The Significance of Enhanced Yield in Semiconductor Manufacturing - PowerPoint PPT Presentation

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The Significance of Enhanced Yield in Semiconductor Manufacturing

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In the semiconductor manufacturing industry, the yield signifies the amount of product derived from a specific process. Yield can be evaluated in different dimensions such as die yield, wafer yield, and manufacturing yield. Enhancing yield is an intricate process involving rigorous data analysis and root cause identification to alleviate any bottlenecks in the manufacturing process. – PowerPoint PPT presentation

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Title: The Significance of Enhanced Yield in Semiconductor Manufacturing


1
The Significance of Enhanced Yield in
Semiconductor Manufacturing https//yieldwerx.
com
2
In the semiconductor manufacturing industry, the
yield signifies the amount of product derived
from a specific process. Yield can be evaluated
in different dimensions such as die yield, wafer
yield, and manufacturing yield. Enhancing yield
is an intricate process involving rigorous data
analysis and root cause identification to
alleviate any bottlenecks in the manufacturing
process. The Role of Yield Management Systems in
Semiconductor Manufacturing  Yield is scrutinized
using Yield Management System (YMS) solutions in
semiconductor manufacturing. The fusion of
machine learning and data mining techniques into
YMS can bring automation and support to the
table, thereby increasing yield, reducing yield
loss, and optimizing the overall production
yield. Stages of Yield Analysis in Semiconductor
Manufacturing  The yield analysis in
semiconductor manufacturing comprises three
primary stages. The first stage focuses on
monitoring failure map patterns of semiconductor
wafers, identifying areas with high failure
concentrations. The second stage involves
identifying the root cause analysis in
semiconductor of these failures, leveraging
pattern mining techniques. The final stage is the
tracking of failure recurrence, utilizing deep
learning methodologies. Through each of these
stages, data is thoroughly analyzed, patterns are
recognized, and measures are implemented to
prevent future occurrences, ultimately improving
the overall yield. Monitoring Failure Map
Patterns  First stage of yield analysis involves
monitoring the failure map patterns of
semiconductor wafers. A critical component in
semiconductor manufacturing, any glitch in wafer
production can significantly impact the overall
yield. In wafer fabrication stage, various tests
like the Wafer Acceptance Test (WAT) are
conducted. Data from these tests, when collated,
generates a wafer failure map - an essential tool
for yield analysis. Identifying Causes of
Failure  In the second stage of yield analysis,
the causes of failure are identified. Pattern
mining, a method of extracting valuable,
recurrent patterns from voluminous datasets, can
be utilized effectively to spot devices that
could potentially cause failures. Notably, the
FP-Growth algorithm proves efficient in finding
complete sets of frequent patterns in large
datasets, thus enabling swift and precise
identification of the components causing a
decline in manufacturing yield.
3
Monitoring the Recurrence of Failures  The third
stage of yield analysis focuses on monitoring the
recurrence of failures. A subset of machine
learning, deep learning, is proposed as an
effective tool for this stage. It involves
training a neural network model on patterns,
which can then autonomously classify new wafers
and signify long-term failure occurrence
trends. The Application of Machine Learning in
Yield Analysis  Machine learning plays a crucial
role in yield analysis in the semiconductor
manufacturing industry. It automates the
detection of failure map patterns using
algorithms such as K-Means, which group wafers
exhibiting similar patterns, reducing manual work
for engineers. In the process of pattern mining,
algorithms like FP-Growth efficiently identify
recurring failure patterns in large datasets,
leading to a ranking of potential cause devices.
Furthermore, deep learning, a subset of machine
learning, aid in the long-term monitoring of
failure occurrences by training neural network
models to automatically classify new wafers and
predict trends. The application of machine
learning significantly enhances yield analysis,
driving productivity and efficiency. Cluster
Detection Using K-Means Algorithm  The K-Means
algorithm in machine learning can automate the
grouping of wafers with similar failure map
patterns. This automation of failure pattern
