Nordic Innovation Centre project

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NTNE2006, Helsinki, 18 May 2006
Nordic Innovation Centre project NORD-PIE Heli
Jantunen University of Oulu Microelectronics and
Materials Physics Laboratories Oulu,
Finland heja_at_ee.oulu.fi On behalf of the owner
and coordinator of the project Henrik Ræder and
Frode Tyholdt SINTEF Blindern Oslo,
Norway www.sintef.no
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NTNE2006, Helsinki, 18 May 2006
Main goal is to provide an open foundry service
that allows prototyping and small scale
production of MEMS with piezoelectric thin films

• Schedule
• 1.5 years starting in Sept. 2006
• Partners
• SINTEF, Norway (coordinator)
• Infineon Technologies SensoNor AS, Norway
• Hök Instrument AB, Sweden
• InSensor A/S, Denmark
• Mandalon Technologies AB, Sweden
• Sonitor Technologies AS, Norway
• Star-Oddi, Iceland
• University of Oulu, Finland

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NTNE2006, Helsinki, 18 May 2006

• Starting point
• piezoelectric thin films for integration with
  MEMS have been studied intensively in academic
  institutions, and improved methods to prepare
  them have been developed at laboratory scale
• innovative ideas for new types of sensors,
  actuators and other products based on silicon
  MEMS (MicroElectroMechanical Systems) technology
  especially in SMEs
• the production, however, is very demanding
  (investments in clean-room infrastructure and
  equipment, requires long experience in modelling,
  design, materials technology, materials
  processing and special micromachining in addition
  to normal microsystem processing technology)
• based on developed reliable technology for
  integration of piezoelectric thin films through
  the European project MEMS-pie
  (www.sintef.no/mems-pie)
• next step is to fabricate real device
  demonstrators

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NTNE2006, Helsinki, 18 May 2006

• THE MAIN GOAL IS TO FILL THE GAP BETWEEN RESEARCH
  AND PRODUCTION
• How to proceed
• based on developed reliable technology for
  integration of piezoelectric thin films through
  the European project MEMS-pie
  (www.sintef.no/mems-pie)
• work organized into work-packages and four
  phases
• 1. The participating companies will
  propose ideas for demonstrator devices followed
  by feasibility studies, evaluate fabrication
  routes and choose the most representative
  demonstrator designs.
• 2. SINTEF will fabricate the chosen
  devices
• 3. The demonstrator devices will be
  tested and characterised
• 4. Alternatives for packaging of
  the devices will be investigated

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NTNE2006, Helsinki, 18 May 2006

• Possible demonstrator
• ultrasonic imaging transducers
• positioning systems
• pressure and flow sensors
• gas sensors
• energy harvesters
• accelerometers
• micropumps
• Business areas
• automotive industry
• medical field
• building and construction
• Information and communication

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NTNE2006, Helsinki, 18 May 2006

• The results of the project
• demonstrate the capability of the established
  piezo-MEMS process
• at SINTEF for device production
• perform feasibility studies of the present
  technology and future
• products
• produce demonstrators upon a set of design rules
  
• defined a design handbook
• access to state-of-the art piezo-MEMS technology
  
• networking for innovations
• platform for EU 7FP proposal

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Thanks for your attention Heli