NIC Components Corp.

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WEEE RoHS Impact on Passive Components
NIC Components Corp.
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• WEEE - Waste Electrical and Electronic Equipment
• RoHS - Restriction on Hazardous Substances

Environmental legislation impacting the
electronics industry
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• WEEE - Waste Electrical and Electronic Equipment
• The WEEE Directive is primarily tasked with
  reducing the amount of electrical and electronic
  equipment (often expressed as EEE) from entering
  landfill at the end of its useful life by
  encouraging reuse, recycling and separate
  collection. It is apparent from this statement
  that the WEEE directive will not eradicate all
  EEE from landfill. The role of RoHS is to reduce
  harmful substances materials at source,
  ensuring that these hazardous substances are not
  leached into the environment by equipment which
  inevitably fails to be recycled. The WEEE
  Directive is a separate piece of environmental
  legislation, though it is directly linked to
  RoHS.
• RoHS WEEE directives were instituted by the
  European Union in 1992 The EU consists of
  Austria, Belgium, Cyprus, Czech Republic,
  Denmark, Estonia, Finland, France, Germany,
  Greece, Hungary, Ireland, Italy, Latvia,
  Lithuania, Luxembourg, Malta, Netherlands,
  Poland, Portugal, Slovakia, Slovenia, Spain,
  Sweden, United Kingdom. The directive extends to
  the European Economic Area (EEA) which also
  includes Iceland, Liechtenstein and Norway.
• Similar Legislation
• ? Japan - Consumer Appliance Law
• ? China's Regulation for Pollution Control of
  Electronics Products (RPCEP)
• ? USA State of California

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Awareness of WEEE RoHS legislation, and
requirements, has increased over past six months
at companies of all sizes.
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• RoHS - Restriction on Hazardous Substances
• Who is impacted?
• Ultimately, anyone who builds, markets or
  imports electrical or electronic equipment (or
  components) into the European Union must ensure
  that the product complies with the RoHS
  directive, regardless of where it was originally
  produced.
• Who is exempt from RoHS?
• Military, Aerospace and network infrastructure
  equipment for switching, signaling, transmission
  as well as network management for
  telecommunication Pb (lead) used in Servers,
  Storage and Storage array systems exemption
  granted until 2010. ... It should be recognized
  that existing exemptions may be short lived, and
  should not be relied upon as part of your overall
  conversion strategy
• Influencers to reconsider taking exemption
• ? Reduction in available markets
• ? Competitive position
• ? Legacy (Sn-Pb) component availability
  potential unit price premium

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• RoHS - Restriction on Hazardous Substances
• When does WEEE and RoHS take effect?
• WEEE August 13, 2005
• RoHS 1 July 2006
• What is its impact on companies designing and
  building electronic PCB assemblies? ...
• ? Materials
• - Assurance of RoHS compliance
• - Material identification and control
• - Supplier confirmation of RoHS compliance

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Confidence in meeting RoHS compliance by the July
1, 2006 deadline has slipped, ...with 55 73
of companies expecting to be fully compliant by
July 1, 2006
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RoHS challenge at many companies is engineering
resources
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• RoHS - Restriction on Hazardous Substances
• RoHS EU Member States shall ensure that, from 1
  July 2006, new electrical and electronic
  equipment put on the market meets the maximum
  concentration values on the below six materials
• Lead (Pb)
• Mercury (Hg)
• Cadmium (Cd)
• Hexavalent Chromium (CrVl)
• Polybrominated biphenyls (PBB) Flame retardant
  used in plastics
• Polybrominated diphenyl ethers (PBDE) Flame
  retardant used in plastics

• Will Additional Substances be added to RoHS?
• when additional scientific evidence is
  presented, the banned substances may increase
  to encompass other hazardous materials

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• What is the difference between lead-free and
  RoHS compliant?
• While lead (Pb) is the most widely used RoHS
  specific hazardous substance in electrical and
  electronic equipment (EEE), the term "lead-free"
  is often wrongly adopted to refer to all of the
  substances specified in the Restriction of
  Hazardous Substances (RoHS) Directive. However,
  RoHS restricts a total of six substances - lead,
  mercury, cadmium, hexavalent chromium, PBB and
  PBDE. To be truly RoHS compliant with the WEEE
  RoHS legislation, the presence of each of
  these substances must be reduced below their
  proposed maximum concentration values (MCV)..

