Challenging Technology: Detectors Beyond the LHC

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Challenging Technology Detectors Beyond the LHC

• Craig Buttar
• Higgs-Maxwell Meeting Feb 06

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Examples ATLAS SCT
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Future of Particle Physics in a nutshell

• Luminosity upgrade of LHC (sLHC)
• H self couplings ? precision tracking in high
  multiplicity environment
• Radiation hardness x10 cf LHC
• Large scale production
• LHCb upgrade
• Velo replacement required after 3 years
• LHCb data taking limited to 1/50th of design
  luminosity
• Make better use of LHC luminosity ? improve rare
  decay limits test new physics
• Precision physics at ILC
• Higgs couplings, SUSY (Higgs) mass spectrum..
• High resolution vertexing for flavour tagging
• High resolution tracking calorimetry based on
  energy flow
• The neutrino sector
• Unravelling the neutrino mass matrix
• Large scale detectors
• Beam systematics

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sLHC

• Luminosity upgrade for ATLAS-SCT
• Tracking and b-tagging
• Design issues
• layout
• occupancy
• radiation damage

50mm pitch
Pixels r6cm, 15cm, 24cm Ministrips r35cm,
48cm, 62cm Microstrips r84cm, 105cm
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Si technologies for sLHC
n-in-p

• Si Traditionally use p-in-n detectors but cannot
  operate underdeplented
• Use n-in-p as no type inversion
• Production issues
• HV required, careful design to avoid breakdown
• Use Cz based n-type Si
• Does not invert (?)
• Now a common material in Si manufacture
• Harder to charged particles? best for
  intermediate radii or pixels

-
Ionisation in oxide?high field regions
P
-
-
current from cut edges
-
-
P-type Si
Displacement damage cluster n?p increased dark
current
CCE is now an issue
guard region
Detector region
ionisation?signal
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3D detectors
W3D20mm W2D300mm
ve
ve
-ve
SiO
2

p

• 3D uses MEMS technology to engineering Si
  structures
• Smaller detector cells
• Lower depletion voltages
• Faster and more efficient charge collection
• BUT small-scale suitable for LHCb upgrade
• For 4.5 x 1014 24GeV/c p/cm2
• (2.7 x 1014 1MeV n/cm2)
• 2 years LHCb Velo inner radius
• Depletion voltage 19V
• Type inversion observed

h

h
Bulk
E
n
W2D
-
e
-
e
W3D

n
ve
E
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Other issues for sLHC

• Cooling
• Thermal runaway
• I ? Power dissipation ? T
• To avoid thermal runaway need to have edges a
  -30oC to dissipate heat and keep temp low
• Current technology has a coolant temperature of
  -30oC to give 7oC at LHC
• Low mass cooling with robust minimum mass pipes
• Large scale production
• SCT area 60m2 ?210m2
• Electronics 6M ? 60M channels
• Need close links with industry for mass
  production of components and assembly?

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LHCb upgrade triggering at LHC lumi

• Factor five higher lumi
• Cope 3-4 interactions per beam crossing
• Muon trigger fine
• 4 of 10 benchmark channels have ??- in final
  state
• Hadron Trigger bandwidth saturates
• Need displaced track trigger at first trigger
  level

• FPGA based Triggering system
• Pattern recognition / tracking
• Primary Vertex Identification
• Displaced Track Trigger
• 4?s latency

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Vertex detectors for ILC

• Physics requirements
• Identify b and c-jets and jet-charge
• Momentum resolution s(1/pT) at 100GeV 4-5TeV-1
  (ATLAS 100TeV-1) important for energy flowsee
  later
• Detector requirements
• Very low mass
• High resolution sip3mm ? 20mm pixels ? 109
  channels ? reduces occupancy
• Beam structure ? readout every 50ms 20 times
  during 1ms train
• Data readout possible em interference
• Data stored -- readout during 0.2 between
  bunches
• Radiation hardness less of an issue

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ILC vertex detectors

• CCDs
• Used in linear collider at SLAC -- SLD
• Precision but readout speed is slow as reading
  out each column and then row
• Readout each column CPCCD
• First prototypes CPC1 by LCFI
• Readout at 25MHz
• RF pickup from beam is a worry!

