V. Cindro, Jo

1
Pre-series Low Mass Tapes
12 different lengths were produced for barrel 3
harness 50 ?m Al/ 50 ?m kapton was used Lengths
needed Left Harness 1317 mm - 2024 mm Right
Harness 1350 mm - 2061 mm Tapes produced on
sheets 12 A sheets 12 B sheets
processed Ends electroplated with Ni/SnPb A and B
sheets laminated ? 12 double sheets Cut ? 12
tapes/sheet 144 tapes pre-series tapes produced
60 were shipped to Taiwan 26.4.2002 In addition
? 90 short (30 cm) tapes were produced for
soldering tests at Taiwan
V. Cindro, Jožef Stefan Institute, Ljubljana,
Slovenia
SCT week, Valencia, June
2002
2
Acceptance Underetching of lines (reduction of
average metal trace width) shall be less than
100 microns. Conductor width reduction shall not
exceed 30 of the nominal conductor
width. Conductor spacing shall not be reduced by
more than 30 due to conductor edge roughness,
spikes, etc. Line resistance shall be smaller
than 0.15 ?/m for 4.5mm lines and 1.7 ?/m for
0.5 mm lines. Inter line resistance shall be
greater than 100 M?. Leakage current lt 100 nA
at 500V There shall be no lifted Al lands on
the delivered tapes. Al thickness shall not be
changed by the process by more than 10
. Adhesive flow on coverlay edges shall not be
more than 2mm. Electroplated surface shall be
solderable in accordance with IEC
68-2-20. Plating adhesion shall be tested in
accordance with IPC-TM-650, method 2.4.1. using
a strip of pressure sensitive tape.
Misalignment of lines on top and bottom layer
shall be smaller than 0.2 mm in laminated
area. The yield of the production of double
layer tapes shall be greater than 80 . For
small quantities, lower yield figures can be
agreed.
V. Cindro, Jožef Stefan Institute, Ljubljana,
Slovenia SCT week, Valencia, June 2002
3
Optical inspection (now at ELGO-LINE)
V. Cindro, Jožef Stefan Institute, Ljubljana,
Slovenia
SCT week, Valencia, June
2002
4
Optical inspection 24 errors (11 are due to
error on mask) Electrical test 4 breaks (were
also revealed with optical inspection) 6
additional cables out of spec. (Rint lt 100 M?) 1
tape damaged during cutting Yield Optical
120/144 83 Electrical 134/144 93 Total
113/144 78 Without mask error 113/132 85
Plating adhesion was checked and was in
agreement with IPC standard. Solderability
(wetting) check before and after aging (16
hours at 155oC) OK Plating thickness Sn/Pb
9.1 ? 0.4 ?m Ni
2.3 0.2 ?m
V. Cindro, Jožef Stefan Institute, Ljubljana,
Slovenia
SCT week, Valencia, June
2002
5
V. Cindro, Jožef Stefan Institute, Ljubljana,
Slovenia
SCT week, Valencia, June
2002
6
nominal value
V. Cindro, Jožef Stefan Institute, Ljubljana,
Slovenia
SCT week, Valencia, June
2002
7
Side view of Ni/SnPb plated Al line
V. Cindro, Jožef Stefan Institute, Ljubljana,
Slovenia
SCT week, Valencia, June
2002
8
Tape dimensions Nominal thickness 2x(50?m
18 ?m 50 ?m) 25 ?m 37.5 298.5 ?m
Al glue kapton glue
coverlayer Measured thickness 295 - 310 ?m,
with some 330 ?m spots in transition part,
improvement foreseen. Tape width 21.1
mm Bending test (on short tapes S13) r 2 mm
20 bends OK 40 bends 1 line broken 60 bends
all lines broken - top layer all
lines OK - bottom layer r 3 mm 50 bends OK 80
bends 1 line broken 100 bends 2 lines R
increase 130 bends 2 lines broken
V. Cindro, Jožef Stefan Institute, Ljubljana,
Slovenia
SCT week, Valencia, June
2002
9
Conclusions Pre-series tapes produced within
agreed specifications. Further improvements
more precise lengths, labeling on sheet masks
improved lamination process adhesion of
electroplating - new requirement will be
specified after the test method will be agreed.

V. Cindro, Jožef Stefan Institute, Ljubljana,
Slovenia
SCT week, Valencia, June
2002
10
LMT production schedule delivery of 1st
production batch 9 weeks after reception of GTS
material at ELGOLINE assuming material arrival
at July 15 10 - Sep 15 20 - Sep 30 40 -
Oct 21 60 - Nov 18 80 - Dec 16 100 - Jan
20, 2003
V. Cindro, Jožef Stefan Institute, Ljubljana,
Slovenia
SCT week, Valencia, June
2002
11
Adhesion of Ni/Al What is good adhesion - our
wishes more demanding than standards. Pull
strength of IPC specified tape only 1N/mm, we are
testing 10 N/mm They can be fulfilled -
previous batches proved that ELGOLINE in contact
with ATOTECH parameters were at the edge of what
was allowed by the QA QC procedures
investigated - calibrated peel strength sticky
kapton tape - simple soldering of tapes to PCB
pull test
V. Cindro, Jožef Stefan Institute, Ljubljana,
Slovenia
SCT week, Valencia, June
2002