Fermilab PMG Meeting - PowerPoint PPT Presentation

About This Presentation
Title:

Fermilab PMG Meeting

Description:

Recommendation: The KSU facility's dosimetry needs to be fully understood and ... Tim Bolton's talk will address the dosimetry. ... – PowerPoint PPT presentation

Number of Views:17
Avg rating:3.0/5.0
Slides: 14
Provided by: marce208
Category:

less

Transcript and Presenter's Notes

Title: Fermilab PMG Meeting


1
Response to Committee Comments on Outer Layer
Sensor Review
DØ Inner Layer Sensor Production Readiness
Review August 08, 2003 M. Demarteau, G.
Ginther
2
Sensor Specifications
  • sensor specifications were well designed and
    sufficient however, several issues arose which
    need to be clarified in discussions with
    Hamamatsu Photonics (HPK) Recommendation Make
    revisions to the specifications as appropriate
    based on the following points
  • The specification for the detector full depletion
    voltage is Vdep lt 300 V. The absence of a lower
    limit could lead to large, undesirable mismatches
    between detectors in the tracker. A lower limit
    of Vdep gt 40 V seems appropriate, but should be
    discussed with HPK to ensure no impact on cost.
  • The recommendation to specify a lower limit for
    the detector full depletion voltage of 40 V has
    been adopted and the specifications have been
    adjusted accordingly.
  • Comment from Hamamatsu 1) specificationsa) The
    change about 40V lt Vdep lt 300V is not a problem
    for us.

3
Sensor Specifications
  • The specification of wafer warp less than 25 mm
    is too stringent, and in practice it may be too
    difficult to achieve. This specification was not
    met for the prototype sensors. DØ should
    understand what the real specification should be.
    The final sensor warp might be less once the
    sensor is glued down. This should be investigated
    and quantified.
  • The specification of wafer warp has always been
    on a best effort basis with Hamamatsu. For the
    Layer 1 sensors Hamamatsu has shown that it can
    achieve wafer warps that are within our 25 mm
    window. Our prototype modules show that we can
    tolerate wafer warps of 50 mm. We communicated
    our warp requirements to HPK We have relaxed
    the sensor warp to 100 mm, that is that the
    sensor has to fit within two parallel planes 100
    mm apart. We would like to view this as an upper
    limit if a sensor has a larger warp we reserve
    the right to reject the sensor. We continue to
    work with Hamamatsu on a best effort basis for
    wafer warp, to emphasize that wafer warp is a
    critical parameter for us.
  • Comment from Hamamatsuc) The chip warp should be
    within 100 mm max. on the prototypes. Do you have
    the measured data on it ? If so, provide the
    same with us, please.

4
Sensor Specifications
  • Stave height along the length of the stave
    Note, current tooling for stave assembly not
    very flat.

75 mm
5
Sensor Specifications
  • HPK will not do whole-wafer visual inspections
    for open-circuits or short-circuits, so this part
    of the specification should probably be deleted.
  • The experience with Hamamatsu is indeed that they
    are confident enough in the quality of their
    product that they deem whole-wafer visual
    inspections for open-circuits or short-circuits
    at the company redundant. Given that Hamamatsu
    has accepted this requirement we consider it
    prudent to leave it as part of our
    specifications. Recent quality assurance
    measurements of the CMS collaboration reinforce
    our notion that quality assurance at the vendor
    should be emphasized.

6
Sensor Specifications
  • The mask alignment specification (2.5 mm) is not
    stringent enough. Mask alignment of 0.5 mm
    should be achieved in order to ensure proper
    metal-implant overlap.
  • Our response to committee The recommendation to
    make the mask alignment specification of 2.5 mm
    more stringent was adopted. The prototype sensors
    show that Hamamatsu is able to achieve a mask
    alignment to better than 0.5 mm, and that is our
    new specification.
  • Response from Hamamatsu mask alignment
    tolerance of /-0.5um is very tough for us. Could
    you kindly accept the /-2um tolerance although
    the most pcs should be covered by about /-1um
    tolerance ?
  • We accepted their proposal. We now also receive
    test structures with alignment marks on them.

