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Applying Precision Air Conditioning Systems

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Title: Applying Precision Air Conditioning Systems


1
Applying Precision Air Conditioning Systems
  • Canatal International Inc.

2
Introduction
  • Application of Precision Air Conditioning
  • Data Centers
  • Switching Stations
  • Co-Location Facilities

3
Topics of Discussion
  • Servers / Switch Gear
  • Temperature Humidity Control
  • Air Distribution
  • Redundancy
  • Alternating Cold Aisle, Hot Aisle
  • Perforated Tile Capacity
  • Design Planning Stage
  • Maintenance

4
Servers / Switch Gear
  • Smaller, More Powerful
  • Driven by semi-conductor capacity
  • More transistors on a chip
  • More power consumption per chip
  • More heat generation

5
Servers / Switch Gear
  • Published Power Rating may expect future
    upgrades, higher energy consumption and greater
    heat rejection
  • Initial power consumption and heat generation can
    be lower

6
New ASHRAE Document
  • Thermal Guidelines for Data Processing
    Environments
  • Equipment Environment Specifications
  • Facility Temperature Humidity Measurement
  • Equipment Facility Layout
  • Equipment Manufacturers Heat Airflow Reporting

Available _at_www.ashrae.org, Item Number 90431, or
D90431
7
Thermal Guidelines for Data Processing
Environments
  • Equipment Environment Specifications

8
Thermal Guidelines for Data Processing
Environments
  • Equipment Environment Specifications

9
ASHRAE Class 1 Operating Conditions
10
ASHRAE Class 1 Operating Conditions
Increase Equipment Failures
11
ASHRAE Class 1 Operating Conditions
Increase HVAC Energy Use
12
Thermal Guidelines for Data Processing
Environments
  • Facility Temperature Humidity Measurement

13
Thermal Guidelines for Data Processing
Environments
  • Equipment Facility Layout
  • Recommended Airflow Protocol for Computer
    Equipment

14
Thermal Guidelines for Data Processing
Environments
  • Equipment Facility Layout
  • Recommended Airflow Protocol for Computer
    Equipment

15
Thermal Guidelines for Data Processing
Environments
  • Equipment Facility Layout
  • Recommended Airflow Protocol for Computer
    Equipment

16
Thermal Guidelines for Data Processing
Environments
  • Equipment Manufacturers Heat Airflow Reporting

17
Server / Switch Gear
1U (1.70 H) Server
Back View
Front View
18
Server / Switch Gear
2U (3.50 H) Server
Back View
Front View
19
Server / Switch Gear
4U (6.80 H) Server
Front View
Back View
20
Server / Switch Gear
5U Server Tower Configuration
Front View
Back View
21
Server / Switch Gear
Front View
Back View
22
Heat Density Trends
Source Uptime Institute
23
What is wrong with this picture?
24
What is wrong with this picture?
2
2
1a, 1b Cold aisles. 1a has less airflow then 1b - WHY?
2 Hot aisles
3 Top of hot aisle (from right to left warm to hot)
4 Insufficient cold air and recirculation from hot aisle to cold aisle
5 Mixed return air path
25
  • External re-circulation
  • Top 1/3 portion likely to have higher failure
    rate

26
  • Internal re-circulation
  • Add blanking panels to eliminate the problem

27
Positioning of PAC units
  • Parallel or Perpendicular to aisles

28
Temperature Control
  • Challenges
  • Hot Spots / Hot Zones / Hot Room
  • Uneven heat load on the floor space
  • Fluctuating heat loads
  • Initial low loads

29
Temperature Control
  • Servers/Switches generate sensible heat
  • Utilize Precision Air Conditioning Systems with
    high sensible heat ratios
  • Unwanted dehumidification is a waste of energy
    and money

30
Humidity Control
  • Independently operated units will fight-
    simultaneously humidify and dehumidify
  • Wasting energy and money
  • Units should work together as a Team

31
Air Distribution
  • Raised Floor System
  • Generally more flexible
  • Easy to move perforated tiles
  • Overhead System
  • Ducted or Plenum
  • Make the last length of duct flexible to enable
    movement of discharge grilles

32
Air Distribution
  • Deliver Cool Air to the Heat Source
  • Eliminate Short Circuiting
  • Anytime air returns to the PAC without passing
    through heat generating servers, routers,
    switches etc.

33
Air Distribution
  • Short Circuiting - Common Causes
  • Obstructions to airflow
  • Air Leakage
  • Location of discharge grilles and perforated tiles

34
Air Distribution Obstructions
  • Raised Floor System
  • Electric cable trays, especially with shallow
    floor heights
  • Water damp

35
Air Distribution Obstructions
  • Practice Recommendations for Position Equipment
    Racks Cabinets
  • Power Distribution Unit (PDU) cables should run
    under the Cold Aisles
  • Cable trays for telecom cablings should locate
    under the Hot Aisles
  • Cabinet should be aligned with one edge along the
    edge of the cold aisle floor tile
  • Floor tile cuts should be no larger then
    necessary to minimize air pressure loss

36
Air Distribution Obstructions
  • Practice Recommendations for Position Equipment
    Racks Cabinets
  • Power Distribution Unit (PDU) cables should run
    under the Cold Aisles
  • Cable trays for telecom cablings should locate
    under the Hot Aisles

37
Air Distribution Obstructions
  • Practice Recommendations for Position Equipment
    Racks Cabinets
  • Power Distribution Unit (PDU) cables should run
    under the Cold Aisles
  • Cable trays for telecom cablings should locate
    under the Hot Aisles

