IC-EMC Training

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AN EDUCATIONNAL APPROACH TO ELECTROMAGNETIC
COMPATIBILITY OF INTEGRATED CIRCUITS
Alexandre BOYER INSA/DGEI University of
Toulouse 31077 Toulouse - France Alexandre.boyer_at_i
nsa-toulouse.fr
Etienne SICARD INSA/DGEI University of
Toulouse 31077 Toulouse - France Etienne.sicard_at_in
sa-toulouse.fr
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SUMMARY

• CONTEXT
• EDUCATIONAL NEEDS
• STANDARDS
• 4. WHAT IS IC-EMC
• 5. EXAMPLE
• 6. EVALUATION
• 7. CONCLUSION

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CONTEXT
EMC ONE ACRONYM, TWO CONCEPTS
Susceptibility to EM waves
Emission of EM waves
Carbon airplane
Radar
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CONTEXT
TRENDS INCREASED PARASITIC EMISSION
Increased complexity, IOs number, operating
frequencies, transient current
Technology
180nm
Complexity
50M
Packaging
2002
Embedded blocks transient current
Core 1 A
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CONTEXT
TRENDS - INCREASED SUSCEPTIBILITY
Less voltage margin
Supply (V)
5.0
3.3
I/O supply
2.5
1.8
1.2
0.7
32nm
45nm
0.5µ
0.35µ
0.18µ
90nm
65nm
Technology
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CONTEXT
PACKAGES AS ANTENNAS
Package dimensions are close to lambda/4 at GHz
range
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CONTEXT
EMC VALIDATED BEFORE FABRICATION
What IC designers and EMC experts are dreaming of
This work
DESIGN
Architectural Design
Design Entry Design Architect
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EDUCATIONNAL NEEDS
EMC TRAINING AT IC LEVEL HOW TO START?

• A nightmare?

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EDUCATIONNAL NEEDS
EMC TRAINING AT IC LEVEL HOW TO START?

• A nightmare?

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EDUCATIONNAL NEEDS
THINGS WE NEED TO DO

• Illustrate technology scale down
• Complexity
• Current switching
• Impact on EMC
• Illustrate package role and complexity
• Simulate simple models with simple simulator
  (SPICE-like)
• Post-process in Freq. domain for Spectrum
  comparison
• see E, H fields from currents and voltage
• Investigate what if with students

3D real-time view in Microwind
IBIS 3D viewer in Microwind
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EDUCATIONNAL NEEDS
OUR PROPOSAL KEY FACTS

• Give key facts about technology impact on EMC
• Introduce standard measurement methods
• Simulate first order effects using standard model
  approaches
• Give the basics of
• emission prediction
• immunity simulation
• Give simple design rules for improved design
• Address both
• Undergraduate, graduate students
• Engineers in companies
• Leave plenty of space for exercises and real-case
  problem solving
• Fit the course in a one or two days format (cost,
  duration)

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EDUCATIONNAL NEEDS
OUR PROPOSAL COURSE OUTLINES

• Overview (EMC-IC for managers)
• Basic concepts
• Measurement methods
• Guidelines for improved EMC
• Case study
• EMC models
• Chip-chip coupling

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STANDARDS
EMISSION MEASUREMENT METHODS
International Standards IEC 61967
IEC 61967-2 (TEM 1GHz) IEC 61967-3/6 (Near field scan, 5GHz) IEC 61967-4 (1/150 ohm, 1 GHz)
IEC 61967-5 (WBFC, 1 GHz) IEC 61967-7 (Mode Stirred Chamber 18 GHz) IEC 61967-2 (GTEM 18 GHz)
www.iec.ch
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STANDARDS
IMMUNITY MEASUREMENT METHODS
International Standards IEC 62 132
IEC 62132-3 (Bulk Current Injection 1 GHz) IEC 62132-4 (Direct Power Inj 1GHz) IEC 62132-2 (TEM/GTEM)
IEC 62132-5 (WBFC 1 GHz) New proposal (LIHA 10 GHz) Still research (NFS 10 GHz)
www.iec.ch
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STANDARDS
MODEL APPROACHES
International Standard IEC 62 433
1. ICEM-CE - Conducted RF emission 2. ICEM-RE - Radiated RF emission
4. ICIM-CI - Conducted RF immunity 4. ICIM-RI - Radiated RF immunity
www.iec.ch
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WHAT IS IC-EMC
IC-EMC - A TOOL FOR EMC PREDICTION