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• RoHS - Restriction on Hazardous Substances
• RoHS EU Member States shall ensure that, from 1
  July 2006, new electrical and electronic
  equipment put on the market meets the below MCVs
  of the six restricted substances listed below

Maximum concentration values (MCV) define the
maximum amount of an individual restricted
substance (per the EU RoHS directive) within each
homogeneous material that compose the component.
RoHS RESTRICTED SUBSTANCES RoHS RESTRICTED SUBSTANCES
Substance RoHS LIMIT MCV - Maximum concentration values
1. Lead (Pb) lt 0.10 lt 1000 PPMException Allowable Lead (Pb) within glass of electronic components (i.e. glass coat or frit)
2. Mercury (Hg) lt 0.10 lt 1,000 PPM
3. Hexavalent Chromium (Cr VI) lt 0.10 lt 1,000 PPM
4. Cadmium (Cd) lt 0.01 lt 100 PPM
5. 6. (PBB and PBDE)Poly-brominated flame retardants lt 0.10 lt 1,000 PPM
- Homogeneous materials are defined as
materials that cannot be mechanically disjointed
into different materials and are of uniform
composition throughout. Types include plastics,
ceramics, glass, metals, alloys, paper, resins,
and coatings.
HOMOGENEOUS MATERIAL SUBSTANCE NAME CHEMICAL SYMBOL
Substrate Aluminum oxide Al2O3
Termination - Conductor Silver Ag
Nickel Plating Nickel Ni
Tin Plating Tin Sn
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• What Methods Are Commonly Utilized To Assuring
  Supplier Compliance?
• Surveys - Questionnaires
• Supplier Documentation
• RoHS Compliance Statements
• Material Declaration Statements (MDS)
• Green Statements
• ICP Inductively Coupled Plasma Testing
  typically performed by third party test lab, to
  demonstrate specific component family meets RoHS
  material limits

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• RoHS - Restriction on Hazardous Substances

RoHS is very explicit about which substances
should be restricted and the precise levels that
may be tolerated. Some exceptions are
allowed Appendix Exception 5. Lead in glass of
cathode ray tubes, electronic components and
fluorescent tubes. For clarity, this exemption
applies to lead in the glass parts of cathode ray
tubes, lead in the glass parts of electronic
components and lead in the glass parts of
fluorescent tubes. Electronic components in the
context of this exemption could also include
glass parts when they are part of an electronic
component or electrical and electronic
equipment. Example Trace levels of Pb found in
Glass Overcoats, Glass Frit, Inks, etc.
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• RoHS - Restriction on Hazardous Substances

• How are RoHS compliant electronic components
  ordered? - is there a standard code used to
  differentiate them from traditional lead (Pb)
  containing devices?
• Unfortunately, there is NO component
  identification standard. Some manufacturers have
  generated new ordering codes to designate RoHS
  compliant product, others employ temporary
  designators to be utilized during FAB transition,
  while several IC manufacturers have openly stated
  there will be no planned component ordering
  modifications.
• National Electronic Distributors Association
  (NEDA) and National Electronics Manufacturing
  Initiatives (NEMI) recommend new part numbers be
  implemented for RoHS compliant components, to
  enable control throughout the supply chain and
  provide clear identification of RoHS compliant
  material.

