery quality
• CIP/CVP
• Cycle time reduction
• Control cycle time deviation
• Maximum global machine utilization

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IC ??????-??(Dispatching)

• ??????
• FIFO(Firsr In First Out)????????
• Random????????
• SPT(Shortest Processing Time)??????????
• SRPT(Shortest Remaining Processing
  Time)??????????
• EDD(Early Due Date)?????????
• Slack(Slack Time)?
• SLKRO(Slack Ratio)?
• CRIRO(Critical Ratio)?
• ...

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????

• Why we need simulation
• ?? forecast ??
• ??????????????????????

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Production Simulation Introduction
Lot1 Product 1 Route 1
NOW
Model
Lot 1
Process Time
Event Series
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Equipment Simulation
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Scheduling

• Synchronize manufacturing
• Management objectives
• Cycle time, Utilization, WIP..
• Material and capacity constrain
• Material and capacity planing

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Scheduling


tolerated cycle time
ideal cycle time

earliest start tolerated start
ideal start
due day
Forward calculation
Backward calculation
Forward calculation
capacity constrain material constrain
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?????-The Road Map
? 20000 pcs/month ? base
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??????
Automatic Process Modeling
Process Optimization
Automated Process Control
Reduce Process Variability
Automated Equipment Control
Reduce Mis-operation
Automated Recipe Control
Automated Data Collection
Improved Productivity
Manual Operation
Base Capability
Source????????????
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300mm(12) Virtual FAB
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Intel 300mm FAB
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???????????

• The key factors to enhance
• transportation efficiency are
• AMHS control algorithms and
• track flexibility.
• Enabling SW algorithms include
• Vehicle Distribution and Allocation
• Dynamic Path Planning
• Enabling HW Features include
• Multi-path Layouts
• Small Footprint for Track Merge/Diverge

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IE Background ?????????????

• IE layout,capacity,costing
• Supply chain management
• PC production plan
• MFG
• On line ????????????
• Off line
• ????(simulation,dispatching,scheduling)
• Automation(FAB Automation)
• ?????????

55
???????

• ???????
• ??????????????
• ??
• ??????????(??????????)
• ????????????, patent ??
• ?????? model ?? paper (OR,??simulation,
  programming..)
• ??
• ??? EQ ?
• ????
• ??

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Q A
57
????

• ????????????????????, ????????????????????????