IPC/JEDEC INDUSTRY MAPPING

1
IPC/JEDEC INDUSTRY MAPPING
Agenda Item 6.2
4th JIC meeting Regensburg, Germany June 17,
2003
2
Minimum IPC Standards Tool Kit
3
IPC STANDARDS MAP
4
IPC STANDARDS MAP (cont.)
5
ASSEMBLY

• J-STD-001
• Soldering Electrical and Electronic Assemblies
• IPC-HDBK-001
• Handbook Guide to Supplement J-STD-001
• IPC-9261
• In-Process DPMO and Estimated Yield for PWAs
• IPC-7912
• Calculation of DPMO Manufacturing Indices for
  Printed
• Board Assemblies

6
ACCEPTANCE

• IPC-DRM-40
• Through-Hole Solder Joint Evaluation Desk
  Reference Manual
• IPC-A-610
• Acceptability of Electronic Assemblies
• IPC-9191
• General Guidelines for Implementation of
  Statistical Process Control (SPC)
• IPC-DRM-SMT
• Surface Mount Solder Joint Evaluation Desk
  Reference Manual

7
SOLDERABILITY

• IPC-WP-001
• Soldering Capability White Paper Report
• J-STD-002
• Solderability Tests for Component Leads,
  Terminations, Lugs, Terminals and Wires
• J-STD-003
• Solderability Tests for Printed Boards
• IPC-WP-005
• PWB Surface Finishes
• IPC-TR-461
• Solderability Evaluation of Thick Thin Fused
  Coatings
• IPC-TR-462
• Solderability Evaluation of Printed Boards with
  Protective Coatings Over Long-Term Storage

8
SOLDERABILITY (cont.)

• IPC-TR-464
• Accelerated Aging for Solderability Evaluations
• IPC-TR-465-1
• Round Robin Test on Steam Ager Temperature
  Control Stability
• IPC-TR-465-2
• The Effect of Steam Aging Time and Temperature on
  Solderability Test Results
• IPC-TR-465-3
• Evaluation of Steam Aging on Alternative
  Finishes, Phase 11A
• IPC-TR-466
• Wetting Balance Standard Weight Comparison Test

9
ADVANCED

• IPC-TR-001
• An Introduction to Tape Automated Bonding Fine
  Pitch Technology
• IPC-WP-003
• Chip Mounting Technology
• J-STD-012
• Implementation of Flip Chip and Chip Scale
  Technology
• J-STD-013
• Implementation of Ball Grid Array Other High
  Density Technology
• J-STD-026
• Semiconductor Design Standard for Flip Chip
  Applications
• J-STD-028
• Performance Standard for Construction of Flip
  Chip and Chip Scale Bumps
• IPC-SM-784
• Guidelines for Chip-on-Board Technology
  Implementation
• IPC-MC-790
• Guidelines for Multichip Module Technology
  Utilization

10
WIRE HARNESS

• IPC-WHMA-A-620
• Requirements Acceptance for Cable Wire
  Harness Assemblies

11
OPTOELECTRONICS

• IPC-0040
• Optoelectronic Assembly and Packaging Technology

12
ASSEMBLY SUPPORT

• SMC-WP-002
• Solderability Tests for Component Leads,
  Terminations, Lugs, Terminals and Wires
• IPC-DRM-18
• Component Identification Desk Reference Manual
• IPC-DW-426
• Specification for Assembly of Discrete Wiring
• IPC-TR-581
• IPC Phase III Controlled Atmosphere Soldering
  Study
• IPC-TA-722
• Technology Assessment Handbook on Soldering
• IPC-TA-723
• Technology Assessment Handbook on Surface
  Mounting
• IPC-CM-770
• Component Mounting Guidelines for Printed Boards

13
ASSEMBLY SUPPORT(cont.)

• IPC-SM-780
• Component Packaging and Interconnecting with
  Emphasis on Surface Mounting
• IPC-SM-785
• Guidelines for Accelerated Reliability Testing of
  Surface Mount Attachments
• IPC-S-816
• SMT Process Guideline Checklist
• IPC-AJ-820
• Assembly Joining Handbook
• IPC-TP-1115
• Selection and Implementation Strategy for A
  Low-Residue No-Clean Process
• IPC-1720
• Assembly Qualification Profile

