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Autonomous On-Wafer Sensor Arrays

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Title: Introduction Author: yongsik Last modified by: Timothy D. Duncan Created Date: 4/10/1998 5:16:05 AM Document presentation format: On-screen Show – PowerPoint PPT presentation

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Title: Autonomous On-Wafer Sensor Arrays


1
Autonomous On-Wafer Sensor Arrays
SFR Workshop November 8, 1999 Mason Freed,
Kameshwar Poolla, and Costas Spanos Berkeley, CA
This project involves the incorporation of
sensors, a communication system, and a power
supply onto a standard silicon wafer, for the
purpose of supplying wafer-state information
during a process step.
2
Overview
  • Motivation
  • Certain wafer-state variables are difficult or
    destructive to measure, and many are impossible
    to measure in real-time
  • Add-on in-situ measurement devices are costly and
    cumbersome
  • Proposal distributed sensor array on a wafer

3
Test-Case Etch Rate
  • Polysilicon etch rate sensors based on van der
    Pauw probe electrical film-thickness measurement
  • Use wired connections for power and
    communications
  • Initial testing in XeF2, an isotropic, gaseous
    etchant
  • No problem making connections to wafer
  • No electrical or physical isolation necessary

4
Design 1
  • Connections made using edge-board connector

Sensors
Edge-board connector
5
Results (Design 1)
  • Eleven etch cycles performed, interferometric
    thickness measurements made between each cycle.
  • Repeatability ? 12.89 Å
  • Accuracy ? 45.9 Å
  • Stability 3.2 Å drift in 15 minutes.

6
Design 2
Temperature-referenced Sensors
Surface mount multiplexers
Edge-board pads
7
Results (Design 2)
  • Preliminary test of a single sensor only, during
    etch

8
Progress vs Milestones
  • Year 1
  • Demonstrate tethered, real-time etch-rate
    measurements in chemical, non-plasma etch. (Done)
  • Year 2
  • Demonstrate un-tethered real-time measurements
    with integrated power and data processing. (Work
    in progress)

9
Future Work
  • Next Year
  • Conduct testing of new sensor design.
  • Research isolation schemes to allow operation in
    plasma conditions.
  • Work on integrating power and communications
    modules onto sensor wafer, for wireless
    operation.
  • 2000-2002
  • Develop additional integrated sensors for plasma.
  • Develop sensors for other processes (DUV resist
    processing, Rapid Thermal Processing steps.)
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