Small Feature Reproducibility Measuring, Understanding and Controlling Variability in Sub-quarter micron patterning

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FLCC
Feature-level Compensation Control
Overview April 5, 2006
A UC Discovery Project
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The Industry Team
17 Supporters 2 Contributors 2 Former
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Meeting Objectives and Agenda

• Objectives
• Get re-acquainted
• Real Technologist Real Student interactions gt
  collaboration
• Results to date on Year 3
• Faculty overview presentations and student poster
  discussions
• Feedback on Year 3 and guidance on Year 4 and
  beyond
• Agenda
• Faculty Overview Presentations (110-210
  225-305)
• Questions and Answers (305-315)
• Student Poster Discussion (330-445)
• Steering Committee Meeting (445-545)
• Feedback (545-615)

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Feature Level Compensation and Control

• Industry/University collaboration through the
  U.C. Discovery Program

Four year research vision for compensating and
controlling variability at the feature level
Starting Year 3 Scoping Year 4
Novel Apparatus
Novel Vehicles
Lithography CMP Plasma Tech
Device/Diff/Int Sensors Ctrl
Collaborative Experiments
FLCC
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Thanks to Our Participating Companies and the
U.C. Discovery Program

• Very fortunate to have continuity in industry
  support from 17 companies with UC Discovery
  matching for 17 students at a time of cut-backs
  in university research.
• Support for Our University Research is only
  sustainable long term if it adds value to the
  Bottom Line of each of our Participating
  Companies.
• Mutual value starts with dialog between Working
  Technologists and Our Future Technologists.
• Looking for Guidance on High-Risk Opportunities
  where University Talent can do Pioneering
  Research.

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FLCC Assets for High-Risk Research

• Academic Knowledge and Skills on Broad Fronts
• Physical Mechanisms, Process, Device, CAD,
  Circuits
• Flexible Apparatus, Platforms and Software
• Scientific Apparatus and Instrumented Process
  Apparatus
• Source Code for Rapid Prototyping
• Working Structure of FLCC
• Novel Test Vehicle Zero Foot-Print Metrology
• Multi-Student Test Masks
• Collaboration with FLCC Companies
• Phase-Shifting Test Masks
• Vanilla CMOS Wafer Fabrication

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Scientific Apparatus Leverage Univ. Legacywith
minor investment (4)
Atomic Layer Deposition Source (Verify Molecular
Dynamics Simulation of Clusters in FC)
Polisher
Annealing Furnace (diffusion Studies)
CMP Wet-Bench
LEO SEM and Hitachi CD-SEM (PC and PCI bus
upgrades)
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Process Apparatus Industry ContributionAMAT
Centura (Y1, Y3), laser for 248 nm AMSL (Y2)
Etch Modeling Plasma (JC, DG)
Test Structures Lith (AN)
Zero Foot-Print End Point Sensors (NC)
Future Metals Device (TK)
Corrosion CMP(FD)

• Emission
• Species
• Probe

• Compatible
• Gates for high-K
• MEMS

• Passivation alternatives

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Novel Vehicle Zero Foot-Print Metrology
Plasma Etching

• Interdisciplinary
• Development
• Heterogeneous Assembly
• Metrology and Control Interface
• Modeling
• Monitoring Applications
• Plasma Etch End- Point Detection
• CMP End-Point Detection
• Lithography Image Monitor

