Title: Importance of Materials Processing
1Importance of Materials Processing
- All electronic devices systems are made of
materials in various combinations - Raw materials are far from the final electronic
products - Semiconductor materials (e.g., Si, Ge, GaAs,
GaN...) used for devices must be of extremely
high purity and crystalline order
2Real Materials and their Processing
- Particles, lines and rigid bodies vs. real
materials - Material-specific properties determine the
function and processing details of a material - Comprehensive knowledge of materials processing
requires 5-10 years of learning and practice - Advantage and role of physics students
3Different Types of Electronic Devices
- Discrete devices diodes, transistors,
rectifiers, sensors, - Integrated circuits (IC) CPU, DRAM, ASIC,
- Opto-electronics LED, semiconductor laser (in
CD/VCD players, optical communication), display,
lighting, - Solar cells on satellites, calculators,
large-scale power generation - Data storage DRAM, hard disk, ZIP, flush memory,
CD-ROM, ... - Electro-mechanic devices electro-magnetic,
piezo-electric, ...
4Different Electronic Materials
- Semiconductors Elemental (Si, Ge) Compound
(GaAs, GaN, ZnS, CdS, ) - Insulators SiO2, Al2O3, Si3N4, SiOxNy, ...
- Conductors Al, Au, Cu, W, silicides (metal-Si
compounds), ... - Organic and polymer liquid crystal, insulator,
semiconductor, conductor - Composite materials multi-layer structures,
nano-materials, photonic crystals, ... - More magnetic, superconductor, bio-material,
5(No Transcript)
6Cubic Lattices and Main Crystal Faces
Z
Y
X
7Lattice Structures of Semiconductors
Ga
Si
Si
Ga
Ga
Si
Ga
Si
Ga
Si
As
Si
As
Si
Ga
Si
Ga
Ga
Si
Si
Ga
Si
As
Si
As
Si
Ga
Ga
Si
Si
Ga
Si
Ga
Ga
Si
Si
Silicon, a 5.43 Å (diamond structure)
GaAs, a 5.65 Å (zincblende structure)
8Point Defects
impurities
91D 2D Defects
Edge Dislocation
10Real Device Structures in IC
metal contacts
n
p
n
Diode
Bipolar transistor
MOSFET
11N-channel MOSFET (Metal-oxide-semiconductor FET)
Primary flat edge along 110
Schematic vs. Real
Secondary flat
Si(001) wafer
12Fabrication of a Diode
wafer cut
diffusion
oxidation
lithography
diffusion
(f) metallization
13Processes involved in Semiconductor device and
IC manufacture
Crystal growth and wafer preparation
Epitaxy
Diffusion
Ion implantation
Oxidation
Lithography
Diffusion
Etching
Deposition
Connection
Testing
Packaging