Title: Selection and Evaluation of Materials for tehrmoelectric Applications
1MEMS the state of the art and future
challengesPaul RonneyDept. of Aerospace
Mechanical EngineeringUniv. of Southern
California, Los Angeles, USAYiguang Ju
Department of Engineering MechanicsTsinghua
University, Beijing, China
2Outline
- Part 1 Introduction to MEMS
- What is MEMS?
- Fabrication techniques
- Applications
- The market for MEMS
- Opportunities for the future
- What can the government do to help?
- Part 2 Power MEMS as an example of MEMS
development
3What is MEMS?
- Micro-Electro-Mechanical Systems (MEMS) is a
technology that - Leverages Integrated Circuit fabrication
technology by adding additional functions, for
example - Mechanical
- Chemical
- Biological
- Optical
- Mass-produces ultra-miniaturized components at
low cost - Enables radical new micro-system applications,
for example - Pressure / acceleration sensors
- Power production
- Medical devices
- Optical switches
4Advantages of MEMS
5Microscale fabrication techniques
- Bulk Micromachining
- Deep reactive ion etching
- Surface Micromachining
- LIGA
- Others
- EFAB
- Micro EDM
- 3-D Lithography
- Laser Micromachining
6Anisotropic Wet Etching of Silicon
7Deep Reactive Ion Etching
8Surface Micromachining
9LIGA process
10EFAB (Electrochemical FABrication) (NEW)
- Analogous to macroscale rapid prototyping,
solid freeform fabrication - enables
fabrication of arbitrarily complex 3D structures - Selective electroplating of structural and
sacrificial metals - Developed at University of Southern California
- Electrochemistry can also be used to deposit
other types of materials, e. g. - Thermoelectric
- Magnetic
- Electrically insulating
- Catalytic
- Can use existing mechanical design software
modeling tools - No clean room required for device fabrication -
much less expensive than silicon-based techniques - Commercialization by MEMGen Inc., Torrance, CA,
USA
11EFAB key technology Instant Masking
- Pre-fabricated masks serve as reusable printing
plates - Polymer mask patterned on anode using
conventional photolithography - Lithography for all layers done in parallel,
prior to, separate from device fabrication,
allowing - Low-cost, self-contained automated machine
- Mask outsourcing - possible collaboration with
Chongqing
12EFAB process flow
Selectively deposited material (usually
sacrificial)
Blanket deposited 2nd material (usually
structural)
(
b
)
(
c
)
(
a
)
(
d
)
(
e
)
(
f
)
13EFAB results
- 12-layer chain, 290 ?m wide (worlds
narrowest?) - Minimum feature size 20 µm
- First-generation microcombustor built
14Applications for MEMS
- Pressure transducers
- Accelerometers
- Gyroscopes
- New areas
- Optical switches
- Gas turbines
- Nano-satellite systems
- Drug delivery
- Power MEMS
15Switches for fiber-optic networks
- Many possible approaches, MEMS and non-MEMS
- 3D much higher density of switches than 2D, MEMS
fabrication required
16Space applications
17Advanced aircraft applications
- Smart skin - senses reduces air drag
- Micro-mixing enhancement in engines
- Sensing in Gas turbine engine Environment
- Flow
- Vibration
- Temperature
- Strain
- Pressure Sensors for Stall/Surge Control
- Fuel Valve Position Sensors
- Chemical Sensors for Emissions Monitoring
18Microfluidic system for bio-chemical sensing
19Drug delivery systems
- Micromachined needles connected to individual
microvalves and supply reservoirs - Each reservoir may contain different
type/concentration of drug - May be combined with on-chip biosensor
20Drug delivery systems (2)
- (a) Drug delivery chamber
- (b) Two electrodes (AgCl/Ag electrode and IsOx
electrode) for monitoring pH - (c) Metal valves
21MEMS Market (U. S. estimate)
22Conclusions (MEMS)
- Many potential MEMS applications - has been
demonstrated in USA - China can become a significant force in MEMS
development because of its existing
infrastructure and its large yet highly educated
workforce - What can the government do to help?
- Difference between Japan and USA USA time from
research to market is much shorter - why? - Support and stimulate joint collaborative
research between universities and companies - Attract different sources of funding to sustain
research - government, workshop registration
fees, company staff training - Government provides funds to university for
facilities that companies can rent to test new
ideas before buying their own facilities - DARPA funds applied research on MEMS but allow
universities and companies to retain intellectual
property rights for non-government applications
23Conclusions (MEMS)
- Expect 95 of 100 projects to fail (success of
other 5 will more than pay for 95 failures) - Balance between traditional MEMS areas and
radical new areas - Traditional Chinese successes in international
markets based on production cost advantages,
especially lower labor costs - High technology successes in high value-added
markets depend on making use of skilled,
educated, motivated Chinese workforce - How to judge the future of MEMS technologies?
