Title: V. Cindro, Jo
1Preseries patch panels PCB with 8 layers,
length 268 mm width 38 mm thickness 2 mm 15
panels produced in preseries 4 populated (for
pre series) 1 without connectors (for
soldering tests) delivered to Taiwan 6 on stock
waiting Taiwan confirmation
V. Cindro, Jožef Stefan Institute, Ljubljana,
Slovenia
SCT week, Valencia, June
2002
2Soldering of tapes to panels
V. Cindro, Jožef Stefan Institute, Ljubljana,
Slovenia
SCT week, Valencia, June
2002
3Accelerated aging of LMT/PCB joints 15 tapes
(SnPb plating, 25 ?m kapton) soldered at RAL to
small PCB (red) Aging in CO2 atmosphere CO2
bubbled through water at 25 oC Aging at 100
oC 120 hours HV line at 500 V during aging
Acceleration factor (20 oC ? 100 oC) 110 (Ea
0.5 eV) 8000 (Ea 1 eV) No visual damage has
been observed. Resistance of lines, resistance
between the lines, HV leakage current were
measured before and after aging.
V. Cindro, Jožef Stefan Institute, Ljubljana,
Slovenia
SCT week, Valencia, June
2002
4V. Cindro, Jožef Stefan Institute, Ljubljana,
Slovenia
SCT week, Valencia, June
2002
5Testing of PP1 boards All boards are tested on
shorts, contacts before the assembly with
components. After assembly preseries were
tested manually (contacts, interline on M?
level) PP1 boards in serial production
tester designed interface with computer will
check shorts, contacts, capacitors
V. Cindro, Jožef Stefan Institute, Ljubljana,
Slovenia
SCT week, Valencia, June
2002