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Title: New England Particle Physics Student Retreat (NEPPSR)


1
New England Particle Physics Student Retreat
(NEPPSR)
Front End Electronics for Particle Detection Case
study ATLAS Muon Spectrometer August 20,
2003 John Oliver
  • Signal formation in gas detectors
  • Basic electronic components noise sources
  • Noise calculations
  • Amplifier/Shaper/Discriminators (ASDs) for ATLAS
    Muon Spectrometer


Disclaimer This will be a fairly analytical
approach. The idea is to develop a tool-box of
methods you will need to analyze similar
applications. If you find the need, you can
explore any of these subjects in more detail
later. You dont need to memorize this stuff!!
Homework There will be numerous examples given as
homework. Go as far with them as you can. Well
go over the solutions Wednesday/Thursday evening.
2
Signal formation in gas detectors
Simple example Uniform electric field in drift
gas (eg Ar/CO2)
A
  • Electric field ? E 1e 5 Volts/meter
  • Particle track ionizes N electron/ion(Ar) pairs
    with total charge Ne Q
  • Electrons/ions drift toward Anode/Cathode with
    velocity given by their mobilities
  • Question What signal current i(t) is seen by
    ideal ammeter in series with battery ?

3
  • Electrons drift to Anode, ions to Cathode
  • First the electrons
  • In time Dt, electrons move distance

through potential
Work done by field is
Work done by battery is
In general ?
-------------------- (1)
In this example ?
-------------------- (1b)
Total signal charge collected in arbitrary time t,
-------------------- (2)
4
  • Example
  • Q 1fc , x 2 mm
  • electron signal current i(t) 4 nA
  • velocity mE 4104 met/sec
  • time to hit anode 50 ns
  • total electron signal charge collected in 50 ns
  • q 4 nA 50 ns 0.2 fc ( from eq 2, ?
    Q200V/1kV)

  • What happened to the rest of the ionization
    charge?
  • Homework Liquid argon ionization chamber (or
    calorimeter)
  • Liquid argon filled gap, horizontal track
  • me 0.01 met2/(V-s) (neglect ion drift)
  • Ionization density 7000 electron-ion pairs per
    mm of track (MIP)
  • Vhv 5kV
  • ? Find signal current i(t)
  • ? Total signal charge

5
Signals in circular drift tube (ATLAS Muon
Spectrometer)
  • Electric field ?
  • Primary electrons drift to Anode wire
  • High field at wire surface ( 2e7 V/m) causes
    avalanche centered very close to wire,
    typically 10V from wire surface1
  • Each primary electron liberates Qtot 2e4
    secondary electrons
  • Must analyze both electron and ion signal
    response to single primary electron
  • Electron signal
  • Charge centroid very close to wire ? short
    collection time , lt 1 ns
  • i(t)qelectron d(t)
  • qelectron Qtot DV/Vhv Qtot (10V/3080V)
    (1/3 ) Qto t 130 e

6
  • Ion signal
  • Ion velocity

where t0 is a constant of integration given by,
and integrated signal charge
-------------------- (7b)
7
  • Pulse properties
  • Initial current
  • Extremely long pulse. (See eq 5) Pulse
    terminates when ions arrive at cathode at time
  • Question What proportion of charge is collected
    in time t0 (11ns) ?
  • Conclusions
  • Ion charge is not much but its a lot more then
    the electron signal charge. For ATLAS MDT its
    about 1000 electrons for each primary electron.
  • Electron charge can generally be neglected in
    simulations calculations

HW Go through this analysis to make sure you
understand it. It will come in handy some day!
8
Basic electronic components noise sources Part
I Mathematical note
  • Circuit analysis is almost always done by means
    of Laplace (not Fourier) transforms
  • More convenient than Fourier when
  • circuit is considered quiescent before t 0
  • stimulus occurs after t 0
  • Steady state (fixed frequency) response is
    obtained by s?jwj2pf
  • Universal method of inverting Laplace transforms
  • Look them up in a table or use Maple or
    Mathematica

9
Basic electronic components and noise
sources Part -II
  • Inductor
  • Stores energy in magnetic field
  • E ½ L i2
  • Impedance Z(s) sL
  • Lossless, noiseless
  • Capacitor
  • Stores energy in electric field
  • E ½ C v2
  • Impedance Z(s) 1/(sC)
  • Lossless, noiseless
  • Ideal transmission line
  • Considered infinite sequence of series inductors
    parallel capacitors
  • Results in wave equation with phase velocity
  • and a constraint between voltage and current
  • noiseless
  • Note that an infinitely long transmission line
    is indistinguishable from a resistor of value Z0
  • As corollary, a finite line with a resistor of
    value Z0 at its end, is also indistinguishable
    from a resistor of value Z0.
  • In other words, if you launch a pulse into a
    terminated line, it never comes back (no
    reflection).

