C.A.D. Agenda - PowerPoint PPT Presentation

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C.A.D. Agenda

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Reusable, composable solvers rapid flow synthesis/optimization ... isomorphism, Odawara/Szymanski/Nijssen-Jess/Varadarajan-Arikati on regularity extraction ... – PowerPoint PPT presentation

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Title: C.A.D. Agenda


1
C.A.D. Agenda
  • Roadmapping Living Roadmaps for systems
  • SiP physical implementation platforms (CLC, SOS)
  • Tools needs
  • Interfaces and standards (infrastructure) for
    design process
  • Internal to flows and methodologies
  • External down (manufacturing variability
    models, mask flow handoff, cluster tool
    abstractions, ) or up (IO cells, signaling
    standards, logic, system-level, )
  • Reusable, composable solvers ? rapid flow
    synthesis/optimization
  • Measurement and quantification of design quality,
    design productivity
  • Concrete realizations of GSRC and other
    methodologies
  • with metrics and automated evaluators (bX)

2
Infrastructure and Benchmarking Agenda
  • Today 900 1000
  • BX and Benchmarking Status
  • Saurabh Adya new Placement Utilities slot
  • Aaron Ng Creating a Living Benchmarking
    Resource Using BX
  • Today 1000 1100
  • Placement-Centered Directions (Mini-Flows, New
    Problems)
  • Xiaojian Yang Industry suggestions
  • Today 1100 1230 pm
  • Concrete steps with OpenAccess
  • Mark Bales OA status update
  • Discussion

3
Placement-Centered Open Problems
  • Incremental Placement
  • Combined Placement and Floorplanning
  • ltClustering cells Floorplanning clustersblocks
    Placing cellsgt locks solution into a bad subspace
  • Timing is a constraint (not an objective) WL is
    an objective
  • Problem lack of understanding of
    interrelationships between different objectives,
    e.g., timing, area (fixed-die) and congestion
  • N.B. WL may not really be an objective it is a
    proxy for congestion (area)
  • Issue of capturing timing in top-down
    partitioning-based placement (partitioning is
    net-based timing is path-based)
  • Open question How is SI solved at placement?
  • IR drop placement?
  • Variability-aware placement?

4
Placement-Centered Open Problems
  • Thermal placement (not just dynamic power
    minimization)
  • Given activities of all gates, find a placement
    to minimize a linear combination of dynamic power
    and maximum thermal variation
  • Hierarchy-driven placement?
  • Probably moving to flat, so this seems less
    important
  • Datapath-based (timing-constrained) placement
  • People have tried but have not achieved notably
    better results
  • 2 literature from late 1980s Ebeling et al.
    subgraph isomorphism, Odawara/Szymanski/Nijssen-Je
    ss/Varadarajan-Arikati on regularity extraction

5
Placement-Centered Open Problems
  • Power implications (voltage islands)
  • Chuck also mentions this
  • Clock gating
  • Multi-Vdd islands granularity of several
    hundred cells (?) 1-2 rows min in V, stripe
    pitch min in H
  • Ground islands (shutdown of blocks keeping memory
    partially powered up)
  • Cf. Amirs work at Northwestern 1995
  • Placement for BIST (check with Tim Cheng et al.)
  • Signal Integrity Issues (crosstalk handling at
    floorplan and placement)
  • Clock distribution
  • ABK Suggestion Single-width, single-pitch cell
    layout, synthesis, place and route flow WOULD BE
    HEROES !!! (PhasePhirst!, SCAAM, etc.
    next-generation lithography proposals, all of
    which depend on hyper-resolution (2-beam
    imaging) ? basically, only one direction and one
    pitch will print (the layout is a subset of a
    grating). Goal C.A.D. people should prove a
    one-time, bounded hit on Moores Law (e.g., 30
    density) but then scalability of SPR thereafter.

6
Placement-Centered Open Problems
  • X, Y Architectures March 5th EE Design ?
  • Design for Variability
  • Backend Process Optimization
  • Complex objective marketing, methodology,
    integration
  • Marketing BEOL should be optimized for many
    designs (derivatives, etc.) range of size,
    frequency, etc.
  • Methodology Crosstalk, IR drop, routing
    density, etc.
  • Statistical information WL per layer,
    designs having X gates, Y MHz,
  • Integration cost of fabrication (e.g., AR
    limits, low metal-layer count, layers, thickness
    (mfg throughput, pitch LBs from AR limits, ))
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