Title: Autonomous On-Wafer Sensor Arrays
1Autonomous On-Wafer Sensor Arrays
SFR Workshop November 8, 1999 Mason Freed,
Kameshwar Poolla, and Costas Spanos Berkeley, CA
This project involves the incorporation of
sensors, a communication system, and a power
supply onto a standard silicon wafer, for the
purpose of supplying wafer-state information
during a process step.
2Overview
- Motivation
- Certain wafer-state variables are difficult or
destructive to measure, and many are impossible
to measure in real-time - Add-on in-situ measurement devices are costly and
cumbersome - Proposal distributed sensor array on a wafer
3Test-Case Etch Rate
- Polysilicon etch rate sensors based on van der
Pauw probe electrical film-thickness measurement - Use wired connections for power and
communications - Initial testing in XeF2, an isotropic, gaseous
etchant - No problem making connections to wafer
- No electrical or physical isolation necessary
4Design 1
- Connections made using edge-board connector
Sensors
Edge-board connector
5Results (Design 1)
- Eleven etch cycles performed, interferometric
thickness measurements made between each cycle. - Repeatability ? 12.89 Å
- Accuracy ? 45.9 Å
- Stability 3.2 Å drift in 15 minutes.
6Design 2
Temperature-referenced Sensors
Surface mount multiplexers
Edge-board pads
7Results (Design 2)
- Preliminary test of a single sensor only, during
etch
8Progress vs Milestones
- Year 1
- Demonstrate tethered, real-time etch-rate
measurements in chemical, non-plasma etch. (Done) - Year 2
- Demonstrate un-tethered real-time measurements
with integrated power and data processing. (Work
in progress)
9Future Work
- Next Year
- Conduct testing of new sensor design.
- Research isolation schemes to allow operation in
plasma conditions. - Work on integrating power and communications
modules onto sensor wafer, for wireless
operation. - 2000-2002
- Develop additional integrated sensors for plasma.
- Develop sensors for other processes (DUV resist
processing, Rapid Thermal Processing steps.)