10
  • Resistor
  • Electric field pushes conduction electrons
    through a lattice
  • Dissipates power IV
  • Conduction electrons (generally) in thermal
    equilibrium with environment
  • Noisy ? Noise characterized by noise power
    density p(f) watts/hz
  • p(f) is frequently expressed as a voltage (in
    series) or current density (in parallel)
  • en(f) in(f) given in volts/sqrt(hz)
    amps/sqrt(hz)
  • To get values of en(f) in(f) Nyquist, Phys
    Rev, Vol 32, 1928, p. 110

Total noise current in cable
11
  • Disconnect resistors trapping noise power in
    cable
  • Total energy in cable, in frequency band Df is
  • Open circuit cable requires current at ends to
    be zero, and voltage at ends to be nodes
  • Standing waves (integer number of half-waves)
  • In frequency band Df , number of modes is
  • Energy equipartition requires that each mode
    (one for voltage, one for current) corresponds to
    energy kT/2

?
from which we get

---------------------------- (11)
Independent of frequency ? white noise
12
Basic electronic components and noise
sources Part III General circuit analysis
primer
  • Objective
  • To find response of arbitrary circuits to
    arbitrary stimulus in both time and frequency
    domains.
  • Use this to get expected response from MDT
    Amp/Shaper to
  • calibration pulses injected into drift tubes
  • real ion-tail pulses in chambers
  • Method - A
  • Define ratio of output variable to input
    variable Transfer function H(s)
  • Write node and loop equations and solve for
    transfer function
  • Delta function response of circuit is just h(t),
    the inverse transform of H(s)
  • To get response to other inputs g(t)
  • Get transform of g(t) ? G(s)
  • Transform of response is ? F(s)G(s)H(s)
  • Invert to get f(t)

Simple example Find step response of simple
low-pass filter
13
Basic electronic components and noise
sources Part III General circuit analysis
primer
  • Objective
  • To find response of arbitrary circuits to
    arbitrary stimulus in both time and frequency
    domains.
  • Use this to get expected response from MDT
    Amp/Shaper to
  • calibration pulses injected into drift tubes
  • real ion-tail pulses in chambers
  • Method B
  • What if method A fails? ? ie the transforms or
    inverse transforms cannot be found in closed form
  • Resort to the time domain solution ? Convolution
    integral and use numerical solution if necessary
  • Simulation (SPICE)

14
General circuit analysis - Homework
An ideal integrator is followed by a 2-pole
RC-CR shaper as follows
Unity gain buffers
C
R
1x
1x
R
C
  • Show that transfer function of system is
  • a) With delta function input, what do the signals
    look like throughout the circuit?
  • b) Is this circuit suitable for use in high
    rate (eg LHC/ATLAS) environment?
  • Extra credit part
  • c) Replace ideal integrator (1/s) with leaky
    integrator, 1/(sT1) with T15ns
  • Same questions as (a) and (b)

15
Part-IV Noise calculations
  • Example 1
  • What is the rms terminal voltage of the
    following simple circuit?

10k
  • Solution
  • Add noise current source,
  • Solve for circuit transfer function? This
    gives you output voltage density
  • set s jw2pjf
  • Integrate over frequencies (quadrature)

16
  • In this case,

---------------------------- (12)
  • Called kT over C noise, or kTC noise (when
    dealing with charge instead of voltage).
  • Example (Homework)
  • Suppose we want to use an array of 100
    femtofarad capacitors to build an integrated
    voltage waveform recorder in a 3.3Volt CMOS
    process.
  • Note that the switches are CMOS devices and
    are actually voltage controlled resistors which
    switch between some finite resistance in the On
    state to near infinite resistance in the Off
    state
  • Assume maximum signal swing inside the circuit
    is limited to about half the supply voltage, or
    1.6 volts
  • What is the maximum possible dynamic range (in
    bits) of this device? (Dynamic range is max
    signal divided by rms noise).
  • If we plan to digitize this signal, should we
    pay more money for a 16 bit ADC, or will a 14-bit
    ADC do the job?

17
CMOS components Field effect transistors (nfets)
  • In undoped (intrinsic) silicon, electron and
    hole densities are the same
  • n-doped (arsenic, phosphorous, antimony,..)
    electron density increases, hole density
    decreases
  • p-doped (boron, aluminum, gallium, ..)
    vice-versa
  • Strength of doping denoted by sign ? n, n,
    p, p
  • sign indicates higher doping, lower resistivity

Conductive gate electrode
Dielectric gate oxide Si02
n source and drain implants
p substrate ( 10kW/sq)
  • With Vgate 0, structure is non-conductive
    (back to back diodes)
  • Increasing Vgate in positive direction, attracts
    electrons from substrate
  • When Vgate gt Vthreshold, channel becomes
    conductive. Conductance increases as Vgate
    increases.
  • As Vdrain is made more positive than Vsource,
    current starts to flow
  • Voltage gradient appears from drain to source.
  • Electric field is strongest near source, weakest
    near drain..

