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ILC Detector R

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Title: ILC Detector R


1
ILC Detector RD at BNL
  • BNL-FNAL Meeting, Nov. 14, 2005
  • Veljko Radeka
  • For an overview of ILC detector requirements and
    design issues see Jim Braus seminar at BNL , Oct
    2005
  • https//www.inst.bnl.gov/seminars/PDF/10122005.pdf

2
RD at BNL for ILCI. Detectors
  • Monolithic Active Pixel Sensors (MAPS) for
    Vertex Detection.
  • This is based on direct collection of
    charge produced by an ionizing particle within
    the sensitive layer of a CMOS readout circuit.
    The result is a low mass (0.1 of radiation
    length of Si) detector layer with a position
    resolution of a few microns.
  • Fine granularity small TPCs.
  • These TPCs will be based on GEMs (Gas
    Electron Multipliers) at the ends of the drift
    region followed with fine granularity
    interpolating readout electrodes and extensive
    use of monolithic circuits designed for low noise
    TPC waveform recording.
  • EM calorimetry based on tungsten absorbers and
    silicon sampling layers (in collaboration with
    SLAC).
  • Fine granularity calorimetry with
    small cells ( 5 mm) can only be realized with in
    situ readout at the sampling layers. This
    requires specially designed monolithic circuits
    and presents interconnection topology challenges.
  • End cap calorimetry.
  • Unique challenges in forward
    direction. This has not been addressed in depth
    so far.

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Original MAPS (Deptuch,Turcheta, et al.)
A new concept - and challenge introduce a drift
field into standard CMOS (Rehak, Deptuch, et al.)
  • View of a pixel
  • Green are n-wells for anode and
  • p-channel transistors
  • Red are p-wells fo n-channel transistors

8
TPC Critical Technologies
  • GEM vs MWPC
  • Anode pad configuration - chevron
  • Anode pad ASIC board topology and fabrication
  • ASIC DD
  • Field cage fabrication and asembly

HV Connection
HV Cathode Plane
Field cage
Double GEM planes
Digital readout board
Interpolating anode pad plane with front end ASICs
9
Anode Pad Plane Asic Board A major topology
and fabrication challenge (solved)
0.010
0.004
Blind Vias!
10
TPC pad readout plane ASIC side
7300 2x5 mm2 pads
11
TPC for LEGS Experiment
12
  • Novel prototype detectors
  • 2d stripixel detectors, planar 1-sided
    process
  • US-ATLAS Upgrade (radiation hard up to

  • 1015 neq/cm2)
  • Combination of 3 new aspects
  • 2d stripixel structure with short strips (3 cm)
  • P-type substrate (no inversion, higher CCE than
    n-type after radiation)
  • Magnetic Czochralski-Si (MCZ-Si) for added
    radiation hardness
  • 1st batch of prototypes completed at BNL

50 ?m
  • US-ATLAS Upgrade
  • Pixel pitch 620 ?m (X) and 50 ?m (Y)
  • Strip pitch 50 ?m (U) and 50 ?m (X)
  • Stereo angle between u and Y strips 4.6 ยบ
  • MCZ p-type, detector thickness 200-300 ?m

13
Si Detector Development and Processing in
Instrumentation Div.
  • Novel 2d Stripixel detectors
  • 2d position sensing, 1-sided processing
  • NASA heavy ion microbeam project (2d-submicron
    position resolution obtained in laser and ion
    beam tests at BNL)
  • PHENIX Upgrade
  • 25 ?m position resolution in x and y obtained in
    beam teats on BNL-made prototypes)
  • Technology transferred to industry both SINTEF
    and Hamamatsu had pre-production test runs
  • Hamamatsu also produced prototypes with side
    readout

6
14
RD at BNL for ILCII. Accelerator Technology
  • Photocathode development for polarized electron
    beams
  • 1.1 Development and testing of a low
    emittance ellipsoid beam using suitably
    designed laser beam
  • 1.2 Development of a long lived
    photocathode and characterization of the
    polarized electrons
  • 1.3 Integration of laser, cathode
    injector and magnet system to produce and
    characterize the electron beam for the ILC
  • - generation of flat beam
  • - generation of low emittance
  • - production of polarized beam of
    required charge, bunch structure and life time.
  • 2. Electron beam profile and bunch length
    diagnostics.
  • Physics Dept., CAD and Instrumentation
    Division have been working on using electro
    optic technique to measure the bunch length of
    relativistic electron beams with sub ps time
    resolution, which is essential for
    characterization of ellipsoidal beams.
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