JWG 9

1
JWG 9

• A joint working group with IEC TC3
• Application Protocols
• ISO 10303-2102001Electronic assembly
  interconnect and packaging design
• ISO 10303-2122001Electrotechnical design and
  installation
• ISO/PWI 10303-220Printed circuit assembly
  process planning

2
AP210 second edition (1)

• Extensive implementations have identified a
  number of inconsistencies and shortcomings
• Restructuring and refinement parts of the ARM
  model
• Ensured fully consitent ARM - AIM mapping
• No scope change
• Actual document JWG9-N070 (WD 32 of the PDES
  Inc. electromechanical pilot project)

3
Actual AP210 Implementations

• PCB-CAD
• Mentor Graphics - BoardStation
• Zuken - Visula
• CAD-Soft - EAGLE
• Viewer (Editor)
• Boeing
• STEP-Book AP210
• Component modelling tool ...

• M-CAD
• IDF
• AP203
• CAM
• Gerber
• Manufacturing analysis process
• Functional
• VHDL, IEEE 1076
• EDIF 200

4
AP210 second edition (2)

• The AP210 project team intents to publish the2nd
  edition as a Minor Amendment(avoiding a NWI)
• Future plans (3rd edition)
• Extend for intelligent schematics
• Work with AP233 (systems engineering) to maximize
  AP210 re-use
• Modularisation

5
IEC - TC93

• IEC 61182 (1994-99) series (old IPC-D-350 and
  IPC-356)
• IEC 616902000 EDIF
• JWG 11 (with IEC TC 91)Digital descriptions of
  completely designed printed boards and printed
  board assemblies with emphasis on the
  manufacturing requirements of the final product.
• IPC 2510 series, GenCAM (IEC/PAS 62119)
• Goal to initiate a new IEC standard to replace
  GenCAM PAS with an XML based format
• IEC/FDIS 62016 Core model of the electronics
  domainBallot close on 2003-03-28
• Big overlap with ISO 10303-210

6
Actual AP212 Implementations

• ECAD-Implementors Forum (www.ecad-if.de)
• Focus on cable harness for car electric
• Data dictionary
• High Level Interface
• IDA-STEP project (www.ida-step.com)
• Focus on schematics and factory electrification
• EPLAN 5 converter
• STEP-Book AP212 viewer