14
ASSEMBLY SUPPORT(cont.)

• IPC-7095
• Design and Assembly Process Implementation for
  BGA's
• IPC-7525
• Stencil Design Guidelines
• IPC-7530
• Guidelines for Temperature Profiling for Mass
  Soldering (Reflow Wave) Processes
• IPC-7711
• Rework of Electronic Assemblies
• IPC-7721
• Repair and Modification of Printed Boards and
  Electronic Assemblies
• IPC-9701
• Performance Test Methods and Qualification
  Requirements for Surface Mount Solder Attachments
  
• IPC-9851
• Equipment Interface Specification

15
ASSEMBLY MATERIALS
FLUX/SOLDER

• J-STD-004
• Requirements for Soldering Fluxes
• J-STD-005
• Requirements for Soldering Pastes
• J-STD-006
• Requirements for Electronic Grade Solder Alloys
  and Fluxed and Non-Fluxed Solid Solders
• IPC-TP-1043
• IPC Cleaning and Cleanliness Test Program Phase 3
  Water Soluble Fluxes Part 1
• IPC-TP-1044
• IPC Cleaning and Cleanliness Test Program Phase 3
  Water Soluble Fluxes Part 2

16
ASSEMBLY MATERIALS (cont.)
ADHESIVES

• IPC-SM-817
• General Requirements for Dielectric Surface
  Mounting Adhesives
• IPC-CA-821
• General Requirements for Thermally Conductive
  Adhesives
• IPC-3406
• Guidelines for Electrically Conductive Surface
  Mount Adhesives
• IPC-3408
• General Requirements for Anisotropically
  Conductive Adhesives Films

17
ASSEMBLY MATERIALS (cont.)
COAT/MASK

• IPC-CC-830
• Qualification and Performance of Electrical
  Insulating Compound for Printed Wiring Assemblies
  
• IPC-HDBK-830
• Guidelines for Design, Selection and Application
  of Conformal Coatings
• IPC-SM-840
• Qualification and Performance of Permanent Solder
  Mask

18
PCB / ACCEPTANCE

• IPC-DW-425A
• Design and End Product Requirements for Discrete
  Wiring Boards
• IPC-QE-605
• Printed Board Quality Evaluation Handbook
• IPC-TF-870
• Qualification and Performance of Polymer Thick
  Film Printed Boards
• IPC-MC-960
• Qualification and Performance Specification for
  Mass Lamination Panels for Multilayer Printed
  Boards
• IPC-1710
• OEM Standard for Printed Board Manufacturers'
  Qualification Profile (MQP)

19
PCB / ACCEPTANCE (cont.)

• IPC-6011
• Generic Performance Specification for Printed
  Boards
• IPC-6012
• Qualification and Performance Specification for
  Rigid Printed Boards
• IPC-6013
• Qualification Performance Specification for
  Flexible Printed Boards
• IPC-6015
• Qualification Performance Specification for
  Organic Multichip Module Mounting and
  Interconnecting Structures
• IPC-6016
• Qualification Performance Specification for
  High Density Interconnect (HDI) Layers or Boards
• IPC-6018
• Microwave End Product Board Inspection and Test

20
PCB / ACCEPTANCE (cont.)

• IPC/JPCA-6202
• Performance Guide Manual for Single- and
  Double-Sided Flexible Printed Wiring Boards
• IPC/JPCA-6801
• Terms Definitions, Test Methods, and Design
  Examples for Build-Up/High Density Interconnect
  (HDI) Printed Wiring Boards
• IPC-9191
• General Guidelines for Implementation of
  Statistical Process Control (SPC)
• IPC-9252
• Guidelines and Requirements for Electrical
  Testing of Unpopulated Printed Boards
• IPC-A-600
• Acceptability of Printed Boards

21
COMPONENTS

• J-STD-020
• Moisture/Reflow Sensitivity Classification for
  Nonhermetic Solid State Surface Mount Devices
• J-STD-032
• Performance Standard for Ball Grid Array Balls
• J-STD-033
• Handling, Packing, Shipping and Use of
  Moisture/Reflow Sensitive Surface Mount Devices
• J-STD-035
• Acoustic Microscopy for Non-Hermetic Encapsulated
  Electronic Components

