System in Package (SiP) Technology Market Share, Trends & Forecast - 2022

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System-in-Package Technology Market
Opportunities and Forecasts, 2014- 2022
Pages 226 Published 2016
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SYSTEM IN PACKAGE TECHNOLOGY MARKET
System in packaging (SiP) technology is a
mixture of various integrated circuits in a
compact size to enable reduction of power
consumption. Moreover, they offer numerous
benefits, such as high efficiency, low system
complexity, and reduced system maintenance. 2.5-D
IC Packaging represents almost 40 of the total
SiP market, owing to its resilience and high
efficiency. In addition, substantial demand for
electronics applications and trend of customer
shift towards advanced IC packaging to achieve
better efficiency are expected to fuel its
adoption in the consumer electronics,
telecommunication, and other industry
sectors. Jeshin Jayamon
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SYSTEM IN PACKAGE TECHNOLOGY MARKET OVERVIEW

• System in Package (SiP) Technology Market report,
  published by Allied Market Research, forecasts
  that the global market is expected to garner 30
  billion by 2022, registering a CAGR of 9 during
  the period 2016 - 2022.
• Asia-Pacific dominates the global market in
  terms of revenue, accounting for more than 50
  share of the global market, followed by North
  America.
• SiP Technology is widely used across the
  applications such as consumer electronics,
  telecommunication, and automotive.
• Presently, rise in demand for portable electronic
  devices and adoption of SiP in graphic cards and
  processors are some factors that majorly drive
  the market. 
• Read more at https//www.alliedmarketresearch.co
  m/system-in-package-technology-market

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SYSTEM IN PACKAGE TECHNOLOGY MARKET KEY BENEFITS

• The study provides an in-depth analysis of the
  global SiP technology market to elucidate the
  prominent investment pockets.
• Current trends and future estimations are
  outlined to determine the overall attractiveness,
  and single out profitable trends to gain a
  stronger foothold in the market.
• The report provides information regarding key
  drivers, restraints, and opportunities along with
  their impact analyses.
• The market is analyzed based on various regions,
  namely, North America, Europe, Asia-Pacific, and
  LAMEA.
• Value chain analysis of the market enables better
  understanding of the roles of intermediaries in
  the production processes.

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GLOBAL SIP MARKET TOP IMPACTING FACTORS
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SYSTEM IN PACKAGE TECHNOLOGY MARKET KEY FINDINGS

• In 2014, 2.5-D IC Packaging segment dominated the
  global SiP market in terms of revenue, and is
  projected to grow at a CAGR of 9.3 during the
  forecast period.
• Flat Packages segment dominates the global SiP
  market, accounting for about 32 share in 2014.
• Flip Chip segment is expected to exhibit the
  fastest growth during the forecast period, owing
  to increase in applications such as computers and
  smart phones.
• China is the major shareholder in the
  Asia-Pacific SiP market, accounting for about 42
  share.

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SYSTEM IN PACKAGE (SIP) TECHNOLOGY APPLICATIONS
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KEY PLAYERS IN INDUSTRY

• Amkor Technology Inc.
• Fujitsu Ltd.
• Toshiba Corporation
• Qualcomm Incorporated
• Renesas Electronics Corporation
• Samsung Electronics Co Ltd
• Jiangsu Changjiang Electronics Technology Co.,
  Ltd.
• ChipMOS Technologies Inc.
• Powertech Technologies Inc.
• ASE Group
• Download Sample Report
• https//www.alliedmarketresearch.com/request-free-
  sample/1827

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GLOBAL SIP MARKET SEGMENTATION
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SYSTEM IN PACKAGE TECHNOLOGY MARKET BY GEOGRAPHY

• North America, Europe, Asia-Pacific, LAMEA

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