7
Sensor Specifications
  • The average coupling capacitance was 105 pF,
    about 12 pF below the minimum specification. The
    measurement should be checked - the reason why
    the specification was not met should be
    identified and corrected, or the specification
    should be revised.
  • The coupling capacitance measurements shown at
    the review were taken at 10kHz. The full
    frequency dependence of the coupling capacitance
    was measured and a low frequency limit of 140 pF
    was obtained, which is well within our
    specifications. (more results today)

8
Sensor Testing and QA
  • Our testing seemed to indicate more bad channels
    than identified by HPK. Recommendation Discuss
    the discrepancies as soon as possible with HPK to
    understand the cause for each discrepancy. This
    will ensure the integrity of the HPK
    measurements, which are relied upon for
    identifying bad strips for the majority of
    sensors.
  • Those sensors that showed many more defects in
    our own QA tests than at Hamamatsu were
    re-measured at Fermilab. It was found that some
    of the flaws previously identified were a result
    of a bad contact between the probe and the
    sensor.
  • After the review, the QA program at the testing
    centers was reviewed and some significant
    shortcomings in the setup were identified and
    rectified. Results on site qualification and
    comparison will be shown today
  • Only two sensors showed defects that were not
    identified at Hamamatsu. Those results have been
    communicated to the vendor.
  • HPK response 29) We are afraid they are
    scratches made after our pre-shipping test.5)
    Regarding increase of pinhole at your test from
    ours, complete elimination is unlikely in
    consideration of an insulation layer's life. In
    fact, higher voltage than 80V (say 100 to 120V)
    is applied on our inspection, which should be
    useful for a screening purpose. Incrase of
    pinhole of a few channels may not be avoided.

9
Irradiation
  • Recommendation The KSU facilitys dosimetry
    needs to be fully understood and sensors should
    be irradiated at alternative facilities with
    well-understood dosimetry The post-irradiation
    measurements need to be re-examined and fully
    understood.
  • Tim Boltons talk will address the dosimetry. For
    the previous PRR the area of an L1 sensor was
    mistakenly used in the normalization of the flux
    (see Boltons talk). We have not performed a
    cross-check of the results at alternate
    facilities, but rather have performed a cross
    check of copper foil activation measurements at
    Fermilab
  • Updated results for outer layer sensors made
    available for this PRR
  • Results from irradiation of Layer 1 sensors to be
    presented today, with new dosimetry calibration.

10
QA
  • Recommendation Identify a physicist who is
    experienced with sensor device testing and
    properties to be responsible for the overall
    testing and QA program. This physicist should
    spend a significant fraction of his/her time on
    sensor QA, full-time if needed. Consistency of
    measurements between the different facilities
    should be ensured by selecting a subsample of
    detectors and comparing the results of the same
    QA tests performed at each facility.
  • Mme. Mao and Ralf Bernhard will be full time
    dedicated physicists to the overall sensor
    testing and QA. More details in QA talk.
    Consistency of measurements between various
    facilities has been addressed (see McCarthys
    talk).

11
SVX4 Noise Performance
  • Recommendation Perform refined SVX4 noise
    studies with prototype modules using 396 ns
    crossing time electronics to understand issues
    like setup noise and post-irradiation shot noise.
    We recommend DØ get together with CDF to
    understand the SVX4 noise behavior.
  • After the review the noise measurements were
    revisited and results communicated to CDF. We
    continue to perform noise measurements with
    modules and irradiated modules exploring the full
    parameter space.

12
Database
  • Recommendation DØ should investigate if the
    database selected will serve the upgrade project
    smoothly through the entire project cycle. We
    recommend that this be done together with CDF and
    that databases of ongoing projects (CMS, ATLAS,
    GLAST) be investigated if the present choice is
    found deficient.
  • Response Old database relied on student in
    computing department at UIC. Concerns about long
    term stability, support and flexibility motivated
    us to adopt the ATLAS database design with full
    support from the Dzero online group. Please see
    todays QA presentation

13
Hamamatsu Delivery Schedule
  • Recommendation Obtain a firm commitment of the
    delivery schedule from HPK to clarify the
    delivery rate for each month of the project
    duration.

Dzero Schedule
CDF Schedule
Write a Comment
User Comments (0)
About PowerShow.com