Title: Conclusion 1
1Stepped Isothermal Method for Creep Rupture
Studies of Aramid Fibres
Nadun Alwis and Chris Burgoyne
2Overview
- Introduction to stress-rupture
- Accelerated testing methods
- - Time Temperature Superposition (TTSP)
- - Stepped Isothermal Method (SIM)
- Results and discussion
- Conclusions
3Stress-rupture - Creep until failure.
Conventional creep testing - long durations to
cause failure at low loads.
4- Test data
- Lifetime models to predict long-term
stress-rupture - Probabilistic predictions for design (5 95)
Applied stress
ln(time to failure)
5Multiple models
Different models give very different results
6- Reliability of lifetime extrapolations is
questionable. - Need Stress-rupture data at low stress levels.
- A long times needed for low stress tests.
- Accelerated creep tests have been suggested.
7Time temperature superposition principle (TTSP))
- Uses multiple specimens at the same load
- Each specimen creeps at a different temperature
for short time
- At highest temperature specimen creeps to
failure. - A reference temperature is selected (Tr).
- Other creep curves are shifted to superpose to a
master curve at Tr .
8Shift on log (time) scale if Arrhenius applies
9TTSP result
Master curve at 70 ABL
10Stepped Isothermal Method (SIM)
- Uses one specimen.
- Load applied
- Temperature increased in steps
- Specimen fails due to creep
- Complete creep curve can be obtained from one
specimen. - Curves need to be adjusted for-
- 1. Variations in thermal expansion (Vertical
shift). - 2. Thermal history (Rescaling)
- 3. Shifting as for the TTSP
11Vertical shift (v)
- Thermal expansion (or contraction) occurs while
the temperature is being increased. - The specimen continues to creep.
The adjusted strain just after the temperature
step can be found by
(a) by adding the thermal contraction, so
(b) by adding the creep over temperature step, so
12Coefficient of thermal expansion (CTE) not
accurately known. Difficult to calculate
Method (b) uses measured values. Changes of the
creep rate over time tc can be found by
conducting separate creep tests from temperature
T1 to various temperatures T2 and T3
13Perform two tests - T1 to T2 T1 to T3
Measure creep rates before and after
Known temperature rate
Hence
14Rescaling (r)
- At higher temperatures specimen did not start
from zero - Rescaling accounts for the thermal history.
- Shift in the linear time scale
- PQ should be same as a single TTSP curve
15P3
i represents each data point j represents
each adjustment
16Material and experimental set-up
- Kevlar-49 yarns are used in TTSP and SIM tests
- Average breaking load was found to be 445 N
17Results and discussion
Master curves with conventional creep data at 50
ABL
18Master curves with conventional creep data at 70
ABL
19All SIM master curves at 50 ABL
20All SIM master curves at 70 ABL
21Stress-rupture data
22Conclusions
- TTSP and SIM can be used to obtain the long-term
stress-rupture data. - SIM can be automated.
- SIM is better than TTSP and conventional creep
tests. - SIM curves show repeatability.
- Many stress-rupture data points can be generated
using SIM and included in the lifetime models to
improve the reliability. - The Reverse curve in the SIM master curve is
notable and further investigation is necessary.
23Question
- Is the resulting Master Curve the same as the
curve that would have been obtained from a very
long conventional test?