18
CMOS components Field effect transistors (nfets)
  • In undoped (intrinsic) silicon, electron and
    hole densities are the same
  • n-doped (arsenic, phosphorous, antimony,..)
    electron density increases, hole density
    decreases
  • p-doped (boron, aluminum, gallium, ..)
    vice-versa
  • Strength of doping denoted by sign ? n, n,
    p, p
  • sign indicates higher doping, lower resistivity

Conductive (polysilicon) gate electrode
Dielectric gate oxide Si02
n source and drain implants
gate
source
drain
p substrate ( 10kW/sq)
  • With Vgate 0, structure is non-conductive
    (back to back diodes)
  • Increasing Vgate in positive direction, attracts
    electrons from substrate
  • When Vgate gt Vthreshold, channel becomes
    conductive. Conductance increases as Vgate
    increases.
  • As Vdrain is made more positive than Vsource,
    current starts to flow
  • Voltage gradient appears from drain to source.
  • Electric field is strongest near source, weakest
    near drain.
  • Channel charge density tilts toward source.
  • Drain current increases with Vdrain
  • When Vdrain comes within a threshold voltage
    of Vgate, (Vdrain Vgate Vthreshold) current
    saturates
  • Saturation region also called pinch-off

19
CMOS components Field effect transistors pfets
nfet
gate
source
drain
p substrate ( 10kW/sq)
n well
  • Generally, pfet drain current constant, Kp, is
    about 1/3 that of nfets due to lower hole
    mobility
  • For same size transistor at same current, pfet
    transconductance is smaller by sqrt(3)

20
FET properties (simplified model)
Linear, resistor, or triode region
Saturation region
  • Drain current properties in saturation region
  • Id increases quadradically with Vgs
  • Increases linearly with transistor channel
    width, W
  • Decreases linearly with transistor gate length, L
  • Increases linearly with transistor channel
    width, W
  • Decreases linearly with transistor gate length, L
  • Definition Transconductance ratio of change
    in drain current per unit change in gate voltage.

---------------------------- (14)
21
FET properties (cont)
  • Terminal impedances
  • Gate No dc current flow, just gate capacitance
    Cgate (of order tens of femtofarads to pf)
  • Drain
  • Wiggle the drain voltage a little, whats the
    change in drain current?
  • Ans no (or very little) change so ?
  • Source
  • Wiggle the source voltage a little bit.
  • This changes Vgs and thus drain current (and
    source current) by (Vgs) x (gm).
  • Typical numbers depending on application
  • Example
  • Idrain 1 ma, L0.5u, W100u

22
Some common FET circuits
23
Some common FET circuits cont
E) Fancier differential amplifier
  • Boxes Z1 Z2 can be whatever you need
  • example
  • Z1 is parallel RC
  • Z2 is series RC
  • Transfer function is

? Implements a Bipolar shaping function (See
table of Laplace transforms)
24
Noise in Fets
  • Fet channel is resistive and will thus have a
    thermal noise current component, in
  • Channel is not a single resistor, but rather a
    series of increasing resistances (from source to
    drain)
  • A fudge factor will be needed! (ff 2/3)

en
  • Noise current in drain is equivalent to noise
    voltage in gate with

---------------------------- (15)
25
Noise in Fets
  • HW
  • What is the noise voltage density (nV/sqrt(Hz))
    of a 100W resistor?
  • How much transconductance is required of a fet
    to have this same noise voltage density ?
  • Assuming we have a power budget of 1 ma (drain
    current) for this transistor and that the
    transistor has minimum allowed gate length of L
    0.5 microns, how wide (W) does the transistor
    have to be?
  • How much improvement in en do we get by doubling
    the drain current? or the transistor width?

26
Front end amplifiers (eg ATLAS MDT)
  • Open loop gain
  • Example
  • Cstray 500ff
  • Gm 0.006
  • What is unity gain frequency?

G(f)
f
  • Whats the gain at 1 Hz?

