INFN Bologna M'Guerzoni M'Bruno G'Laurenti

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INFN Bologna M.Guerzoni M.Bruno G.Laurenti (A
thought and a thanks to Jim Gautier)
Photodiode 22x22x0.5
Back-frame (area bonding)
Basic telescope
Silicon 22x22x0.5
Supporting frames (area bonding)
kapton 0.2
Csi holder
Csi 21.4x21.4x40
Nylon-wire d 0.2 mm
Silicon 22x22x0.3
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• To keep the different parts together in a single
  unit, two Fishing wire 0.2 diam are inserted in
  the first frame, strechted and glued into the
  back.
• Advantages
• 1-more compact assembly
• 2-reduction of dead area
• In the back side the wire is
• Inserted at the tension of 200 g and glued in the
  support basket(plastic material not yet defined).
• The back frame is designed to accommodate the
  photodiode, to form the basis for anchoring the
  wire of nylon, has a surface area of contact for
  Csi holder (red one) and locks to the basket by
  the teeth

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The single unit is made of 4 telescopes (FEE
boardBasket). In case of substitution of each
telescope , it is needed substitute the block
Previous design (modularity eight units)
New designin this phase we dont take in
consideration the cooling system(modularity four
units)
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In figure we can show the sequence of assembly
part. It can see how the nylon wire has the
function of maintaining the assembly together. It
plans to assemble each telescope and then group
them together through basket( blu one) by number
four
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There are three possible configurations
The basket of the block has a inner cross 0.8mm
thick to define the positioning of the telescopes
The basket has an internal cross(centering) wich
is tapered.The internal walls are tapered with
0.5degree.
The basket (blu one) of the block is made without
internal cross but it is present singol
back-frame(green one) for the telescope centering
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In this case the telescopes are separated with
cross(0.8 thick) DA/AA4.39
In this case the telescopes are without cross
DA/AA2.2
In this case the telescopes have the cross and
the walls are 1 inclined (projecting geometry)
DA/AA2.33
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Technological feasibility
The materials used might be the following
-Delrin (acetal resin) ABS-(not glass loaded
due to small thickness ).The the accuracies
obtainable could be about 20-30 microns The
thickness T(0.2mm) will be very difficult to
obtain and Csi holder(red one) could be in two
halves, while the S thick (0.5mm) is feasible.
The electrical conductivity can be achieved with
conductive coating or paint (aluminum,
silver). Testing must be done to verify that the
parameters are respected. We need to build
prototypes and then test them .