CMP
Aerial Image Sensor
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Multi-Student Process-EDA Test Mask
4 Phase Alt-PSM High-NA, Pol Fall 04 Fab
Photronics Tested AMD, Nikon, gt UCB
Att-PSM Short Loop NMOS Mar 05 Fab DuPont Fab
Cypress
193 nm phases binary 248
4 Phase Pin-Hole Alt-PSM High-NA, Pol Spring
05 Fab Benchmark DuPont Test Plan Nikon, AMD
2006 Mar Att-PSM for Enhanced NMOS, Apr 4 Phase
Att-PSM for PI
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2006 Vanilla CMOS Wafer Fab at Cypress
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FLCC Seminars and Tutorials (210-3PM M)
9/8/03 Kickoff meeting All
2/7/05 Seminar on Lithography Video Neureuther
2/14/05 Metrology SPIE Previews Video Spanos
3/7/05 Modeling of CMP Video Dornfeld
3/28/05 Fluid Modeling of Plasmas Video Graves
4/18/05 Diffusion Video Haller
5/2/05 Tutorial on Wireless Wafer Technology Video Spanos
9/19/05 Lithography Video Neureuther
11/14/05 Process Integration Video King
10/17/05 CMP Slurry Video Doyle
10/31/05 Lithography Video Neureuther
11/14/05 Plasma Etching Video Chang
11/28/05 Kalman Filtering Video Poolla
1/23/06 Kickoff Year III Video All
2/6/06 Test Masks Video Neureuther
3/6/06 CMP Colloidal Effects Video Talbot
3/20/06 Advanced Substrates for CMOS Video Cheung
32 talks (19 video)
April 17 May 1
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The Student Team
CAMPUS STUDENT AREA ADVISOR
Berkeley Alex De Feo CMP Dornfeld
Berkeley Sunghoon Lee CMP Dornfeld
Berkeley Sangkee Min (Post Doc) CMP Dornfeld
Berkeley Shantanu Tripathi CMP Doyle
San Diego Robin Ihnfeldt CMP Talbot
Berkeley Zheng Xin (Eric) Liu Process Integration Cheung
Berkeley Christopher Liao Process Integration Cheung
Berkeley Pankaj Kalra Process Integration King
Berkeley Eric Chin Lithography Neureuther
Berkeley Juliet Holwill Lithography Neureuther
Berkeley Gregory McIntyre Lithography Neureuther
Berkeley Wojtek Poppe Lithography Neureuther
Berkeley Paul Friedberg Sensors Control Spanos
Berkeley Vorrada Loryuenyong Sensors Control Cheung
Berkeley Kurt Moen Sensors Control Spanos
Berkeley Jing Xue Sensors Control Spanos
Berkeley Qiaolin Zhang Sensors Control Spanos and Poolla
Los Angeles John Hoang Plasma Technology Chang
Berkeley Cheng-Che Hsu Plasma Technology Graves
Berkeley J.T. Gudmundsson Plasma Technology Lieberman
Berkeley Emi Kawamura Plasma Technology Lieberman
Berkeley Sungjin Kim Plasma Technology Lieberman
Berkeley Alan Wu Plasma Technology Lieberman
Jason Cain PhD, Tanuja Gopal PhD, Edward Hwang
PhD, Mark Nierode M.S., Garth Robins, PhD, Hugh
Silvestri PhD, Ling Wang, PhD and 2 UG Joe Chien
and Hideaki Oshima
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The Faculty Team
Jane Chang ChE UCLA Plasma
mechanisms and feature modeling Cheung,
Nathan EECS UCB Plasma modeling, diagnostics,
surface interactions Dornfeld, David ME UCB Chemic
al-Mechanical Planarization Doyle,
Fiona MatSci UCB Chemical-Mechanical
Planarization Graves, David ChE UCB Plasma
modeling, diagnostics, surface interactions Haller
, Eugene MatSci UCB Dopant and Self-Diffusion in
Si and SiGe Alloys King, Tsu-Jae EECS UCB Novel
Electron Devices Lieberman, Michael EECS UCB RF
sources and EM plasma modeling Neureuther,
Andrew EECS UCB Pattern Transfer
Modeling/Simulation Poolla, Kameshwar ME UCB AEC/A
PC and Metrology Spanos, Costas EECS UCB IC
Process Metrology, Diagnosis and Control Talbot,
Jan CE UCSD Chemical-Mechanical Planarization
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The Staff Team
Principal Investigator Andrew Neureuther
510 Cory Hall, ERL phone
[phone] fax [phone] neureuth_at_eecs.
berkeley.edu
Contract Management Ellen Lenzi
558 Cory Hall, ERL phone (510)
643-9665 fax [phone] lenzi_at_eecs.berkeley.
edu
System Support Changrui Yin 550 Cory Hall, phone
[phone] fax [phone] changrui_at_eecs
.berkeley.edu
Administrative Support Charlotte Jones 558 Cory
Hall, ERL phone [phone] fax (510)
642-2739 cmjones_at_eecs.berkeley.edu
Teleconference 1-888-446-3559 code 510-643-2834
http//flcc.berkeley.edu Access restricted by
password