Title: Simulations of Radiation Damage in 3D detectors
1Simulations of Radiation Damage in 3D detectors
2Radiation damage in ISE-TCAD
- Trap models have been taken from work done at
University of Perugia - Most recently, Numerical simulation of radiation
damage effects in p-type and n-type FZ silicon
detectors, IEEE Trans. Nucl. Sci. vol. 53, pp.
2971-2976, 2006. - Trap models were initially based on direct
measurements of traps from DLTS etc., then trap
concentrations cross-sections were tuned to
match macroscopic experimental results.
3Reproducing results planar detectors
- The experimental results used in the paper were
current, depletion voltage and CCE tests on
p-type, oxygen-free FZ planar detectors - Oxygenated detectors could give better
performance. M. Petasecca did a presentation on
oxygenated p-type sims at last RD50, but this
isnt published yet. - The physics models used consider oxide charge as
well as bulk traps, but avalanche breakdown was
not included. - To start with, I worked to reproduce the results
shown in the paper
4Reproducing results IV / depletion
5Reproducing results - CCE
6Traps in full-3D detectors
- Simulated full-3D detectors up to 1016neq/cm2.
- Detectors are
- P-type substrate (71011cm-3)
- N column readout
- 55µm pitch
- 300µm thick
7I-V results still show reasonable Vdepletion
32V
16V
6V
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9Charge collection simulation
- What about variation in charge collection with
position? - In most of the following simulations, flooded the
entire pixel with uniform charge as a test of the
average CCE - Have also considered variation with horizontal
position for one case
10Charge collection simulation
Increasing radiation damage reduces the output
pulse, but the pulse shape isnt greatly affected
11Charge collection simulation
Simulation predicts gt50 CCE after 1016neq/cm2
12Horizontal position and CCE
- A series of simulations tested the variation in
CCE with horizontal position - Carrier drift is horizontal, and E-field varies
with horizontal position - Particles passing vertically through the detector
were simulated for 15 different positions with
both zero and 1016neq/cm2 damage (100V bias) - With zero damage, simulations give uniform CCE
(within 2) for each simulation - Exception charge collection reduced within
electrodes
13The MIP simulations map out the pixel reasonably
well. By symmetry, the results can be extended
to the top-left section of the pixel.
14These results show the highest CCE for MIPs
arriving around the n readout column, and a
decrease in CCE towards the p bias column.
15Alternative 3D structures
Alternative square layout
Hexagonal layout
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18Alternative structures - CCE results
Neither alternative structure shows better
performance than the standard structure after
radiation damage. Depletion voltages are also
much the same as the standard structure
19ATLAS 3D devices
- 3D ATLAS devices were tested for CCE after
irradiation by Cinzia da Via et. al. - N readout
- 230µm-thick substrate, high-resistivity n-type
- Each 50µm400µm pixel has 3 n columns, shorted
together - In effect, we have three elongated 50µm133µm
sub-pixels, giving a much larger electrode
spacing than in the simulations so far. - Simulated this device geometry
- Used a p-type substrate in simulation not a
match to the real detectors in the undamaged
case, but after damage the n-type substrate will
type invert.
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21ATLAS 3D devices
- Simulated depletion voltages
- Higher for this structure than in previous
simulations, due to greater electrode spacing - 100V for 8.61015neq/cm, compared to 35V for
1016neq/cm for 55µm-square pixel - CCE tests
- The bias used in the experimental tests was
increased from 60V to 160V as the radiation
damage increased. The biases in the CCE tests
were chosen to match this - For each simulation, the bias was 50V higher
than the full depletion voltage
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23ATLAS 3D devices
Simulated charge collection is lower than the
experimental results In simulation, reducing the
electrode spacing improves collection greatly
24Other simulation work 3D-STC strip detectors
253D-stc strip detectors
- Have done simulations of 3D-single-type-column
strip detectors, rather than just pixels - Simulated devices have 2 strips with strips of
p-stop between them, matching the devices tested
at Freiburg.
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27Strip 3D-stc effect of p-stop
- Change in electric field around p-stop means
holes generated just below the surface will drift
to the p-stop, rather than back surface
28Simulation of laser pulses
- Freiburg tested the variation in detector
response with position using an IR laser - The laser pulses were approximated by a linearly
decaying track of charge, 100µm long, moving from
the front surface down into the substrate - In practice, laser beam should decay
exponentially with distance - Since 2 strips were used, the readout currents at
both neighbouring strips were simulated
293D-stc example of two signal pulses
Fast pulse from electron collection polarity
depends on laser position
Slow pulse from hole collection polarity is the
same regardless of position
303D-stc Charge from laser pulses
Laser pulse before mid-point of strip
Large dependence on integration time
Laser pulse arrives past mid-point of strip
313D-stc Charge from laser pulses- 20ns
For a short (20ns) integration time, mainly see
electron collection signal
32Total charge seen on both strips
Missing charge matches region where p-stop
alters field pattern