22
COMPONENTS (cont.)

• IPC-9501
• PWB Assembly Process Simulation for Evaluation of
  Electronic Components
• IPC-9502
• PWB Assembly Soldering Process Guideline for
  Electronic Components
• IPC-9503
• Moisture Sensitivity Classification for Non-IC
  Components
• IPC-9504
• Assembly Process Simulation for Evaluation of
  Non-IC Components (Preconditioning Non-IC
  Components)

23
CLEANING/ CLEANLINESS

• IPC-SC-60
• Post Solder Solvent Cleaning Handbook
• IPC-SA-61
• Post Solder Semi-Aqueous Cleaning Handbook
• IPC-AC-62
• Aqueous Post Solder Cleaning Handbook
• IPC-CH-65
• Guidelines for Cleaning of Printed Boards
  Assemblies
• IPC-TR-468
• Factors Affecting Insulation Resistance
  Performance of Printed Boards
• IPC-TR-476
• Electrochemical Migration Electrically Induced
  Failures in Printed Wiring Assemblies

24
CLEANING/ CLEANLINESS (cont.)

• IPC-TR-580
• Cleaning and Cleanliness Test Program Phase 1
  Test Results
• IPC-TR-581
• IPC Phase III Controlled Atmosphere Soldering
  Study
• IPC-TR-582
• Cleaning Cleanliness Test Program for Phase
  3-Low Solids Fluxes Pastes Processed in Ambient
  Air
• IPC-TR-583
• An In-Depth Look At Ionic Cleanliness Testing
• IPC-SM-839
• Pre Post Solder Mask Application Cleaning
  Guidelines
• IPC-9201
• Surface Insulation Resistance Handbook

25
LAMINATE
FLEX

• IPC-FC-234
• PSA Assembly Guidelines for Single-
  Double-Sided Flexible Printed Circuits
• IPC-4202
• Flexible Base Dielectrics for Use in Flexible
  Printed Circuitry
• IPC-4203
• Adhesive Coated Dielectric Films for Use as Cover
  Sheets for Flexible Printed Circuitry and
  Flexible Adhesive Bonding Films
• IPC-4204
• Flexible Metal-Clad Dielectrics for Use in
  Fabrication of Flexible Printed Circuitry
• IPC-4552
• Specification for Electroless Nickel/Immersion
  Gold (ENIG) Plating for Printed Circuit Boards

26
LAMINATE (cont.)

• RIGID
• IPC-4101
• Specifications for Base Materials for Rigid and
  Multilayer Printed Boards
• IPC-4103
• Specification for Base Materials for High
  Speed/High Frequency Applications
• IPC-1730
• Laminator Qualification Profile

• HDI
• IPC-DD-135
• Qualification Testing for Deposited Organic
  Interlayer Dielectric Materials for Multichip
  Modules
• IPC-4104
• Specification for High Density Interconnect (HDI)
  and Microvia Materials
• IPC-SM-840
• Qualification and Performance of Permanent Solder
  Mask

27
LAMINATE (cont.)
FOIL

• IPC-CF-148
• Resin Coated Metal for Printed Boards
• IPC-CF-152
• Composite Metallic Materials Specification for
  Printed Wiring Boards
• IPC-1731
• Strategic Raw Materials Supplier Qualification
  Profile
• IPC-4562
• Metal Foil for Printed Wiring Applications

28
FABRICATION

• IPC-DR-570
• General Specification for 1/8 inch Diameter Shank
  Carbide Drills for Printed Boards
• IPC-DR-572
• Drilling Guidelines for Printed Boards
• IPC-OI-645
• Standard for Visual Optical Inspection Aids
• IPC-TA-724
• Technology Assessment Series on Clean Rooms
• IPC-PE-740
• Troubleshooting for Printed Board Manufacture and
  Assembly