CPC1 RO chip (Bump bonding Packaging and
interconnects)
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Detectors with storage ISIS and MAPS

• ISIS In-situ Storage Image Sensor
• Store charge in 20-element CCD
• Readout during 0.2s between bunches
• Solves potential RF problem and is more radiation
  hard
• But processing has to be demonstrated
• Monolithic Active Pixel sensors
• CMOS imaging technology
• Smaller active volume
• Requires development of on-chip memory

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Calorimetry for the ILC

• Need to resolve W and Zs
• Requires best achieved at LEP
• Need to measure energy flow in the event
• Match charged tracks to clusters
• Measure neutral clusters in calorimeter
• ? good spatial resolution more important than
  energy resolution!
• Leads to a number of technical issues
• Readout density and getting data out of the
  calorimeter 0.3-3GBytes/s per ASIC, 200TByte/s
  total ECAL
• Achieving the required spatial resolution -- MAPS
• Managing the thermal load

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Neutrino factory

• Golden channelmuon appearance
• Requires MINOS like detectors but x10 larger
• The large volume leads to problems with reading
  out scintillator (10m)
• But need to understand the beam!

wrong sign muon
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Neutrino factory

• Near detector
• Need to measure flux and charm background rates
  for measurements at far detector
• Use active target
• Large area coverage required (18 layers covering
  50x50cm2
• Use MAPS
• 2D readout
• Cheap large area coverage

Si tracker in NOMAD
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Not covered

• Development of technologies for PP is as active
  as ever
• Too many to cover!
• Some topics not covered (still only a selection)
• Rad-hard readout chips for sLHC
• Development of ionisation cooling for nufact
  MICE _at_ RAL
• Fast feedback systems for ILC to optimise
  luminosity
• Low background detectors for Dark Matter searches
  and neutrinoless double beta decay
• Precision physics at LHC (FP420) Small scale
  tracking detectors able probe the edge of the
  beam
• ..

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Other applications

• Particle physics technology has found
  applications in
• Radiotherapy
• Imaging

2 mm
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Summary and conclusions

• Future Particle Physics experiments has many
  challenges for detectors and systems
• Rad-hardness
• Speed
• Precision
• Large scale production
• Connections
• System building detectorsreadout?modules?subsyste
  ms
• Data handling

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Backup
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LHCb Upgrade Why ?

• LHCb uses only 1/50th of LHC design luminosity
• Average of one interaction per beam crossing
• Limit Radiation damage
• Many physics results would benefit from higher
  luminosity, e.g.
• Rare B decays
• Clear Benefit
• e.g. Bs???-
• SM BR 3.5 x 10-9 , 3.7 ? after 3 (107 second)
  years
• ?
• Not theoretically limited after 3 (107 second)
  years
• More (clean) events would help !

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LHCb Upgrade -Technically Feasible?

• Radiation Hard Silicon Technology Developed

• Czochralski Silicon
• n-on-p
• 3D detectors
• Hybrid Pixels

Priority only if large Dms

• Construct a Vertex Detector with
• better proper time resolution
• withstand 10 times more radiation damage
• First Velo need replacement 2011

1015 1 MeV neutron equiv. /cm2
VEtex LOcator
VELO Superior Performance Apparatus
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New Triggering Strategy

• Factor five higher lumi
• Cope 3-4 interactions per beam crossing
• Muon trigger fine
• 4 of 10 benchmark channels have ??- in final
  state
• Hadron Trigger bandwidth saturates
• Need displaced track trigger at first trigger
  level

• FPGA based Triggering system
• Pattern recognition / tracking
• Primary Vertex Identification
• Displaced Track Trigger
• 4?s latency

8
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Plan

• Rad. Hard Sensors being produced
• Prototype VELO modules and Trigger 2009
• Upgraded VELO displaced vertex trigger 2011

• 6 mask designed
• MCz, n-on-p, pixels

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Physics case for future neutrino facilities

• Neutrino oscillations for atmospheric, solar,
  reactor neutrinos provide fit to q23, q12, Dm122
  and Dm232
• Need more experiments for q13, mass hierarchy and
  CP violation phase d

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Super-beams

• Super-beams (ie. JPARC beam for T2K) provide
  monochromatic off-axis neutrino beams for ne
  appearance

Goal T2K down to q132-30

• Proposals for super-beams with Mton Water
  Cherenkov detectors (Memphys in Frejus,
  HyperKamiokande Japan, UNO in USA)

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Beta-beams and neutrino factories

• Beta-beam facility

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Oscillation signatures

• Golden channel at a NuFact wrong-sign muons

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Near Detector

• Near detector control flux, systematics,
  maeasure cross-sections, charm backgrounds for
  oscillation signals, .

