Executive summary from Bonding WG Meeting 16 Sep 2003

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Executive summary from Bonding WG Meeting 16
Sep 2003

• Salvatore Costa
• INFN Catania

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Summary of recent TIB/TOB prod
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Summary of recent TIB/TOB prod
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Summary of recent TIB/TOB prod
bonded Problems or lack of Rework New defects by Bonding Pull Tests on PA TAs Pull Tests on 50th PA-Sen rate
BARI (old PA) 7 Yes varying par w/ PA, edges 0-10 (avg3.3) per Mod No 8 g
(new PA) 5 No same par for all Pas 0 in 4 Mod 2 in 1 Mod for pad cleanliness No 3
FIRENZE (new PA) 8 No On 2 Mod 2 bias ring-capacitor 8 -10 g No diff w/ area 9 g Uniform across det 3
PISA (new PA) 13/16 No further details on bonding. Data not in DB yet The 3 not-yet-bonded modules had mechanical or IV problems No further details on bonding. Data not in DB yet The 3 not-yet-bonded modules had mechanical or IV problems No further details on bonding. Data not in DB yet The 3 not-yet-bonded modules had mechanical or IV problems No further details on bonding. Data not in DB yet The 3 not-yet-bonded modules had mechanical or IV problems No further details on bonding. Data not in DB yet The 3 not-yet-bonded modules had mechanical or IV problems ?
TORINO (new PA) 8 No No No 4 x 3areas 10.0 0.8g 9.7 1.3 3
FNAL (old PA) Report on last 17 See next slide No 8 1 by eye See plot 3
UCSB (old PA) 54 10 at edges of PA or for pad cleanliness ltlt 10 2 missing (besides those to be skipped) to find par (vary w/ single RMT PA) NOTE 45m to find par vs.15m tot for bonding! 7
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FNAL Bonding
Bonds are skipped for pinholes (Idiel) and
selected cases of Cac. ARCS testing following
bonding revealed no new pinholes (17K bonds).
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FNAL Bonding
RMT PAs
US power adjusted based on results.
Sen-to-PA pull test data for odd-numbered
modules Units are in grams.
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50th wire pull test

• The recommended way to perform it

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50
52
98
102
100
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DB I/F v. 3.0

• Added section "Module Pull Tests" for the newly
  decided pull tests to be performed on bonds made
  in the PA Test areas, and on a sample (suggested
  every 50th) of real PA-Sen and Sen-Sen bonds.
• Added section on "Hybrid Quality Control "
  requested by the Strasbourg group. It concerns
  quality control of the bonds made on Hybrids by
  the producing Company.
• Added section on "Hybrid's APV Control Side Bonds
  Pull Tests" requested by the Strasbourg group. It
  concerns pull tests on the bonds made on Hybrids
  by the producing Company. These tests, which are
  destructive, are done on Hybrids rejected for
  other reasons and are themselves part of the
  Hybrid Quality Control process.
• Removed the check that required Sensor's
  calibration data (IDIEL, CAC100HZ) to exist in
  order to serve the "Module Bonding" forms This
  was decided at the July 2003 Tracker Week, on the
  argument that bonding all strips is better than
  not bonding those Modules at all.