Silicon wafer processing-Addison Engineering

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Silicon Wafer Processing

• Addison Engineering has an extensive array of
  processing capabilities. On our silicon or yours,
  we can provide virtually any processing service
  you may need, from a simple oxide layer to
  completely patterned wafers.
• Thermal oxide
• Ion implant
• Epitaxial deposition
• Plasma nitride
• Photoresist
• Wafer bumping

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Silicon Wafer Processing
About Wafers In electronics, a wafer (also
called a slice or substrate) is a thin slice of
semiconductor material, such as a silicon
crystal, used in the fabrication of integrated
circuits and other microdevices.  The wafer
serves as the substrate for microelectronic
devices built in and over the wafer and undergoes
many microfabrication process steps such as
doping or ion implantation, etching, deposition
of various materials, and photolithographic
patterning.
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Silicon Wafer Processing

• Formation
• Wafers are formed of highly pure (99.9999999
  purity) nearly defect free single crystal
  material.
• One process for forming crystalline wafers is
  known as Czochralski growth invented by the
  Polish chemist Jan Czochralski.
• In this process, a cylindrical ingot of high
  purity monocrystalline semiconductor, such as
  silicon or germanium, is formed by pulling a seed
  crystal from a 'melt'.

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Silicon Wafer Processing
Donor impurity atoms, such as boron or phosphorus
in the case of silicon, can be added to the
molten intrinsic material in precise amounts in
order to dope the crystal, thus changing it into
n-type or p-type extrinsic semiconductor.
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Silicon Wafer Processing

• Thermal oxide
• Oxide
• TEOS/PETEOS oxide
• Gate oxide
• Low temperature oxide
• PSG glass
• Silicon Nitride
• LPCVD
• Low Stress
• Ultra-low Stress
• Polysilicon (undoped)

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Silicon Wafer Processing

• Metal deposition
• Evaporation
• Sputter
• Epitaxial deposition
• Ion implantation
• SOI
• oxidation
• wafer bonding
• Photolithography

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Silicon Wafer Processing

• Clean
• RCA clean
• Mechanical
• Ingot slicing
• Lap etch
• Wafer thinning
• Wafer downsize (diameter cut-down)
• Wafer dicing

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Silicon Wafer Processing

• Wafer reclaim
• Laser marking
• Wafer bumping
• MEMS - Silicon machining

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Silicon Wafer Processing

• Thin Film Processing
• LOW k
• Black Diamond
• Coral
• Spin On
• and more
• OXIDE CVD and Thermal
• Thick Photoresist Polymide
• High Energy Deep Ion Implant
• Nitrides (Si- and O-)

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Silicon Wafer Processing

• Low Stress Silicon Nitride
• BPSG, PSG, USG
• Amorphous Silicon
• Diamond Like Carbon
• Polysilicon (Doped and Undoped)
• METALS PVD, CVD, Electroplate
• Ai, Cu, Au, Cr, Ta, Ti, TiN
• TiW, TaN, WN, Ni, Ru
• Co, NiSi, TiO2, Pt

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Silicon Wafer Processing
Czochralski Growth
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Silicon Wafer Processing
Grinding and Slicing
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Silicon Wafer Processing
Lapping and Etching
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Silicon Wafer Processing
Polishing and Cleaning
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Silicon Wafer Processing
Sizes Available

• Silicon wafers are available in several sizes
  (diameters)
• 1 (25mm)
• 2 (50mm)
• 3 (75 mm)
• 4 (100mm)
• 5 (125mm)
• 6 (150mm)
• 8 (200mm)
• 12 (300mm)
• 18 (450mm)

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Silicon Wafer Processing
Addison Engineering provides Silicon wafers that
are available with a wide range of
characteristics (specifications) to select from.
Thank You
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