recognition minimizes the manual work of yield
enhancement engineers and test engineers. Pattern
Mining with the FP-Growth Algorithm  Pattern
mining using the FP-Growth algorithm results in
ranking potential cause devices. Such an approach
allows for quick identification of problematic
components, enabling yield enhancement engineers
to promptly address these issues. Long-term
Failure Occurrence Trends through Deep
Learning  For the implementation of this deep
learning approach, several elements need to be
considered dataset requirements, network
structure, learning rate settings, dropout
technique, model averaging, and learning
procedures. GPUs play a pivotal role in
accelerating learning speed in these deep
learning applications.
4
The Integration of Advanced Techniques into an
Automated Monitoring System   The automated
monitoring system designed with engineer-friendly
interfaces can facilitate real-world
semiconductor manufacturing settings and enable
comprehensive and long-term monitoring
automation. The integration of machine learning
and data mining technologies is projected to
reduce the labor of engineers, thus contributing
to significant yield enhancement. Impact of
Machine Learning and Data Mining on Labor
Reduction   By reducing the manual labor of
engineers, product engineers, characterization
engineers, and yield engineers, machine learning
and data mining can increase efficiency and
productivity while improving the production yield
report. The Significance of Enhanced Yield in
Semiconductor Manufacturing  In summary, the
application of machine learning and data mining
to yield analysis heralds a groundbreaking
approach to yield engineering in the
semiconductor manufacturing industry. Integrating
these advanced techniques into existing processes
can significantly enhance manufacturing yield,
reduce yield loss in manufacturing, and improve
overall productivity and efficiency. Embracing
the digital era, these technologies promise a
future of optimized yield, maximized
productivity, and groundbreaking efficiency in
the semiconductor manufacturing industry.
5
  • Conclusion
  •  In conclusion, the integration of machine
    learning and data mining techniques into
    semiconductor manufacturing yield analysis marks
    a significant shift in the industry's approach to
    yield engineering. Not only do these advanced
    methods help reduce labor and improve efficiency,
    but they also lead to substantial improvements in
    yield and productivity. As the semiconductor
    industry continues to evolve and innovate, the
    application of these advanced techniques is set
    to become increasingly critical. They have the
    potential to revolutionize the way we approach
    yield analysis, making it more precise,
    efficient, and effective. The future of the
    semiconductor industry lies in the successful
    incorporation of these advanced techniques into
    existing manufacturing processes, promising
    unprecedented levels of yield enhancement and
    efficiency. In the face of increasing demand and
    rapidly advancing technology, embracing these
    changes is not only beneficial but necessary. The
    semiconductor manufacturing industry must adapt
    and evolve, leveraging the power of machine
    learning and data mining to stay at the cutting
    edge of yield engineering. Only then can we fully
    realize the potential of these technologies and
    drive the industry forward into a future of
    higher yields, improved efficiency, and greater
    productivity.
  • References
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  • Zheng, N., Zhang, T., Zhao, L. (2013). Yield
    enhancement in semiconductor manufacturing based
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  • Khan, S. (2012). Semiconductor Manufacturing
    Technology Materials, Processes, and Equipment.
    McGraw Hill Professional.
  • Hsu, C. H., Yang, C. C., Jiang, J. A. (2010).
    Semiconductor yield prediction using data mining.
    Expert Systems with Applications, 37(10),
    7206-7216.
  • Agrawal, R., Imielinski, T., Swami, A. (1993).
    Mining association rules between sets of items in
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  • Srivastava, J., Cooley, R., Deshpande, M., Tan,
    P. N. (2000). Web usage mining discovery and
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  • Han, J., Pei, J., Yin, Y. (2000). Mining
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    In ACM sigmod record (Vol. 29, No. 2, pp. 1-12).
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  • Goodfellow, I., Bengio, Y., Courville, A.
    (2016). Deep learning. MIT Press.
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