Title: IEC%20TC93%20Liaison%20Report%20DASC%20SC%20Alex%20Zamfirescu%20IEC%20USNC%20Technical%20Aadviser%20TC93%20Convener%20IEC%20TC93%20WG2%20September,%2019%202005
1IEC TC93 Liaison Report DASC SCAlex Zamfirescu
IEC USNC Technical Aadviser TC93Convener IEC
TC93 WG2September, 19 2005
2News from IEC TC93
- TC93 meetings took place during the week of
September 4 to 9, 2005 - Hosted by Japan NC in Nara
- TC93 WG1 and WG2 discussions included
- Interoperability of international standards
- Maintenance of IEC standards
- Future candidates for IS
- Analog VHDL (IEEE 1076.1)
- SystemC (IEEE P1666)
- SystemVerilog (IEEE P1800)
- IEEE 1647 IEEE 1850 IEEE 1500 - 2005
(Sponsor CSS) Extend 1603 for Radiation
Hardening (RHR) - Register Description Language Numerics Ontology
as PAS
3Good progress on IEEE DASC Dual Logo Submissions
- All DL Submissions were voted and approved by the
P member countries - IEEE Std 1497-2001 IEEE Standard for Standard
Delay Format (SDF) for the Electronic Design
Process IEC 61523-3 - IEEE Std 1076-2002 IEEE Standard VHDL Language
Reference Manual .. ..IEC 61691-5 - IEEE Std 1364-2001 IEEE Standard Verilog
Hardware Description Language ..
..IEC 61691-4 - IEEE Std 1076.4-2000 IEEE Standard for VITAL
ASIC Modeling Specification.. ...IEC
61691-6 - IEEE Std 1603-2003 IEEE Standard for Advanced
Library Format (ALF) Describing Integrated
Circuit (IC) Technology, Cells, and Blocks
................................................
.............. IEC 62265 - Ed. 1.0 - IEEE 1076.6 ......IEC 62050
- IEEE 1364.1 ..IEC 62142
4IEC TC93 Std Maintenance Extract
IEC Publication Number Kind Feeder Mnemonics IEC Maint.
IEC 61691-1-1 (2004-10) DL IEEE 1076 VHDL 2007
IEC 61691-2 (2001-06) IEEE 1149 MVL9 2004
IEC 61691-3-2 (2001-06) IEEE 1076.2 VHDLMATH 2004
IEC 61691-3-3 (2001-06) IEEE 1076.3 VHDLNUM 2000
IEC 61691-4 (2004-10) DL IEEE 1364 VERILOG 2006
5Discussion about VHDL IEEE/IEC DL Maintenance
- The first four standards (on previous slide) are
in the process of being merged into one LRM with
additional VHPI documentation - The group (WG2) agreed that the only alternative
left for IEC participation is to wait until IEEE
draft comes for ballot, form Accellera now
jointly working on the documentation with the
IEEE VASG. - Note that IEC was not invited to form a joint
working group as required by the DL procedures
agreed upon in the IEEE-IEC MOU on DL maintenance
(summary of the MOU was circulated twice in DASC
SC minutes, and attached again to this report
next 4 slides). - No draft was circulated so far to IEC (possibly
in contradiction to DASC SC assigned actions).
6An IEC-TC/SC needs to revise an IEC-IEEE standard
IEEE needs to revise an IEC-IEEE standard
MCR
PAR
INFO
IEC and IEEE agree on a common
need
IEC disagrees see note 1
IEEE disagrees see note 2
YES
Dual logo maintenance team (DLMT) set up with
members from IEC and IEEE and a convenor jointly
accepted ( see note 3 )
Maintenance Procedure
Dual logo maintenance process see pages 2/3
7Maintenance Procedure
8Positive results
Positive results
NO
NO
INFO
See note 6
YES
See note 6
IEEE final ballot. Once approved IEC submits the
FDIS for final vote (2 months) See note 7
Maintenance Procedure
Revised IEC-IEEE standard
The DLMT prepares a common compilation of
comments on the CDV together with proposals to
solve them
IEC-TC/SC takes final decisions on the comments
by email or at a meeting
IEEE takes final decisions on the comments
received
INFO
The DLMT prepares the FDIS based on commonly
agreed modifications.
9Maintenance Procedure Notes
- Note 1 IEC may decide to continue its own
route. If any material is used from the IEC/IEEE
standard, a separate license agreement will be
required. - Note 2 IEEE may decide to continue its own
route leading to publish a revised single IEEE
logo standard replacing the previous one. If so
IEC will withdraw the existing IEC-IEEE standard.
Then IEEE may submit to IEC this new standard as
a candidate for a possible new IEC-IEEE standard
according to the agreement. - Note 3 The organisation which initiates the
process, proposes a convenor first. If the
proposal is not accepted by the other
organisation, another convenor has to be chosen
amongst the members of the DLMT by mutual
agreement. - Note 4 At this stage, IEC or IEEE are requested
to task the DLMT to provide a new draft for
comments - Note 5 The 2 ballot processes must be carried
out in such a way that the deadlines are the same - Note 6 At this stage, IEC or IEEE may decide
either to continue their respective route or to
task the DLMT to provide a new draft for vote by
both organizations. If IEC decides to continue
its own route, then note 1 applies. If IEEE
decides to continue its own route then note 2
applies. - Note 7 The comments made at this stage must be
limited to corrections of misspelling or obvious
errors which may have been generated during the
preparation of the FDIS.
10Discussion about Verilog IEEE/IEC DL Maintenance
- The Verilog situation is unfortunately similar.
- The IEC was not contacted to form a joint working
group. However from the reports of WG1 we (the
IEC TC93) know that some unprecedented
deprecation took out nearly half of the LRM and
the semantic of important functions used to
interoperate tools and integrate applications. - Therefore, there is a proposal to re-affirm the
IEC 61691-4 Verilog (in 2006) without
modifications. That will make sure that a
standard including the IEEE version will still be
a live standard. - Decision should be reached by end of September
(to keep Verilog as is in the IEC, to seek
standardizing at the international level the new
IEEE version or to do nothing).
11Future Work
- Towards clarifying DL Std maintenance issues
- Develop roadmap for next generation standards
- Language independent numerics, TC93 WG2 will
participate in DASC/DATC 2005 Workshop - Analyze EDA relevance of efforts like SPIRIT and
SAE Architecture Std. - Standards to support Statistical EDA, 3D, Farming
- Plans to simplify standardization by separating
PASs from STDs - Involve all available experts from around the
globe