RFID Flipchip Die Bonder

1
RFID Flip-chip Die Bonder

• JAF

Specifications Die Size 0.5mm0.5mm5mm5mm Die
missing detect retry function Bonding Accuracy
20µm2 RFID-UPH 4000 WAFER Size Max
12inch Size 2900(W)1200(D)1750(H) weight 2100
KG Air Pressure 0.5 MPa Voltage 220
VAC Power 2800 W
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Flip-chip Die Bonder
Hot-press

• JAF

SS-DZ01
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Material Tape System
The max width of material tape is 300mm, and this
system has the suit to width function, equipped
with servo motor and electronically controlled
damping for tape buffering, it makes the
processing continuously
4
Dispenser
Dispenser is driven by 3 motors in 3 axes Y axis
driven by linear motor X axis driven by lead
screw Z axis driven by coil motor ? Adopting
Double axes high speed grating feedback system
for getting high accuracy Standard dispenser
equipped
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WAFER

• JAF

The Max size 12inch Automatic WAFER expander,
equipped With dry heater before expanding x-y-
axes driven by linear motors
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Bonding System

• JAF

Bonding system is driven by 3-axes motor, Y
axis driven by line motor X axis driven by lead
screw Z axis driven by voice coil motor ? R
axis using precise step motor for deviation
rectification ? This system suits to the high
speed matrix leadframes loading. Z auto teach
function VC motor in Z axis provides accurate
bonding and picking pressure? Equipping high
accurate grating improves bonding accuracy to a
high level?
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Vision System

• JAF

Adopting two main vision systems, one for wafer
location control and die location
rectification, Another one for live produce
inspection?
Adding one more vision system for upward
recognition and location, It improved the bonding
accuracy this system equipped linear motor has
the function of multipoint locating and reducing
the offset for each point.
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Flip-chip System

• JAF

Adopting servo motor for flipping, Using two
micro linear motor for die picking in Z axis.
Picking pressure is adjustable
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Work platform

• JAF

Equipped one whole piece of marble as basis for
absorbing the vibration ,and improving accuracy
10
RFID Flip-chip Devices

• JAF

Adopt 25 independent thermal pressure head ,
Temperature collecting ?heating and pressure
adjusting are working separately, The consistency
of thermal pressures quality and condition got
highly improved
Following delivery
Silicon paper separating