BULK Si (100) VALENCE BAND STRUCTURE UNDER STRAIN - PowerPoint PPT Presentation

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BULK Si (100) VALENCE BAND STRUCTURE UNDER STRAIN

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Si valence band structure calculation using tight binding method. ... 90nm INTEL Technology node transistor with process induced uniaxial stress [Thompson 04] ... – PowerPoint PPT presentation

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Title: BULK Si (100) VALENCE BAND STRUCTURE UNDER STRAIN


1
BULK Si (100) VALENCE BAND STRUCTURE UNDER STRAIN
Sagar Suthram Computational Nanoelectronics Cla
ss Project - 2006
2
Outline
  • Brief history of MOSFET scaling and need for
    Strained Silicon.
  • Understanding Strain.
  • Si valence band structure calculation using k.p
    method.
  • Si valence band structure calculation using tight
    binding method.
  • Strain effects on Si valence and conduction band
    qualitative picture.
  • Summary

3
MOSFET Scaling History
  • Si MOSFET first demonstrated in SSDRC in 1960.
  • Improved dramatically due to gate length scaling
    driven by
  • Increased density and speed
  • Lower costs
  • Power improvements
  • Semiconductor industry scaled the MOSFET channels
    based on Moores law (1965). Simple geometric
    scaling followed.
  • Constant field scaling introduced by Dennard et.
    al. (1974).

4
MOSFET Scaling History
  • Constant field scaling too restrictive
  • Subthreshold nonscaling
  • Power-supply voltage not scaled proportional to
    channel length
  • Generalized scaling is preferable which allows
    oxide field to increase
  • Shape of 2-D electric field pattern preserved
    (channel doping engineering)
  • Short channel effects do not become worse

5
MOSFET Scaling Limits
  • But conventional planar bulk MOSFET channel
    length scaling is slowing
  • Increased off-state leakage
  • Increased off-state power consumption
  • Degraded carrier mobility due to very high
    vertical fields (thin oxides lt2nm)
  • Lithographic limitations
  • Little improvement in switching performance
  • Inability to scale supply voltage and oxide
    thickness

6
Continued Transistor Scaling
  • No exponential is forever Gordon Moore
  • But present scaling limits for Si MOSFET are
    caused by materials and device structure and are
    not hard quantum limits
  • Continued scaling requires new materials and
    device structures
  • High K dielectrics
  • Strained Si
  • Novel channel materials (Ge, III-V
    semiconductors)
  • Non classical CMOS devices (FinFETs etc.)

7
Strained Silicon
  • Strained Silicon has been adopted in all advanced
    logic technologies
  • Scalable to future generations
  • Easily incorporated in existing processes
  • Enhances performance even in the ballistic regime
    due to effective mass reduction

90nm INTEL Technology node transistor with
process induced uniaxial stress Thompson 04
8
How is strain added to silicon ?
  • Uniaxial stress is induced in the following ways
  • SiGe source-drain for PMOS
  • Tensile nitride capping layer for NMOS

9
How is strain added to silicon ?
Biaxial stress is induced by epitaxialy growing a
silicon layer on relaxed SiGe. The lattice
mismatch induces biaxial tensile stress in the
silicon layer.
10
Outline
  • Brief history of MOSFET scaling and need for
    Strained Silicon.
  • Understanding Strain.
  • Si valence band structure calculation using k.p
    method.
  • Si valence band structure calculation using tight
    binding method.
  • Strain effects on Si valence and conduction band
    qualitative picture.
  • Summary

11
Understanding Strain
12
Understanding Strain
Elastic Stiffness Coefficients
Elastic Compliance Coefficients
13
Outline
  • Brief history of MOSFET scaling and need for
    Strained Silicon.
  • Understanding Strain.
  • Si valence band structure calculation using k.p
    method.
  • Si valence band structure calculation using tight
    binding method.
  • Strain effects on Si valence and conduction band
    qualitative picture.
  • Summary

14
Silicon valence band using k.p
The form of the Schrodinger equation when written
in terms of unk(r) near a particular point k0 of
interest.
15
Silicon valence band using k.p
  • Luttinger-Kohns model k.p method for degenerate
    bands
  • Mainly for silicon valence bands
  • Consider the heavy hole, light hole and split-off
    bands as class A and rest of the bands as class B
  • Use 2nd order degenerate perturbation theory

16
Luttinger-Kohn Hamiltonian
17
Valence Band structure
18
Valence Band structure
19
Valence Band structure
20
Outline
  • Brief history of MOSFET scaling and need for
    Strained Silicon.
  • Understanding Strain.
  • Si valence band structure calculation using k.p
    method.
  • Si valence band structure calculation using tight
    binding method.
  • Strain effects on Si valence and conduction band
    qualitative picture.
  • Summary

21
Silicon Valence band using tight-binding method
  • sp3s tight binding picture used
  • 20x20 Hamiltonian including spin-orbit
    interaction considered
  • Silicon valence band predominantly composed of
    p-bonding states which are degenerate at the G
    point

22
Tight binding Band structure
23
Tight binding Band structure
24
Outline
  • Brief history of MOSFET scaling and need for
    Strained Silicon.
  • Understanding Strain.
  • Si valence band structure calculation using k.p
    method.
  • Si valence band structure calculation using tight
    binding method.
  • Strain effects on Si valence and conduction band
    qualitative picture.
  • Summary

25
Strain effects on silicon valence band
  • Splits the degeneracy of the valence band at the
    G point
  • The bands are no longer just HH or LH due to the
    strong coupling between the two, but either
    HH-like or LH-like
  • Biaxial stress does not warp the bands much due
    to the presence of only a hydrostatic component
    in the strain matrix which maintains the crystal
    symmetry.
  • Uniaxial stress warps the bands causing a
    reduction in the effective mass due to the
    presence of a shear term which destroys the
    crystal symmetry

26
Summary
  • k.p method is emperically based and treats the
    band structure with precision
  • k.p is useful for calculating band structure only
    for k values close to the band edge which is
    generally the region of interest
  • Tight-binding on the other hand considers the
    microscopic interatomic interactions and hence
    gives a good physical insight into the strain
    effects on the band structure
  • We see differences in the exact band structures
    computed by the two methods but they show similar
    trends under the application of strain
  • Computing more accurate band structures with the
    tight-binding method involves consideration of up
    to 10 orbitals (sp3d5s) along with spin which
    gets very complicated when the strain effect is
    added

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