29
REINFORCEMENT

• IPC-4412
• Specification for Finished Fabric Woven from "E"
  Glass for Printed Boards
• IPC-SG-141
• Specification for Finished Fabric Woven from "S"
  Glass for Printed Boards
• IPC-A-142
• Specification for Finished Fabric Woven from
  Aramid for Printed Boards
• IPC-QF-143
• Specification for Finished Fabric Woven from
  Quartz (Pure Fused Silica) for Printed Boards
• IPC-1731
• Strategic Raw Materials Supplier Qualification
  Profile

30
REINFORCEMENT (cont.)

• IPC-4110
• Specification and Characterization Methods for
  Nonwoven Cellulose Based Paper for Printed Boards
  
• IPC-4121
• Guidelines for Selecting Core Construction for
  Multilayer Printed Wiring Board Applications
• IPC-4130
• Specification Characterization Methods for
  Nonwoven "E" Glass Mat
• IPC-4411
• Specification and Characterization Methods for
  Non-Woven Para-Aramid Reinforcement

31
ASSEMBLY

• IPC-D-279
• Design Guidelines for Reliable Surface Mount
  Technology Printed Board Assemblies
• IPC-D-326
• Information Requirements for Manufacturing
  Electronic Assemblies
• IPC-C-406
• Design Application Guidelines for Surface Mount
  Applications Connectors
• IPC-C-408
• Design Application Guidelines for the Use of
  Solderless Surface Mount Connectors
• IPC-SM-782
• Surface Mount Design Land Pattern Standard

32
INTERFACES

• IPC-D-310
• Guidelines for Phototool Generation and
  Measurement Techniques
• IPC-A-311
• Process Controls for Phototool Generation and Use
  
• IPC-D-350
• Printed Board Description in Digital Form
• IPC-D-351
• Printed Board Drawings in Digital Form
• IPC-D-356
• Bare Substrate Electrical Test Data Format
• IPC-D-390
• Automated Design Guidelines

33
INTERFACES

• IPC-2511
• Generic Requirements for Implementation of
  Product Mfg. Description Data Transfer
  Methodology
• IPC-2531
• Standard Recipe File Format Specification
• IPC-2541
• Generic Requirements for Electronics
  Manufacturing Shop Floor Equipment Communication
  (CAMX)
• IPC-2571
• Generic Requirements for Electronics Mfg. Supply
  Chain Communication - Product Data eXchange (PDX)

34
PCB

• SMC-WP-004
• Design for Success
• IPC-2252
• Design Guide for RF/Microwave Circuit Boards
• IPC-D-317
• Design Guidelines for Electronic Packaging
  Utilizing High Speed Techniques
• IPC-D-859
• Design Standard for Thick Film Multilayer Hybrid
  Circuits
• IPC-1902
• Grid Systems for Printed Circuits
• IPC-2141
• Controlled Impedance Circuit Boards High Speed
  Logic Design

35
PCB (cont.)

• IPC-2221
• Generic Standard on Printed Board Design
• IPC-2222
• Sectional Standard on Rigid Organic Printed
  Boards
• IPC-2223
• Sectional Design Standard for Flexible Printed
  Boards
• IPC-2224
• Sectional Standard of Design of PWB for PC Cards
• IPC-2225
• Sectional Design Standard for Organic Multichip
  Modules (MCM-L) and MCM-L Assemblies
• IPC-2315
• Design Guide for High Density Interconnects
  Microvias
• IPC-2615
• Printed Board Dimensions and Tolerances

36
JEDEC IEC PAS ACTIVITY

• EIA/JESD22-B102C
• 47/1446/PAS IEC 62173 Ed. 1
• Solderability test method
• JESD22-B106-B
• 47/1447/PAS IEC 60749-15, Ed. 1
• Resistance to soldering temperature for
  through-hole mounted devices
• EIA/JESD-22-B107-A
• 47/1448/PAS IEC 62175, Ed. 1
• Marking Permanency
• 47/1629/MCR Published as part of IEC 60749-9,
  Ed. 1
• EIA/JESD22-B116
• 47/1449/PAS IEC 62176, Ed. 1
• Wire bond shear test method
• 47/1482A/RVD Withdrawal of 47/1449/PAS