27
Front end amplifiers (eg ATLAS MDT)
  • Open loop gain

R0
  • Whats the gain at 1 Hz?
  • Answer 2x109 !!!!
  • This cant be right! Actually, gain rarely
    exceeds 100.Why is this?
  • Ans Output (drain) impedance of fet is not
    actually infinite same thing for current source

28
Front end amplifiers (eg ATLAS MDT)
To make this a practical amplifier ? use feedback
Transimpedance amplifier
  • For high rate environment we want RC to be small
    15 ns is optimal for MDTs (electronics
    chamber simulations)
  • Important question is input impedance. In
    general, it is given by
  • Wed like it to be
  • real or resistive (alternatives are capacitive
    or inductive)
  • low ( a hundred W or so)
  • as constant over frequency as possible
  • HW Questions
  • Why the above criteria?
  • How might you go about assuring this?
  • Second important concept is Sensitivity or
    Peak voltage output per unit charge input
    (typically in mv/fc)
  • HW Question What is the Sensitivity (in mv/fc)
    of the above circuit?

29
Front end amplifiers (cont)
Now attach this to an ATLAS Muon tube
and add a shaper Question Why do we need the
terminating resistor?
  • For extra credit (LOTs of extra credit!)
  • Whats the delta function response at preamp
    output, shaper output?
  • Characterize system gain in peak shaper signal
    output per unit charge input. (volts/coul or
    mv/fc)
  • How might you get the response to the actual
    ion signal from the gas tube? (Dont actually do
    it!)
  • What is the rms noise voltage at the shaper
    output produced by the terminating resistor?
  • How much charge is this equivalent to
    (equivalent noise charge, or enc)?
  • Ans

Hint For the purposes of this exercise, you can
assume input impedance of amplifier is zero.
30
MDT-ASD topology
1 of 8 channels
Transimpedance preamps
Signal
Discriminator
(delta response)
Bipolar shaper
LVDS
Dummy
Control logic
Wilkinson ADC
Calibration
DACs
Mode
Deadtime
31
MDT-ASD topology
Two transistor current source (Better than single
fet current version)
Vb14 are bias voltages supplied from elsewhere
Source follower
Common gate cascode
Current sink (half of a current mirror)
Common source amplifier
Feedback R C
  • Detailed circuit descriptions can be found in the
    following documents
  • ATLAS-MUON-2002-003
  • http//doc.cern.ch//archive/electronic/cern/others
    /atlnot/Note/muon/muon-2002-003.pdf
  • ATLAS-MUON-080
  • http//doc.cern.ch/tmp/convert_muon-95-080.pdf
  • muon-96-127
  • http//doc.cern.ch/cgi-bin/extractFigs.check.sh?ch
    eck/archive/electronic/cern/others/atlnot/Note/mu
    on/muon-96-127.ps.gz

Extra conductance on Hi-Z node to tailor gain vs
frequency, Zin
32
MDT-ASD preamp layout
180u
300u
33
MDT-ASD topology
Shaper differential amplifiers
Vdd
Vref
M5
M5a
M5b
Vb2
M4a
M4
M4b
OUTb
R
OUTa
Z1(s)
M3a
INa
INb
M3
M3b
Z2(s)
M2b
M2c
Vb1
M2a
M2
Fancy differential amplifier (pg 23)
M1
M1a
M1b
M1c
GND
Bias network
34
MDT-ASD topology
Shaper differential amplifiers
35
Summary conclusions
  • Analysis/design methodology
  • Understand requirements
  • Noise, dynamic range,..
  • Impedances
  • Signal shapes
  • etc
  • Hand calculations will get you close and/or
    guide design
  • Noise contributions of worst offenders
  • Transfer functions, response shapes, etc
  • Transistor sizing for CMOS circuits
  • SPICE modelling
  • Vendor SPICE models can be very accurate but
    very complicated
  • Produce best analysis at expense of intuitive
    understanding
  • To learn more
  • Attend IEEE Nuclear Science Symposia and take
    Short course programs in Front End Electronics
    (IEEE NSS 2003 Portland, Oregon, Oct 19-25)
  • Bibliography lending library
  • Particle Detection with Drift Chambers W.Blum,
    L. Rolandi Springer Verlag, pg 134, 155-158
  • Tables of Laplace Transforms Oberhettinger
    Badii, Springer Verlag
  • Complex Variables and Laplace Transform for
    Engineers LePage, Dover
  • Electronics for the Physicist Delaney, Halsted
    Press
  • Noise in Electronic Devices and Systems
    Buckingham, Halsted Press
  • Low-Noise Electronic Design Motchenbacher
    Fitchen, Wiley Interscience
  • Processing the signals from solid state
    detectors Gatti Manfredi, Nuovo Cimento
  • Analog MOS Integrated Circuits for Signal
    Processing Gregorian Temes, Wiley Interscience
  • Detector Physics of the ATLAS Precision Muon
    Chambers Viehhauser, PhD thesis, Technical
    University Vienna.
  • MDT Performance in a High Rate Background
    Environment Aleksa, Deile, Hessey, Riegler
    ATLAS internal note, 1998
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