• A schematic editor to enter macro-models
• An interface to WinSpice analog simulator
• A post-processor to compare simulated with
  measured spectrum
• An Electromagnetic solver to simulate radiated
  field
• Freeware, online, 250 pp documentation, 15 case
  studies

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WHAT IS IC-EMC
SCHEMATIC EDITOR
SPICE compatible
IC, package and PCB model
Basic symbols
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EXAMPLE
CONDUCTED EMISSION
Emission prediction approach
Simulation
Measurements
IEC 62 433
Core Model
Package Model
Probe Model
Test board Model
Time-domain measure
Frequency measurements
Analog Time Domain Simulation
IEC 61 967
Fourier Transform
Fourier Transform
Compare dBµV vs. Frequency
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EXAMPLE
CONDUCTED EMISSION
Emission spectrum analysis
Probe Model
Test board Model
Package Model
Core Model
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EXAMPLE
CONDUCTED EMISSION
Emission spectrum analysis

• What if?
• Effect of decoupling
• Effect of package supply pairs
• Effect of current reduction

Frequency measurements
Compare dBµV vs. Frequency
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EVALUATION
AUDIENCE

• Since 2002, more than 20 sessions involving 300
  students and engineers have been organized
• ISEN France
• ENSME France
• On-Semiconductors
• NOKIA
• APEMC Beijing
• One-day or two-days format.
• The majority of students said
• They understood the mechanisms of parasitic
  emission and susceptibility
• They felt confident in their ability to handle
  EMC at IC level

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EVALUATION
QUESTIONS
Question
1 I appreciated the contents of the training.
2 The level of the training is in accordance with my expectations.
3 The balance between theory and practice was acceptable
4 The contents was adapted to life-long learning.
5 I appreciated the documents given in the training.
6 I appreciated the way the training was taught
7 The contents is clearly related to my work/studies.
8 I may use the contents directly in my activities
9 The lecturer followed the initial planning
10 Overall I was satisfied with the quality of this course.
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EVALUATION
7. The contents is clearly related to my work/studies.
8. I may use the contents directly in my activities
RESULTS

• Answers to questionnaire

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CONCLUSION

• An environment for EMC prediction at IC level and
  trainings has been developed
• The tool is free and is based on measurement and
  model standards
• Trainings help students and engineers to
  understand the mechanisms of parasitic emission
  and susceptibility
• As little theory as possible
• As much practice and examples as possible
• Positive feedback from trainees concerning the
  tool usage for the illustration of EMC concepts
  (80 90 satisfaction rate)

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REFERENCES

• E. Sicard, A. Boyer, IC-EMC v.2 User's Manual
  ISBN 978-2-87649-056-7, July 2009, 320 pages,
  INSA Editor
• C. Dupoux, S. Akue Boulingui, E. Sicard, S.
  Baffreau, N. Bouvier, "Measurement and Simulation
  of Electromagnetic Interference in 3G Mobile
  Components, EMC Compo 2009, November 2009,
  Toulouse, France.
• S. Akue Boulingui, C. Dupoux, S. Baffreau, E.
  Sicard, N. Bouvier, B. Vrignon, "An Innovative
  Methodology for Evaluating Multi-Chip EMC in
  Advanced 3G Mobile Platforms", IEEE Symposium on
  EMC, 2009, Austin, USA.
• S. Bendhia, M. Ramdani, E. Sicard,
  Electromagnetic Compatibility of Integrated
  Circuits, book published by Springer, USA, 2006,
  0-387-26600-3

The tool, manual and course slides are online at
www.ic-emc.org
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THANK YOU FOR YOUR ATTENTION