- High value added - unit cost of complete system
is high - Enabling technology - cant work without MEMS
devices - Collaboration between industry and universities
essential - Inter-disciplinary activity essential
24Microscale power generation (Power MEMS)
- USC effort supported by U. S. Defense Advanced
Research Projects Administration (DARPA)
25The challenge of microcombustion
- Hydrocarbon fuels have numerous advantages over
batteries - 100 X higher energy density
- Much higher power / weight power / volume of
engine - Inexpensive
- Nearly infinite shelf life
- More constant voltage, no memory effect, instant
recharge - Environmentally superior to disposable batteries
- but converting fuel energy to electricity with
a small device has not yet proved practical
despite numerous applications - Foot soldiers
- Portable electronics - laptop computers, cell
phones, - Micro air and space vehicles
26The challenge of microcombustion
- Most approaches use scaled-down macroscopic
combustion engines, but may have problems with - Heat losses - flame quenching, unburned fuel CO
emissions - Heat gains before/during compression
- Limited fuel choices need knock-resistant
fuels, etc. - Friction losses
- Sealing, tolerances, manufacturing, assembly
27Cox Tee Dee .010 Weight 0.49 oz.Bore
0.237 6.02 mmStroke 0.226 5.74
mmDisplacement 0.00997 cu in (0.163 cm3)RPM
30,000Power 3 watts
Smallest existing combustion engine
28Some power MEMS concepts
Wankel rotary engine
Free-piston engine
29Some power MEMS concepts
- Issues
- Friction, heat losses
- Very tight manufacturing tolerances
- High production cost
- Very high rotational speed needed to achieve
compression (speed of sound doesnt scale!) - Fuel may always need to run on hydrogen
Micro gas turbine engine (MIT)
30Some power MEMS concepts
- Non-IC engine concepts possible enabling
technologies, but dont address complete system
31Our approach - microFIRE
- Integrated microscale power generation system
- Combustion
- Heat transfer
- Electrical power generation
- Fabrication assembly
- Swiss-roll heat recirculating burner with
toroidal 3-D geometry - Direct thermoelectric conversion of heat to
electricity - Monolithic fabrication of the entire device with
EFAB - Being developed by MEMGen, Inc.
- gt 10 million venture capital funding in first
year of existence
32microFIRE approach (1) Combustion
- Swiss roll heat recirculating burner -
- minimizes heat losses
- Toroidal 3-D geometry - further
- reduces losses - minimizes
- external temperature on all surfaces
One-dimensional counterflow combustor / heat
exchanger
Two-dimensional Swiss-roll burner
33microFIRE approach (2) - Power generation
- Thermoelectric (TE) power generation elements
embedded in wall between hot (outgoing product)
and cold (incoming reactant) streams
34microFIRE approach (3) - Fabrication
- EFAB (Electrochemical Fabrication)
- Enables fabrication of arbitrarily complex 3D
structures - NASA Jet Propulsion Laboratory proprietary
process for electrochemical deposition of Bi2Te3
thermoelectric elements - Process-compatible with
EFAB, enabling monolithic fabrication of entire
device! - Targets
- Weight 500 mg
- Volume 0.04 cc
- Power 100 mW
- Efficiency gt 10
35microFIRE advantages
- Integrated combustor / heat exchanger / power
generation - Heat losses / flame quenching problems minimized
- External T (IR signature, touch-temperature
hazards) minimized - Direct conversion, no moving parts!
- No friction losses
- No tight manufacturing tolerances
- Rugged, reliable, low maintenance
- Quiet, stealthy, no vibration
- Long life (no wear or fatigue-induced breakage)
- Compact
- Can use wide variety of conventional hydrocarbon
fuels without pre-processing
36Fabrication of macroscale test devices
- Development approach build macroscale models,
test, develop numerical simulation capability,
design microscale device - Soligen rapid prototyping process for 2-D and
3-D designs in Al2O3 - SiO2 ceramic
37Mesoscale experiments
- Wire-EDM fabrication
- Pt igniter wire / catalyst
38Combustion modes
- Combustion usually in flameless mode - no
visible flame!
39Quenching limits
- Area-averaged V can be 30x stoichiometric burning
velocity, even with mixture 33 leaner than
conventional lean limit no insulation - Lower limit can be reduced dramatically with
catalytic Pt strips - but it can also be increased dramatically
40Numerical modeling
- FLUENT software package, 2D 3D simulations
41Numerical modeling
- High fuel
- Low fuel
- Reaction rates Temperatures
42Conclusions (microFIRE)
- Combustion in microscale devices feasible even at
low temperatures compatible with thermoelectric
elements, but will probably require heat
recirculation catalytic assistance - Combustion behavior under such conditions quite
different from conventional flames - Expect similar findings in most other microscale
systems - performance cannot be predicted based
only on macroscale results
43Challenges for Power MEMS
- microFIRE-specific
- Developing calibrating gas-phase surface
chemistry sub-models - Modelling electrochemical processes - rely less
on empirical testing - Catalyst preparation, degradation restoration
- Challenges for all micro-chemical/thermal/fluid
systems - Auxiliary components - valves, pumps, fuel tanks
- System integration and packaging
44Thanks to
- Chongqing Science Technology Commission
- Chongqing University
- and especially U. S. Defense Advanced Research
Projects Administration (DARPA) Microsystems
Technology Office !!!