Irvine Sensors

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3-D Chip Stacking to BuildCameras, Computers
Small Business Innovation Research
Irvine Sensors Corporation
Costa Mesa, CA
INNOVATION 3-D stack technology for different
types of integrated circuit s that can provide
sugar cube size cameras
ACCOMPLISHMENTS ?Produced neo-wafers by potting
chips that can be thinned and stacked ?
Re-routing the electrical connections so that
electrical connections can be made along the
stacked edge COMMERCIALIZATION ? 3-D stacking
technology basis for 1.0 million contract with
Boeing for miniature computer (mobile voice
activated computers for soldiers) ? Incorporating
in infrared cameras for commercial market ?
Complex systems for portable electronics
3-D Stacked Module from Different Integrated
Circuits
GOVERNMENT/ SCIENCE APPLICATIONS ? Various NASA
missions requiring highly integrated instruments
such as the Mars landers and rovers
1993 Phase II NAS7-1374 NASA/JPL Contact -
Bedabrata Pain Company Contact - David Ludwig
Jet Propulsion Laboratory Success Story 7-012
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INNOVATION 3-D stack technology for different
types of integrated circuits that can provide
sugar cube size cameras