JC Yun

1
Status of Encapsulation Study

• 11/10/06
• JC Yun

2
Issues

• Possible Wire Vibration can lead to fracture.
• Fragile Bump Bonding
• Delicate Glue bonding between ROC and VHDI.

3
Geometry

• To protect the fragile bump bonding and delicate
  glue bonding, these areas should be avoided.

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Encapsulant

• Conning Sylgard 186 elastomer - Proven product
  (CDF and D0).
• Temperature rating -45 C to 200 C

6
Filler

• Glass Bubbles
• -- 3M product K37 (Soda-Lime-Borosilicate
  , 45um)
• -- Filler thickens the Resin. -gt
  easier flow control.
• -- At low content, the mixture spread
  out easily and make it hard to control
• -- At higher content, better control
  but elasticity reduced.

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Discussions

• Glass Bubble Filler provides good control but it
  causes loss of elasticity. Mixture ratio between
  Resin and Glass Bubble 1 0.1 1 0.3 is
  workable.
• Need to understand the long term effect of the
  filler to make right choice of the mixture ratio.
  
• Once the mixture ratio and geometry is fixed , we
  will encapsulated one of the panels made of Al
  and ship to Gino for vibration test.