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Tehniline

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The Large Hadron Collider (LHC) will accelerate two ... CASTOR? CMS TOTEM Meeting Risto Orava CERN 23.9.2005. ZDC. ZDC. 23. 24. 25. 26. The Roman Pot unit ... – PowerPoint PPT presentation

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Title: Tehniline


1
Tehniline ülevaade uusimast füüsikast CERNis
  • Endel Lippmaa
  • 20. Detsember 2006, TTÜ

2
The Large Hadron Collider (LHC) will accelerate
two counter-rotating beams of protons to energies
of 7 TeV, about a million times larger than the
energies of radioactive decay. The goal will be
to have protons from one beam collide with
protons from the other, hence the name "Collider.
3
Large Hadron Collider Tunnel
4
This is the underground tunnel of the Large
Hadron Collider (LHC) accelerator ring, where the
proton beams are steered in a circle by magnets.
The LHC is the accelerator facility (in France
and Switzerland).
5
Cross section LHC tunnel
6
Leading Proton Detection
147m
180m
220m
0m
308m
338m
420 430m
D2
Q4
Q5
Q6
Q7
B8
Q8
B9
Q9
B10
B11
Q10
IP
?
?
?
D1
?
?
?
Q1-3
?
?
?
?
?
x 0.02
?
?
Jerry Risto
7
ACCESS to DS5
  • Travel for 400 m in the LSS and DS
  • LSS1/5 very radioactive regions ( KGy/y)
  • DS 1 KGy/y foreseen close to the missing
    magnet and Q11
  • Both the passage trough this zone and the work to
    be done at the cryostat have to be carefully
    planned with Radiation Protection Group .
  • At least a few hours are needed before access is
    granted after a beam dump
  • Flush fresh air in the tunnel
  • RP technician has to inspect the zone

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9
Schematics of the ATLAS Detector
10
EVENT
11
PARTICLES
12
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13
Värskemad uudised CMS installeerimine
NEW
14
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16
ATLAS BARREL DETECTOR
17
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20
Leading Proton Detection
147m
180m
220m
0m
308m
338m
420 430m
D2
Q4
Q5
Q6
Q7
B8
Q8
B9
Q9
B10
B11
Q10
IP
?
?
?
D1
?
?
?
Q1-3
?
?
?
?
?
x 0.02
?
?
Jerry Risto
21
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22
Configuration of the Experiment
Aim at detecting colour singlet exchange
processes with the leading protons scattered at
small angles with respect to the beam.
Roman Pot Station at 147 / 220m
Roman Pot Station at 147/220m
CMS
T1
CASTOR?
T1
T2
T2
CASTOR?
ZDC
ZDC
What is the CMS?TOTEM detector configuration?
CMS?TOTEM Meeting
Risto Orava
CERN 23.9.2005



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26
The Roman Pot unit
  • Three measurement pots two verticals, one
    horizontal
  • Integrated beam position monitor
  • Interconnection bellow between horizontal and
    vertical pots
  • Vacuum compensation system interconnected to the
    machine vacuum
  • Individual stepper motors to drive the pots
  • Adjustable jacks to align the RP unit in the
    tunnel

27
Roman Pot pre-series delivered and mounted
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32
3D Detectors and Active edges
S. Parker, C. Kenney 1995
3D TECHNOLOGY E-field line contained by edge (p)
electrode EDGE SENSITIVITY lt10 mm
Side view
  • EDGE SENSITIVITY lt10 mm
  • COLLECTION PATHS 50 mm
  • SPATIAL RESOLUTION 10-15 mm
  • DEPLETION VOLTAGES lt 10 V
  • DEPLETION VOLTAGES 105 V at 1015n/cm2
  • SPEED AT RT 3.5 ns
  • AREA COVERAGE 3X3 cm2
  • SIGNAL AMPLITUDE 24 000 e before Irradiation
  • SIGNAL AMPLITUDE 15 000 e- at 1015n/cm2

50 mm pitch
Top view
Pictures of processed structures Brunel, Hawaii,
Stanford 2003
33
3D DETECTORSMAKING OF THE HOLES
  • Deep, reactiveion etchings to produce HIGH
    ASPECT RATIO of over 181, near vertical holes.
    The fabrication of 3D structures depends on the
    capability of etching narrow holes with high
    precision in the silicon bulk.
  • Deep reactive ion etching has been
    developed for Micro-Electro-Mechanical Systems
    (MEMS).

Photo of the plasma (violet colour) from the
porthole of the STS (Surface Technology Systems)
while etching a silicon wafer
34
KEY STAGES THAT MAKE THIS TECHNOLOGY POSSIBLE
3D process consists of gt 100 steps
  • WAFER BONDING
  • (mechanical stability). After
  • complete processing this support
  • wafer will be removed.
  • 2. PHOTOLITHOGRAPHY
  • 3. MAKING THE HOLES
  • 4. FILLING THE HOLES
  • 5. DOPING THE HOLES AND ANNEALING
  • 6. METAL DEPOSITION

35
READOUT ELECTRONICS VFAT128
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Detector Control Systems
40
CERN PHYSICS GRID
41
Näited rakendustest
The Medipix2 ASIC is a high spatial, high
contrast resolving CMOS pixel read-out chip
working in single photon counting mode. It can be
combined with different semiconductor sensors
which convert the X-rays directly into detectable
electric signals. This represents a new solution
for various X-ray and gamma-ray imaging
applications
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