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2D Xray Inspection

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Flip Chip on Lead-free Board. Oblique View. Normal View. Oblique View. 16 ... Lead-free Board. 17. DB/lfree/2_02. Much less experience with lead-free solders ... – PowerPoint PPT presentation

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Title: 2D Xray Inspection


1
2-D X-ray Inspection Lead-free Solders
  • Dr. David Bernard
  • Product Manager X-ray Systems

Dage Precision Industries Limited Rabans Lane,
Aylesbury, Bucks., HP19 8RG, UK Tel 01296 317800
Fax 01296 435408 d.bernard_at_dage-group.com www.da
ge-group.com
2
Why X-ray Inspect?Optical image
3
Why X-ray Inspect?x-ray image overlay on optical
image
Lead-free sample
4
Why need an oblique angled view?
  • The solder ball shape can obscure pad detail if
    only look from above
  • May see truncation at top and bottom of ball as
    evidence of good reflow BUT...
  • Different oblique views can be needed to confirm
    analysis
  • Looks OK in one orientation but not in another,
    or vice versa!
  • Angled views usually show ball shape variation
    better and can remove objects from other board
    levels from interfering with analysis

Lead-free images
5
Why need an oblique angled view?
NORMAL VIEW
Not a lead-free image
6
Why need an oblique angled view?
OBLIQUE VIEW
Not a lead-free image
7
Implications of Lead-freeon X-ray Inspection
8
X-ray of Lead-free Soldered Boards
9
X-ray of Lead-free Soldered Boards
  • Traditional solder SnPb (6337)
  • Most common lead-free solder
  • SnAgCu (SAC alloy)
  • 97 Sn
  • This and other lead-free solders have high Z
    material
  • Sufficient radiation absorption to cast a shadow
    at the detector (image intensifier)
  • Slightly different x-ray tube conditions (power
    kV) may be necessary than with traditional solder
    but inspection capabilities should not be
    compromised

10
Example Images
11
Popcorning Bridging
PossibleFaults
BGA
Opens
12
Voiding and location within Sample
Not a lead-free image
13
Voiding in Pads or Die Attach
  • Calculating the void percentage may be critical
    for automotive and other high temperature / high
    power applications where a poor joining area
    within the connection or die attach could provide
    easy failure paths.
  • Criteria needed?
  • lt x of total pad / die area?
  • No one void gt y of total?

Lead-free image
14
Lead-free Board
Lead-free images
15
Flip Chip on Lead-free Board
Normal View
Oblique View
Oblique View
16
Lead-free Board
Oblique View
Lead-free images
17
Conclusion
  • Much less experience with lead-free solders
  • Higher temperatures used
  • Closer to critical temperatures PCB / components
  • Bad News
  • Learning curve to climb
  • Trials / Mistakes / Errors will be made
  • Good News (!)
  • Your 2-D x-ray inspection system should see them
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