Firmware-only Implementation of Time-to-digital Converter (TDC) in Field-programmable Gate Array (FPGA) - PowerPoint PPT Presentation

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Firmware-only Implementation of Time-to-digital Converter (TDC) in Field-programmable Gate Array (FPGA)

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Register Array ... Even using existing chain, TDC bins may still have different widths. ... ASIC: good for large total system channel count. ... – PowerPoint PPT presentation

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Title: Firmware-only Implementation of Time-to-digital Converter (TDC) in Field-programmable Gate Array (FPGA)


1
Firmware-only Implementation of Time-to-digital
Converter (TDC) in Field-programmable Gate Array
(FPGA)
  • Jinyuan Wu, Z. Shi and I. Wang
  • For CKM Collaboration
  • IEEE NSS 2003, Portland, OR
  • Oct. 2003

2
TDC Using FPGA Logic Chain Delay
  • This scheme uses current FPGA technology ?
  • Low cost chip family can be used. (e.g.
    EP1K10QC208-2 15.25) ?
  • Fine TDC precision can be implemented in slow
    devices (e.g., 0.4 ns in a 200 MHz chip). ?

IN
Weve done this 10 years ago. There are many
problems
CLK
3
Problem 1 Logic Cell Delay Time Difference
  • The FPGA compiler can put logic cells anywhere.
    -- The logic path is not easy to predict. ?.
  • Delay times in different logic paths are
    different. ?.
  • Is hand placement a solution?
  • Hand placement is very time consuming. ?.

4
Tired of Hand Placement? ?Use Existing Chains! ?
Chain structures exist in FPGAs.
Delay Chain Altera cascade chain
When the 1st LE is placed, there is only one
possible configuration for the remaining LEs
Register Array
5
After Compiling Automatically
Delay Chain and Register Arrays For 2 TDCs (48
steps each)
6
The Board and the Chip
  • Chip Altera ACEX, EP1K10QC208-1 (22.50).
  • Clock 35 MHz external, 70 MHz inside the chip.
  • Typical precision 0.4 ns/LSB. (This is too good.
    Only 1 ns/LSB is needed. The chip is too fast).

7
TDC Count v.s. Input Time
  • TDC chains are implemented in 12 possible
    positions in the chip.
  • Differences among them are small.

8
Short-term Stability
  • More than 1000 measurements per point are made.
  • Both mean and standard deviation are recorded.
  • Measured standard deviation can be explained with
    binning model.
  • Intrinsic short-term instability, if there is
    any, ltlt 0.5 LSB.

9
Problem 2 Delay Time Change With Temperature
  • Delay time changes with temperature and power
    supply voltage.
  • In DESER or ASIC, the delay time of the delay
    chain is compensated by adjusting relevant
    voltages. Analog compensation.
  • In FPGA, digital compensation is needed.
  • Digital compensation uses delay speed measured in
    the same delay chain to correct the arrival time
    of a hit.

10
Delay Chain Digital Compensation
  • Use longer delay line.
  • Some signals may be registered twice at two
    consecutive clock edges.

IN
N2-N1(1/f)/Dt
  • The two measurements can be used
  • to calibrate the delay.
  • to reduce digitization errors.

CLK
11
Digital Compensation
2nd TDC
  • Power supply voltage changes from 2.5 V to 1.8 V,
    (about the same as 100 oC to 0 oC).
  • Delay speed changes by 30.
  • The difference of the two TDC numbers reflects
    delay speed.

Corrected Time
  • The corrected time variation is less than 1 LSB.

1st TDC
12
Problem 3 Bin Width Variation
  • The logic cell structure is not perfectly
    uniform.
  • Using existing chain helps to improve uniformity.
  • Even using existing chain, TDC bins may still
    have different widths.

13
Measured TDC Bin Width Variation
  • More than 50,000 samples with random arrival time
    for each of 12 chain locations are measured.
  • Relative bin width is calculated from number of
    events for each TDC bin.
  • Bin-by-bin calibration is possible.
  • Its also tolerable without bin-by-bin
    calibration.

14
Performance
Measurement Errors (ns) Measurement Errors (ns)
(max) (rms)
Test TDC 0.4-ns-LSB With digital temperature compensation only 0.6 0.2
Perfect 1.2-ns-LSB TDC 0.6
Perfect 0.7-ns-LSB TDC 0.2
Test TDC 0.4-ns-LSB With bin-by-bin calibration 0.3 0.13
Perfect 0.6-ns-LSB TDC 0.3
Perfect 0.45-ns-LSB TDC 0.13
15
Summary
Problem 1 hand placement. Use existing chain to avoid hand placement.
Problem 2 temperature variation. Make digital compensation.
Problem 3 bin width variation. Use bin-by-bin calibration. It is also tolerable without.
16
The End
  • Thanks

17
TDC Solutions
  • ASIC good for large total system channel count.
  • FPGA with DESER good for large channel count per
    package. (CYP15G04K100V1MGC 285.)
  • Other situations? Consider low cost FPGA.

Tot sys ch.
Ch/pkg
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