37
JEDEC IEC PAS ACTIVITY

• JESD22-A110B-B
• 47/1450/PAS IEC 62177, Ed. 1
• Highly-accelerated temperature and humidity
  stress test (HAST)
• 47/1627/MCR Published as part of IEC 60749-4,
  Ed. 1
• JESD22-A104-A
• 47/1451/PAS IEC 62178, Ed. 1
• Temperature cycling
• EIA/JESD22-A114-A
• 47/1452/PAS IEC 62179, Ed. 1
• Electrostatic discharge (ESD) sensitivity testing
  human body model (HBM)
• EIA/JESD22-A115-A
• 47/1453/PAS IEC 62180, Ed. 1
• Electrostatic discharge (ESD) sensitivity testing
  machine model (MM)

38
JEDEC IEC PAS ACTIVITY

• JESD78
• 47/1454/PAS IEC 62181, Ed. 1
• IC latch-up test
• JESD22-A113-B
• 47/1455/PAS IEC 62182, Ed. 1
• Preconditioning of nonhermetic surface mount
  devices prior to reliability testing
• JESD22-A107-A
• 47/1456/PAS IEC 62183, Ed. 1
• Salt atmosphere
• 47/1633/MCR Published as part of IEC 60749-13,
  Ed. 1
• JESD22-B105-B
• 47/1457/PAS IEC 62184, Ed. 1
• Lead integrity

39
JEDEC IEC PAS ACTIVITY

• JESD22-A106-A
• 47/1458/PAS IEC 62185, Ed. 1
• Thermal shock
• 47/1631/MCR Published as part of IEC 60749-11,
  Ed. 1
• JESD22-B104-A
• 47/1459/PAS IEC 62186, Ed. 1
• Mechanical shock
• 47/1630/MCR Published as part of IEC 60749-10.
  Ed. 1
• JESD22-B103-A
• 47/1460/PAS IEC 62187, Ed. 1
• A vibration, variable frequency
• 47/1632/MCR Published as part of IEC 60749-12,
  Ed. 1
• JESD22-A101-B
• 47/1461/PAS IEC 62161, Ed.1
• Test method A101-B Steady state temperature
  humidity bias life test
• 47/1680/MCR Published as IEC 60749-5, Ed. 1

40
JEDEC IEC PAS ACTIVITY

• JESD22-C101
• 47/1462/PAS IEC 60749-28, Ed. 1
• Test method C101 Electrostatic Discharge (ESD)
  Sensitivity Testing Charged device model (CDM)
• JESD22-B101
• 47/1463/PAS IEC 62163, Ed. 1
• Test method B101 External Visual
• 47/1626/MCR Published as part of IEC 60749-3,
  Ed. 1
• JEP118
• 47/1464/PAS IEC 62164, Ed. 1
• Guidelines for GaAs MMIC and FET life testing
• JEP110
• 47/1465/PAS IEC 62165, Ed. 1
• Guidelines for the measurement of thermal
  resistance of GaAs FETs
• EIA/JESD46-A
• 47/1466/PAS IEC 62166, Ed. 1
• Guidelines for user notification of
  product/process changes by semiconductor suppliers

41
JEDEC IEC PAS ACTIVITY

• EIA/JESD48
• 47/1467/PAS IEC 62167, Ed. 1
• Product discontinuance
• JEP 113-B
• 47/1468/PAS IEC 62168, Ed. 1
• Symbols and labels for moisture-sensitive devices
• IPC/JEDEC J-STD-033
• 47/1469/PAS IEC 62169, Ed. 1
• Standard for handling, packing, shipping and use
  of moisture/reflow sensitive surface mount
  devices
• EIA/JESD59
• 47/1470/PAS IEC 62170, Ed. 1
• Bond wire modeling standard
• JEP114
• 47/1471/PAS IEC 62171, Ed. 1
• Guidelines for particle impact noise detection
  (PIND) testing, operator training and
  certification
• 47/1681/MCR Published as 60749-16, Ed. 1

