Title: BULK Si (100) VALENCE BAND STRUCTURE UNDER STRAIN
1BULK Si (100) VALENCE BAND STRUCTURE UNDER STRAIN
Sagar Suthram Computational Nanoelectronics Cla
ss Project - 2006
2Outline
- Brief history of MOSFET scaling and need for
Strained Silicon. - Understanding Strain.
- Si valence band structure calculation using k.p
method. - Si valence band structure calculation using tight
binding method. - Strain effects on Si valence and conduction band
qualitative picture. - Summary
3MOSFET Scaling History
- Si MOSFET first demonstrated in SSDRC in 1960.
- Improved dramatically due to gate length scaling
driven by - Increased density and speed
- Lower costs
- Power improvements
- Semiconductor industry scaled the MOSFET channels
based on Moores law (1965). Simple geometric
scaling followed. - Constant field scaling introduced by Dennard et.
al. (1974).
4MOSFET Scaling History
- Constant field scaling too restrictive
- Subthreshold nonscaling
- Power-supply voltage not scaled proportional to
channel length - Generalized scaling is preferable which allows
oxide field to increase - Shape of 2-D electric field pattern preserved
(channel doping engineering) - Short channel effects do not become worse
5MOSFET Scaling Limits
- But conventional planar bulk MOSFET channel
length scaling is slowing - Increased off-state leakage
- Increased off-state power consumption
- Degraded carrier mobility due to very high
vertical fields (thin oxides lt2nm) - Lithographic limitations
- Little improvement in switching performance
- Inability to scale supply voltage and oxide
thickness
6Continued Transistor Scaling
- No exponential is forever Gordon Moore
- But present scaling limits for Si MOSFET are
caused by materials and device structure and are
not hard quantum limits - Continued scaling requires new materials and
device structures - High K dielectrics
- Strained Si
- Novel channel materials (Ge, III-V
semiconductors) - Non classical CMOS devices (FinFETs etc.)
7Strained Silicon
- Strained Silicon has been adopted in all advanced
logic technologies - Scalable to future generations
- Easily incorporated in existing processes
- Enhances performance even in the ballistic regime
due to effective mass reduction
90nm INTEL Technology node transistor with
process induced uniaxial stress Thompson 04
8How is strain added to silicon ?
- Uniaxial stress is induced in the following ways
- SiGe source-drain for PMOS
- Tensile nitride capping layer for NMOS
9How is strain added to silicon ?
Biaxial stress is induced by epitaxialy growing a
silicon layer on relaxed SiGe. The lattice
mismatch induces biaxial tensile stress in the
silicon layer.
10Outline
- Brief history of MOSFET scaling and need for
Strained Silicon. - Understanding Strain.
- Si valence band structure calculation using k.p
method. - Si valence band structure calculation using tight
binding method. - Strain effects on Si valence and conduction band
qualitative picture. - Summary
11Understanding Strain
12Understanding Strain
Elastic Stiffness Coefficients
Elastic Compliance Coefficients
13Outline
- Brief history of MOSFET scaling and need for
Strained Silicon. - Understanding Strain.
- Si valence band structure calculation using k.p
method. - Si valence band structure calculation using tight
binding method. - Strain effects on Si valence and conduction band
qualitative picture. - Summary
14Silicon valence band using k.p
The form of the Schrodinger equation when written
in terms of unk(r) near a particular point k0 of
interest.
15Silicon valence band using k.p
- Luttinger-Kohns model k.p method for degenerate
bands - Mainly for silicon valence bands
- Consider the heavy hole, light hole and split-off
bands as class A and rest of the bands as class B - Use 2nd order degenerate perturbation theory
16Luttinger-Kohn Hamiltonian
17Valence Band structure
18Valence Band structure
19Valence Band structure
20Outline
- Brief history of MOSFET scaling and need for
Strained Silicon. - Understanding Strain.
- Si valence band structure calculation using k.p
method. - Si valence band structure calculation using tight
binding method. - Strain effects on Si valence and conduction band
qualitative picture. - Summary
21Silicon Valence band using tight-binding method
- sp3s tight binding picture used
- 20x20 Hamiltonian including spin-orbit
interaction considered - Silicon valence band predominantly composed of
p-bonding states which are degenerate at the G
point
22Tight binding Band structure
23Tight binding Band structure
24Outline
- Brief history of MOSFET scaling and need for
Strained Silicon. - Understanding Strain.
- Si valence band structure calculation using k.p
method. - Si valence band structure calculation using tight
binding method. - Strain effects on Si valence and conduction band
qualitative picture. - Summary
25Strain effects on silicon valence band
- Splits the degeneracy of the valence band at the
G point - The bands are no longer just HH or LH due to the
strong coupling between the two, but either
HH-like or LH-like - Biaxial stress does not warp the bands much due
to the presence of only a hydrostatic component
in the strain matrix which maintains the crystal
symmetry. - Uniaxial stress warps the bands causing a
reduction in the effective mass due to the
presence of a shear term which destroys the
crystal symmetry
26Summary
- k.p method is emperically based and treats the
band structure with precision - k.p is useful for calculating band structure only
for k values close to the band edge which is
generally the region of interest - Tight-binding on the other hand considers the
microscopic interatomic interactions and hence
gives a good physical insight into the strain
effects on the band structure - We see differences in the exact band structures
computed by the two methods but they show similar
trends under the application of strain - Computing more accurate band structures with the
tight-binding method involves consideration of up
to 10 orbitals (sp3d5s) along with spin which
gets very complicated when the strain effect is
added
Thank You