• nm CC event

• Use silicon detectors for vertex (prototype in
  NOMAD)
• 109 n interactions per year in 50 kg!!!
• Monolithic Active Pixel (MAPS) fully active
  neutrino target

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Physics reach neutrino factory

• Sensitivity to d-q13 best for neutrino factory
  (except at high q13, in which matter effects
  dominate).

P. Huber et al.
High-g b beam not included Performance
comparable to Nufact (Burget et al.)
First oscillation maximum only
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Introduction to 3D detectors

• Co-axial detector
• Arrayed together
• Micron scale
• USE Latest MEM techniques
• Pixel device
• Readout each p column
• Strip device
• Connect columns together

Proposed by S.Parker NIMA 395 pp. 328-343(1997).
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Operation
-ve
-ve
-ve
ve
ve
-ve
SiO
2

p

h

h
Bulk
E
n
W2D
-
e
-
e

n
W3D
Equal detectors thickness W2DgtgtW3D
ve
E
Carriers drift total thickness of material
Carriers swept horizontally Travers short
distance between electrodes

• Low full depletion bias
• Low collection distances ? High CCE
• Fast

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Two methods to form pores

• DRIE
• So far, maximum aspect
• ratio 181 (depth 183µm)
• Modification to standard equipment to obtain deep
  narrow parallel walled pores
• In conjunction with STS

• Electro-chemical etching
• maximum aspect ratio 301
• (depth 440 µm, ?14 µm)
• 24 hours per wafer
• Cheap

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Results - IV of devices

• Good rectifying np junction formed
• Oxide as diffusing barrier isolates individual
  cells
• RIE removal of top surface caused increase in
  current after -10V

Glasgow 3D detector
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Results - Proton irradiation

• High res n-type silicon, 85?m pitch,
  close-packed hexagonal pixels
• Irradiation with 24 GeV/c protons at CERN
• 7 fluences from 5 x 1012 to 4.5 x 1014 24GeV/c p
  /cm2

For 4.5 x 1014 24GeV/c p/cm2 (2.7 x 1014 1MeV
n/cm2) 2 years Velo inner radius Depletion
voltage 19V Type inversion observed
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For fab simplification
3D-stc detectors proposed at ITC-irst 2
electrons are swept away by the
transversal field
n electrodes
50 ?m
p-type substrate
n

electrodes
0 V
0V
0V
-5 V
-
5V
-
5V
-
-
-
-
-
-


-
-
potential distribution vertical
cross-section between two electrodes
-
-
holes drift in the central region and diffuse
towards p contact




-8 V
-
8V
-
8V
Uniform p layer
Uniform/grid
-
patterned
-
-
-
-20 V
ionizing particle
Recently, Semi-3D radiation detectors with p
columns in n-type substrates were proposed by
Eränen et al. 3

• 2 C. Piemonte, M. Boscardin, G.-F. Dalla Betta,
  S. Ronchin, N. Zorzi, Nucl. Instr. Meth. Phys.
  Res. A 541 (2005) 441
• 3 S. Eränen, T. Virolainen, I. Luusua, J.
  Kalliopuska, K.Kurvinen, M. Eräluoto, J.
  Härkönen, K. Leinonen, M. Palviainen and M.
  Koski, 2004 IEEE Nuclear Science Symposium,
  Conference Record, paper N28-3, Rome (Italy),
  October 16-22, 2004

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Mask Layout-Test structures
Standard (planar) test structures
10x10 matrix
3D-Diode
Ø hole 10 µm
44 holes GR
p-stop 20 µm
Ø implant 44 µm
Pitch 80 µm
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Backplane full-depletion-voltage
Preliminary 3d-diode/back capacitance
measurements
C-V
Lateral depletion contribution to measured
capacitance at low voltages
Linear 1/C2 vs V region corresponding to the same
doping level of planar diodes
Saturation capacitance corresponding to a
depleted width of 150µm) ? Column depth 150µm
1/C2-V
40V full depletion voltage (300µm wafer)
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S/N for HEPAPS2
Test beam at HERA
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FAPS RAL group

• FAPS could be extended to a full 20 samples
  per train, stored in pixel
• If this doesnt fit with 0.25 mm CMOS, will
  surely be OK with 0.13 mm
• Idea is to relax the requirement for fast,
  precise, signal transmission to chip periphery
  during train, and so render long columns
  feasible, with all processing logic outside the
  detector active volume, as for the CCD
  architecture
• Test devices implemented using a 0.25 mm
  process TSMC(imaging)

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FAPS resolution
13um hit resolution