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• RoHS - Restriction on Hazardous Substances

Part Number Change to allow easy identification
of RoHS compliant versions is the widely
preferred designation
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• RoHS - Restriction on Hazardous Substances

SUBJECT Component Part Number Change NIC PRODUCT
SERIES All NIC Product Series Notice of
standard - default part number change from Legacy
(non-RoHS) to RoHS compliant part number. PART
NUMBERS EFFECTED All NIC products REASON FOR
CHANGE To provide clear - easy to follow -
system for identification of RoHS (Pb-Free)
compliant versions of NIC products. Also to
comply with industry recommendations for new
unique part numbers for RoHS (Pb-Free) compliant
products Ref NEDA JEDEC guidelines
Examples Examples
Legacy Part Number RoHS Compliant Part Number
NACxxxxxxxxxxTR NACxxxxxxxxxxTRF
NMCxxxxxxxxxxxxTRP NMCxxxxxxxxxxxxTRPF
NMC0603NPO101J25TRP NMC0603NPO101J25TRPF
NRSA101M16V6.3X11 NRSA101M16V6.3X11F
NRC06F1001TR NRC06F1001TRF
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• RoHS - Restriction on Hazardous Substances

Reel Carton Bag Packaging Identification In
addition to unique RoHS part numbers, all RoHS
compliant material will have a packaging
identification of RoHS compliance or
Pb-Free. Possible Packaging Identification
Symbols
JEDEC
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• RoHS - Restriction on Hazardous Substances
• RoHS compliance impacts all components suppliers
  that provide Tin-Lead (Sn-Pb) finish components.
  Most component suppliers will need to transition
  away from Tin-Lead (Sn-Pb) finish components to
  LeadFree (Pb-free) alternate.

• 100 Tin (Sn) - or
• Tin (Sn) / Bismuth (Bi) - or
• 96 Sn / 3 Ag / 1 Cu or
• 99 Sn / 1 Cu or -
• 100 Gold (Au)

Component Terminal Transition 95 Tin (Sn) / 5
Lead (Pb)
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• RoHS - Restriction on Hazardous Substances
• What is its impact on companies designing and
  building electronic PCB assemblies? ...
• ? Materials
• - Assurance of RoHS compliance
• - Material identification and control
• - Supplier confirmation of RoHS compliance
• ? Process
• - Development of Pb-Free solder processes
• - Reflow soldering process
• - Flow-wave soldering process
• - Rework

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• Soldering Process Changes as Result of RoHS
• Historically Tin-Lead (Sn-Pb) soldering has been
  the most widely used soldering process globally.
  Reflow and Wave-Flow soldering processes using
  Sn-Pb soldering material are very mature, well
  understood and virtually trouble-free. Legacy
  passive components have properties (materials and
  thermal characteristics) compatible with Sn-Pb
  soldering.

Reflow
Flow - Wave
Soldering heat
Top
Top
PCB
PCB
Bottom
Bottom
Soldering heat
WAVE
Legacy Sn-Pb Soldering Process

• Component Terminals
• 100 Tin (Sn) -or
• 95 Tin (Sn) / 5 Lead (Pb)

• Component Terminals
• 95 Tin / 5 Lead (Pb)

• Solder
• 63 Tin (Sn) / 37 Lead (Pb) Sn63

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• Soldering Process Changes as Result of RoHS
• Legacy Tin-Lead (Sn-Pb) soldering
• Widely based upon Sn63 solder alloy
• Liquidus temperature of 183C
• Reflow soldering with component exposure peaks
  from 210C 230C
• Pb Free Soldering
• Many Pb-Free solder alloys are available LINK
• SAC (Sn-Ag-Cu) Tin Silver - Copper Solder
  Alloy
• Liquidus temperature of 217C 30C higher
  than Sn63
• Reflow soldering with component exposure peaks
  at 240C 260C
• Higher SMT Component Soldering Temperatures
• Effects on SMT Components
• Soldering Heat Resistance Test Data
• Multiple Reflow Exposures

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• Soldering Process Changes as Result of RoHS
• Pb Free Soldering

SAC
Sn63
Using SAC will result in 30C higher reflow
solder temperature
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• Soldering Process Changes as Result of RoHS
• Pb Free Soldering

