IMA Survey Inputs at AECAPC Conference in Indian Wells

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IMA Survey Inputs at AEC/APC Conference in
Indian Wells

• John Pace
• JCP Associates

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IMA Survey Why Are We Doing This?

• Determine what the needs and requirements for APC
  and IM are today and in the future
• Impact the ITRS and possibly RD directions
• Provide a B2B type forum for IMA members and
  survey contributors for connecting sensor
  metrology technology providers with users that
  need the technology
• Who, what, where, in what stage of development,
  etc.
• Provide an ear and a voice for IMA members and
  survey contributors to understand the needs and
  directions of the industry and influence these
  directions respectively

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Survey Statistics

• 17 respondees
• 6 users
• 8 suppliers
• 3 lab/University

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1. What critical process type(s) are you working
with or know of that require / need IM or APC?

• Users
• Dry and wet etch
• Post exposure bake
• Develop
• Electron beam lithography
• Implant and litho processes for flash technology
• CMP
• Contamination
• Suppliers
• Overlay/CD control
• Equipment performance/process performance
  monitoring
• FDC
• Etch r2r
• CMP thickness control
• IM
• Virtual metrology
• Lab/University
• Calibration of sensors for RTP

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2. What sensor, IM other APC technology do you
think could address these critical processes?

• Users
• OES
• Multivariate analysis
• Neural networks
• Closed loop process control
• Integration, on line, tool parameters analysis
  and feedback
• In situ contamination monitors
• Wafer to wafer, L2L control
• Scatterometry
• RF power, reflectometer
• Suppliers
• OES, interferometry, wafer temperature,,,,in-situ
  and IM required
• Neural networks
• Device health
• Predictive maintenance
• Scatterometry
• Integrated overlay
• Lab/University
• Thin film wafer temperature sensors

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3. What do you see as the barriers to successful
implementation of 1 or 2?

• Users
• Large amount information from tools need to
  relate to EOL sort/etest matching to tool
  parameters
• Time and cost
• Virtual benefits
• Data acquisition and merging
• Model identification and controller tuning
• Suppliers
• Hardware/vendor ownership of problems
• Data quality
• Users knowledge and training
• Fab wide vs on tool solution
• Showing customer value to software solution
• Common framework and implementation across the
  fab is necessary to acquire adoption
• Cost
• Foot print on tool
• Lab/University
• Commercialization of sensing devices

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4. What emerging APC needs do you see in the near
future?

• Users
• Improved visualization of data
• Closed loop process control
• Fab wide or module wide APC
• Data management
• Controlling the whole module (several process
  steps) inputs/outputs
• Adaptive sampling and predictive maintenance
• Suppliers
• Dynamic and real time feedback on recipe tunings
  and process control
• Overall fab-wide solution and validation of
  datacommon standards
• Virtual metrology
• Fab-wide FDC implementation on etch tools
• Predictive fault detection
• Standards
• LabUniversity
• IM/APC applied to ALD
• Flexible interface

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5. For suppliers What do you have in development
to meet critical / emerging APC requirements?

• On tool FDC for data analysis
• Predictive maintenance
• Dynamic neural network
• Yield optimization
• Virtual metrology
• E3 software as framework foe E133/PCS and non PCS
  systems
• High performance reflectometer
• Remote secure access to data

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6. For suppliers What problem(s) does your
technology solve?

• Relate in process metrology to final yield
• Automated defect classification
• Virtual metrology reduces cost and gives better
  input into R2R w/o additional cycle time hits
• Integration of R2R/FDC
• Improve tool operational quality reduce
  unscheduled downtime
• Measuring ultra thin films
• W2W and within wafer control
• Knowledge sharing

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7. Does your company have an IM/APC champion we
can contact for additional information?

• 9 contacts identified

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8. For Suppliers Is your company developing any
Fault Classification or Fault Prediction
solutions, and if so, how do you think this
represents an improvement over available
technology?

• Compliment to fab wide solution
• Useful for FSE and reducing tool ramp up time
• FDC solution for etch on tool and fab wide
  solution
• FDC, EES integration with high sample rate

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9. For Users What have you implemented or plan
to implement in the areas of Fault Classification
and Fault Prediction?

• OES based mask analysis and multivariate
  analysis.
• Closed loop process control
• Lithography APC systems for most of
  scanners/steppers, limited activities in etch and
  CD variation control, limited in other areas
• Plasma damaging monitoring with OES

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10. For Users What would be your 1 requirement
for a Fault Classification system? For a Fault
Prediction system?

• Fault prediction for EOL/In line
• Fault prediction for reducing idle time and
  increase line thruput

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Observations

• Virtual Metrology
• FDC on Tool
• OES
• Scatterometry
• Predictive maintenance
• Cost

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Thanks for the inputs

• Your inputs will be used to design a more
  complete survey that will be used by the IMA