Title: ILC Detector R
1ILC Detector RD at BNL
- BNL-FNAL Meeting, Nov. 14, 2005
- Veljko Radeka
- For an overview of ILC detector requirements and
design issues see Jim Braus seminar at BNL , Oct
2005 - https//www.inst.bnl.gov/seminars/PDF/10122005.pdf
2RD at BNL for ILCI. Detectors
- Monolithic Active Pixel Sensors (MAPS) for
Vertex Detection. - This is based on direct collection of
charge produced by an ionizing particle within
the sensitive layer of a CMOS readout circuit.
The result is a low mass (0.1 of radiation
length of Si) detector layer with a position
resolution of a few microns. - Fine granularity small TPCs.
- These TPCs will be based on GEMs (Gas
Electron Multipliers) at the ends of the drift
region followed with fine granularity
interpolating readout electrodes and extensive
use of monolithic circuits designed for low noise
TPC waveform recording. - EM calorimetry based on tungsten absorbers and
silicon sampling layers (in collaboration with
SLAC). - Fine granularity calorimetry with
small cells ( 5 mm) can only be realized with in
situ readout at the sampling layers. This
requires specially designed monolithic circuits
and presents interconnection topology challenges. - End cap calorimetry.
- Unique challenges in forward
direction. This has not been addressed in depth
so far. -
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7Original MAPS (Deptuch,Turcheta, et al.)
A new concept - and challenge introduce a drift
field into standard CMOS (Rehak, Deptuch, et al.)
- View of a pixel
- Green are n-wells for anode and
- p-channel transistors
- Red are p-wells fo n-channel transistors
8 TPC Critical Technologies
- GEM vs MWPC
- Anode pad configuration - chevron
- Anode pad ASIC board topology and fabrication
- ASIC DD
- Field cage fabrication and asembly
HV Connection
HV Cathode Plane
Field cage
Double GEM planes
Digital readout board
Interpolating anode pad plane with front end ASICs
9 Anode Pad Plane Asic Board A major topology
and fabrication challenge (solved)
0.010
0.004
Blind Vias!
10TPC pad readout plane ASIC side
7300 2x5 mm2 pads
11TPC for LEGS Experiment
12- Novel prototype detectors
- 2d stripixel detectors, planar 1-sided
process - US-ATLAS Upgrade (radiation hard up to
-
1015 neq/cm2) - Combination of 3 new aspects
- 2d stripixel structure with short strips (3 cm)
- P-type substrate (no inversion, higher CCE than
n-type after radiation) - Magnetic Czochralski-Si (MCZ-Si) for added
radiation hardness - 1st batch of prototypes completed at BNL
50 ?m
- US-ATLAS Upgrade
- Pixel pitch 620 ?m (X) and 50 ?m (Y)
- Strip pitch 50 ?m (U) and 50 ?m (X)
- Stereo angle between u and Y strips 4.6 º
- MCZ p-type, detector thickness 200-300 ?m
13Si Detector Development and Processing in
Instrumentation Div.
- Novel 2d Stripixel detectors
- 2d position sensing, 1-sided processing
- NASA heavy ion microbeam project (2d-submicron
position resolution obtained in laser and ion
beam tests at BNL) - PHENIX Upgrade
- 25 ?m position resolution in x and y obtained in
beam teats on BNL-made prototypes) - Technology transferred to industry both SINTEF
and Hamamatsu had pre-production test runs - Hamamatsu also produced prototypes with side
readout
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14RD at BNL for ILCII. Accelerator Technology
- Photocathode development for polarized electron
beams - 1.1 Development and testing of a low
emittance ellipsoid beam using suitably
designed laser beam - 1.2 Development of a long lived
photocathode and characterization of the
polarized electrons - 1.3 Integration of laser, cathode
injector and magnet system to produce and
characterize the electron beam for the ILC - - generation of flat beam
- - generation of low emittance
- - production of polarized beam of
required charge, bunch structure and life time.
- 2. Electron beam profile and bunch length
diagnostics. - Physics Dept., CAD and Instrumentation
Division have been working on using electro
optic technique to measure the bunch length of
relativistic electron beams with sub ps time
resolution, which is essential for
characterization of ellipsoidal beams. -