42
JEDEC IEC PAS ACTIVITY

• JESD22-A102-B
• 47/1472/PAS IEC 62172, Ed. 1
• Accelerated moisture resistance Unbiased
  autoclave
• JESD22-A108-A
• 47/1474/PAS IEC 62189, Ed. 1
• Bias Life
• J-STD-020A (IPC/JEDEC)
• 47/1475/PAS IEC 62190, Ed. 1
• Moisture/reflow sensitivity classification for
  nonhermetic solid state surface mount devices
• 47/1592/MCR Publication Withdrawn Topic is now
  covered by IEC 60749, Amendment 2, Ed. 2
  (2001-10) and IEC 60749, Ed. 2.2 (2001-12).
• J-STD-035
• 47/1476/PAS IEC 62191, Ed. 1
• Acoustic microscopy for nonhermetic encapsulated
  electronic components
• 47/1593/MCR Publication Withdrawn Topic is now
  covered by IEC 60749, Amendment 2, Ed. 2
  (2001-10) and by IEC 60749, Ed. 2.2 (2001-12)

43
JEDEC IEC PAS ACTIVITY

• JEP119
• 47/1506/PAS IEC 62201, Ed. 1
• A procedure for executing sweat
• EIA/JEP122
• 47/1507/PAS IEC 62202, Ed. 1
• Failure mechanisms and models for silicon
  semiconductor devices
• EIA/JEP128
• 47/1508/PAS IEC 62203, Ed. 1
• Guide for standard probe pad sizes and layouts
  for wafer-level electrical testing
• EIA/JESD33-A
• 47/1509/PAS IEC 62204, Ed. 1
• Measuring and using the temperature coefficient
  of resistance to determine the temperature of a
  metallization line
• JESD-A103-A
• 47/1513/PAS IEC 60749-6 Ed. 1
• High temperature storage life
• 47/1628/MCR Published as part of IEC 60749-6,
  Ed. 1

44
JEDEC IEC PAS ACTIVITY

• EIA/JESD22-A105-B
• 47/1514/PAS IEC 62206, Ed. 1
• Test Method A105-B Power and temperature
  cycling
• JESD22-A109
• 47/1515/PAS IEC 62207, Ed. 1
• Test Method A109 Hermeticity
• 47/1594/MCR Publication Withdrawn Topic is
  now covered by IEC 60749, Amendment 2, Ed. 2
  (2001-10) and by IEC 60749, Ed. 2.2 (2001-12)
• JESD22-A120
• 47/1595/PAS IEC 62307
• Test Method for the Measurement of Moisture
  Diffusivity and Water Solubility in organic
  Materials Used in Integrated Circuits
• JESD22-A118
• 47/1635/PAS IEC PAS 62336
• Accelerated Moisture Resistance Unbiased HAST

45
IPC IEC PAS ACTIVITY

• IPC-EIA/J-STD-012
• IEC/PAS 62084
• Flip chip and chip scale technology
  implementation
• IPC-EIA/J-STD-013
• IEC/PAS 62085
• Implementation of ball grid array and other high
  density technology
• IPC-2511
• IEC/PAS 62119
• Generic requirements for implementation of
  product manufacturing description data and
  transfer methodology
• IPC-6202
• IEC/PAS 62123 Ed. 1.0
• Performance guide Manual for single- and
  double-sided flexible printed wiring boards
• IPC-4130
• IEC/PAS 62212
• Specification and characterization methods for
  nonwoven "E" glass mat

46
IPC IEC PAS ACTIVITY

• IPC-4411
• IEC/PAS 62213
• Specification and characterization methods for
  nonwoven para-aramid reinforcement
• IPC-6011
• IEC/PAS 62214
• Generic performance specification for printed
  boards
• IPC-1710
• IEC/PAS 62158 Ed. 1.0
• Manufacturers qualification profile (MQP)
• IPC-1720
• IEC/PAS 62159 Ed. 1.0
• Assembly qualification profile (AQP)

47
IPC IEC PAS ACTIVITY

• IPC-1730
• IEC/PAS 62160 Ed. 1.0
• Laminator qualification profile
• IPC-6013 (with amendment)
• IEC/PAS 62249 /ED, 1,9
• Qualification and performance specification for
  flexible printed boards
• IPC-6012 (with amendment)
• IEC/PAS 62250
• Qualification and performance specification for
  rigid printed boards