• Are NIC passive components compatible with SAC
  soldering process?
• Most of the RoHS versions of NIC SMT passive
  components are compatible with the higher reflow
  flow rework soldering temperatures of SAC
  Pb-Free soldering
• No known issues
• SMT Ceramic Chip Capacitors and arrays
• SMT Tantalum Electrolytic Capacitors
• SMT Power Inductors
• SMT Chip Inductors and Ferrite chip beads
• SMT Chip Resistors (Thick Film and Thin Film) and
  Arrays (Thick Film)
• Leaded Components
• Possible thermal exposure issues
• SMT V-Chip Aluminum Electrolytic Capacitors
  liquid electrolyte
• SMT Film Chip Capacitors polymer dielectric

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• Soldering Process Changes as Result of RoHS
• Pb Free Soldering

• Can Liquid Electrolyte Aluminum Electrolytic
  Capacitors withstand SAC soldering process?
• While Japan manufacturers of V-Chip E-Caps have
  indicated No, outside testing has suggested
  part are robust enough to withstand 260C.

• NIC Tools
• Web based guide
• White Paper
• Support Personnel
• Live Help
• E-mail
• Tel

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• Soldering Process Changes as Result of RoHS
• Pb Free Soldering Heat Effects on SMT V-Chip
  Aluminum Electrolytic Capacitors

by CALCE / DFR Solutions PAPER TO BE PRESENTED
PUBLISHED IPC/JEDEC Conference - San Jose
California, USA April 17-19 CARTS Europe in
October 2005 Oct 2005 of Passive Components Mag
Key Findings Case distortion during Pb-free
reflow Capacitors with extended temperature or
extended lifetime capacitors in general were more
resistant to case distortion during Pb-free
reflow. Long-term reliability Exposure to a
range of Pb-free reflow conditions and the
occurrence of case deformation seemed to have
minimal influence of the reliability of the
V-chip capacitors.
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• Soldering Process Changes as Result of RoHS

Typical dull appearance of Pb-Free solders Some
improvement (Right Image) with nitrogen added to
reflow environment
Potential issues of Pb-Free process The common
defects associated with lead-free include ?
Off-pad solder balling mid-chip solder
balling ? Tombstoning bridging (shorts) on
fine-pitch QFP leads ? Open joints, non-wetting,
de-wetting, cold solder joints, voids and
excessive dullness or surface cracks. When
soldered, Pb-Free (SAC) alloys will wet the
metallization at substantially reduced rates when
compared to 63/37. Solderability is impacted by
the speed of wetting and the degree of spread.
Pure tin finishes are the most suitable to solder
with SAC alloys. Source SMT Magazine Pb-Free
Soldering Guide
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Tin Whiskers Issue on Pure Tin Finishes The
occurrence of microscopic (micron length)
extrusions - growths of pure tin (100 Sn) (also
known as whiskers) from the terminal finishes
(which could potential cause short-circuiting).

• National Electronics Manufacturing Initiatives
  (NEMI)
• Tin Whisker Acceptance Test Requirements 2.6
  (7/28/2004)
• Exceptions discrete capacitor and resistor
  devices
• Matte Sn at least 2um (80 micro-inches)
• Nickel barrier at least 2um (80 micro-inches)
• Plating process parameters controls plating
  bath parameters current density, voltage,
  acidity, plating bath chemistry and material
  contamination,plating thickness, plating stress,
  plating grain size, plating crystallographic
  texture, plating carbon content below 0.05 and
  copper content below 0.5

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• RoHS Support Documentation
• Unique F part number suffix for RoHS Pb-Free
  compliant devices
• Packaging (Bag, Reel, Carton) Identification
• MDS Documentation (spreadsheets)
• Component breakdown by materials (mg )
• Green Statements
• Identifying compliance to RoHS requirements
• Tin Whisker Test Reports
• ICP Tests

• Dedicated RoHS Support
• Tech support rohs_at_niccomp.com
• Website documentation www.niccomp.com/rohs
• Live-Help USA / Europe / SE Asia

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END

• NIC Components Corp.
• Dedicated RoHS Support
• Tech support rohs_at_niccomp.com
• Website documentation www.niccomp.com/rohs
• Live-Help USA / Europe / SE Asia