Title: Semiconductor Manufacturing Technology
1EE-354
Integrated Circuit Technology
Characteristics of Semiconductor Materials and
Basic Device Physics(Part 1)
2Elementary Model of the Carbon Atom
Figure 2.1
3Electron Shells for Sodium and Chlorine Atoms
Figure 2.3
4Energy Band Gaps
Figure 2.4
5The Periodic Table of the Elements
Figure 2.6
6Group IVA Elemental Semiconductors
7Silicon Crystal Structure
Silicon crystallizes in the same pattern as
Diamond, in a structure called "two
interpenetrating face-centered cubic" primitive
lattices. The lines between silicon atoms in the
lattice illustration indicate nearest-neighbor
bonds. The cube side for silicon is 0.543 nm.
Germanium has the same diamond structure with a
cell dimension of .566 nm.
8Silicon Crystal Structure
9Covalent Bonding of Pure Silicon
Figure 2.19
10Electrons in N-Type Silicon with Phosphorus Dopant
Figure 2.23
11Conduction in n-Type Silicon
Figure 2.24
12Holes in p-Type Silicon with Boron Dopant
Figure 2.25
13Hole Movement in Silicon
Boron is neutral, butnearby
electron mayjump to fill bond site.
Boron is now a negative
ion.
Only thermal energy to kick
electronsfrom atom to atom.
The empty silicon bond sites (holes) are thought
of as being positive, since their presence
makes that region positive.
Hole moved from 2 to 3 to
4, and will move to 5.
14Conduction in p-Type Silicon
Figure 2.26
15Silicon Dopants
Items in RED form chemical reactions with silicon
and cant be used for doping.
16Silicon Resistivity Versus Dopant Concentration
Redrawn from VLSI Fabrication Principles, Silicon
and Gallium Arsenide, John Wiley Sons, Inc.
Figure 2.27
17N- and P-Type Silicon
Important Facts Not shown are the silicon
atoms, which are present in vastly greater
numbers than either arsenic or boron. Typical
doping concentrations are 1016 arsenic or boron
atoms per cm3. The concentration of silicon
atoms is about 1022 atoms per cm3. For every
"dopant" atom, there are about a million silicon
atoms.
The dominant charge carrier in n-type Si is
the electron.
The dominant charge carrier in p-type Si is
the hole
18 P- and N-Type Silicon Joined
19 Charges in the Interface Region
Most of the arsenic (As) ions on the nside are
covered by an electron.
Near the interface, these ions areuncovered.
Most of the boron (B-) ions on the p side are
"covered", meaning that swimming about them, on
the average, is one hole.
20Depletion Region
21PN Junction Under Reverse Bias
22Negligible Current in Reverse Bias
23Thermally Generated Reverse Current
24Forward-Biased PN Junction
25A Forward-Biased PN Junction
26 I-V Characteristic Curve
This is the "characteristic" curveof a pn
junction diode. It showsthe slow, then abrupt,
rise ofcurrent as the voltage is raised.Under
reverse bias, even verylarge voltages will cause
onlyvery small currents, essentiallyconstant
reverse bias currents.
Reverse current exaggerated typical reverse
current 10 uA.
27Turn-On Voltage
28A PN Junction Diode and Its Symbol
29Semiconductor Devices
- MOS Device Metal/Oxide/Semiconductor. The heart
of modern Integrated Circuits - BiPolar Device Back-to-back diodes. The highest
speed devices, but they produce heat. - Schottky Barrier Diodes Used since 1900 for
electrical rectification. Also called Point
Contact.
30The MOS Transistor
Polysilicon
Aluminum
Gate is insulated from substrate and all
components. NO current flows from Gate under ANY
bias.
31Two Types of MOSFETs
32Biasing Circuit for an NMOS Transistor
33MOS Device Physics
- Gate is TOTALLY insulated from Semiconductor
- Three components are Source (S), Gate (G) and
Drain(D) - Current will be Minority Carriers of substrate
under Gate! - Quiescent State Gate is reverse voltage of
substrate (- for p-type and for n-type.) This
repels/depletes silicon below gate (between S and
D) of any minority carriers. - Conducting State Gate is same as substrate (
for p-type and for n-type substrate). - Gate pulls minority carriers from substrate to
thin layer (5nm) connecting Source and Drain with
their majority carriers. - Forward bias of Source/Gate injects majority
carriers into thin layer. - Bias of Gate/Drain creates field that pulls
majority carriers into Drain.
34NMOS Transistor in Conduction Mode
Figure 3.17
35PMOS Transistor in Conduction Mode
Figure 3.20
36Enhancement and Depletion MOSFETs
37MOS Transistors -Types and Symbols
D
D
G
G
S
S
Depletion
NMOS
Enhancement
NMOS
D
D
G
G
B
S
S
NMOS with
PMOS
Enhancement
Bulk Contact
38Future Perspectives
25 nm FINFET MOS transistor
39Bipolar Device Physics
- Three components are Emitter (E), Base (B) and
Collector(C) - Gate is connected to Semiconductor (produces
heat) - Current will be Minority Carriers of substrate!
- Emitter doping gtgt Base doping. Base is very
narrow. This means electric field penetrates deep
into base region, almost to B/C junction. - Quiescent State Emitter/Gate at same bias. No
current. E/B current is limited by intrinsic
field, B/C junction is reverse-biased. - Conducting State VE lt VB ltlt VC (NPN type)
- Emitter/Base Forward Biased. Base/Collector
Reverse Biased. - This Bias is the same as for MOS device.
- Emitter/Base field extends almost to Collector.
Forward bias injects minority carriers into
narrow Base. These carriers immediately drift to
B/C junction, and the B/C electric field
accelerates them into Collector.
40 The PNP Bipolar Transistor
41 The PNP Bipolar Transistor
The Collector
42Schottky Barrier Diode
- Known since 1900 as Point Contact Diode. Used
for power current rectification (AC ? DC). Used
for early radio receivers. - Made by contacting metal directly to n-type
silicon. Potential barrier is typically 0.3-0.7V
(depends on metal) - Uses only Majority Carriers (electrons). Is a
diode above potential barrier and forward bias. - Effect disappears for silicon doping gt 1016cm-3.
Then get ohmic contact and no diode effect.
43The Schottky Diode
44 Photovoltaic Devices
45Appendix
The following slides are to remind you of some
basic physics.
46How Sizes Affect Resistance
Figure 2.12
47Battery Charges a Capacitor
48Capacitor Holds a Charge