38
Air Distribution Obstructions
  • Practice Recommendations for Position Equipment
    Racks Cabinets
  • Power Distribution Unit (PDU) cables should run
    under the Cold Aisles
  • Cable trays for telecom cablings should locate
    under the Hot Aisles

39
Air Distribution Obstructions
  • Practice Recommendations for Position Equipment
    Racks Cabinets
  • Cabinet should be aligned with one edge along the
    edge of the cold aisle floor tile

40
Air Distribution Obstructions
41
Air Distribution Oversized Openings
  • Practice Recommendations for Position Equipment
    Racks Cabinets
  • Floor tile cuts should be no larger then
    necessary to minimize air pressure loss

42
Air Distribution Oversized Openings
43
Air Distribution Obstructions
  • Maximize Floor Height
  • Floor height restricts air flow volume
  • High airflow velocities under the floor can
    negate static pressure differentials and entrain
    air from above to below
  • May need scoops

44
Air Distribution Obstructions
45
Air Distribution Obstruction
  • Overhead System
  • Light fixtures, overhead cable trays
  • Equipment that is taller than the discharge plenum

46
Air Flow Obstruction
47
Air Distribution Obstructions
48
Air Distribution Obstructions
49
Air Distribution Air Leakage
  • Raised Floor System
  • Behind the PAC unit
  • Improper Wire/Cable openings- remove one tile to
    run wires
  • Around the perimeter of room
  • Adversely effects the under floor static pressure
    hindering the control of airflow

50
Air Distribution Air Leakage
51
Cleanliness and Proper Vapor Barrier in Subfloor
52
(No Transcript)
53
What is the right distancefrom PAC to the 1st
Rack
54
None-Direction Airflow
Pressure Static Pressure Velocity Pressure
55
Perform Better
56
Air Distribution Air Leakage
  • Overhead System
  • No shut off dampers on redundant units
  • Back draft dampers or motorized discharge dampers
    with timers

57
Air Distribution Airflow Pattern
  • Raised Floor System
  • Perforated tile quantity and layout
  • Perforated tiles too close to the PAC
  • 3 foot clearance above computer racks
  • Drop ceiling return air plenum

58
Air Distribution Airflow Pattern
59
Air Distribution Airflow Pattern
60
Air Distribution Airflow Pattern
  • Overhead System
  • Discharge diffuser too close to the PAC
  • Air discharge from one unit enters the return air
    of another

61
Air Distribution Airflow Pattern
62
Redundancy
  • N1 PAC Unitsi.e. 20 ton load, three 10 ton
    units
  • Only one pump on glycol/water loop
  • Multiple feeds to PAC units, but only one breaker
    for all rooftop condensers

63
Redundancy of Airflow
  • Can air reach each part of the room from more
    than one unit?
  • If the answer is no, then N1 may be negated

64
Alternating Cold Aisle, Hot Aisle
  • Computer Equipment Air Flow Pattern
  • In the front, out the back
  • Racks face each other along one aisle
  • Backs face each other on alternate aisle

65
Alternating Cold Aisle, Hot Aisle
66
Alternating Cold Aisle, Hot Aisle
67
Alternating Cold Aisle, Hot Aisle
68
Air Distribution Airflow Pattern
  • Raised Floor System
  • Controlling the Return AirDrop ceiling return
    air plenum

69
Air Distribution Airflow Pattern
70
Cost Effective Solution
71
Cooling Capacity One Tile
  • Perforated Tile Cooling Capacity

72
Cooling Capacity One Tile
  • Directly dependent on the airflow volume deliver
    through each tile
  • Air volume dependent on static pressure under the
    floor

73
Cooling Capacity One Tile
  • One 2 x 2 Perforated Tile
  • Typical Airflow
  • 600 cfm _at_ 0.10 w.c.
  • 200 cfm _at_ 0.02 w.c.
  • Thus, leakage and too many perf. tiles will
    reduce static pressure and reduce the ability to
    control air flow

74
Cooling Capacity One Tile
  • Maintain high sensible heat ratio
  • AT 72F, 50RH or 68F, 50RH, excessive
    condensation occurs after a 17F temperature drop

75
Cooling Capacity One Tile
17F
76
Cooling Capacity One Tile
  • Cooling Capability
  • 600 cfm x 17F x 1.08 11,000 Btuh
  • Airflow volume critical to cooling capacity

77
Cooling Capacity Per Rack
  • Four foot wide aisles
  • 22,000 Btuh sensible cooling per two feet of
    aisle
  • With racks on both sides of the aisle, the heat
    load is 3,200 Watts per two feet of racking

78
Downflow Front Discharge
79
Design Planning Stage
  • Capacity and placement of PAC
  • Room Geometry
  • Initial final room layout
  • Initial final load
  • Factors affecting air flow distribution
  • Plenum static pressure
  • Obstructions beneath plenum
  • Configuration to prevent air mixing

80
Design Planning Stage
  • Mechanical system selection
  • Air / water cool
  • Refrigeration/water piping layout
  • Keep it simple
  • Noise concerns
  • Local or remote compressor
  • Condenser / condensing
  • Energy factor
  • Dual / Free Cooling
  • NSB, increase of useable floor space
  • Free cooling system
  • Risk factor
  • Chilled water /water cooled system

81
Maintenance
  • Commissioning of basic systems
  • Refrigeration, electrical, blower RPM, etc.
  • Programming of controller
  • Configure alarm responses
  • Train End-user
  • Follow Maintenance Program

82
Maintenance
  • Common Deficiencies
  • Dirty or blocked filters
  • Undercharged DX systems
  • Un-calibrated or damaged sensors
  • Poor water flow, partially closed valves or other
    piping obstructions
  • Chilled water supply temp. (49 - 54F)

83
  • Thank You
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