Optoelectronics Packaging Research 2002

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Optoelectronics Packaging Research 2002
Peter Borgesen Project Manager
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Teardown, Product Development, Prototype
Assembly
? Identify potential improvements to current
designs and assembly practices, as well as
generic problems to be researched,
through ?teardown analysis of active and
passive components ?working with manufacturers
to solve individual process and design
problems and, in some cases, develop
complete products ?building generic model
components, assembling these into
corresponding prototype products
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Optical Fibers
? Cleaving, stripping, splicing, pigtailing,
connectorization of SMFs, DSFs, EDFs, PM
fibers ? Damage Failure ?Develop test
data interpretation (life in service) ?Optimiz
e above processes ?Specs
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AuSn Soldering
? Fundamental metallurgy (phases, kinetics) for
different reflow profiles, contact pad and
solder structures (predeposited,
composition, multilayers) ? Materials
properties vs. reflow profile metallurgies ?
Assembly process development ?Scrubbing,
pressure, ambient ?Multilayer design
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Adhesives
? Deposition -- reproducibility location
control ? Pin transfer, dispensing, dipping ?
Dependence of cure kinetics on dimensions
configuration ? Dependence of properties on
cure, dimensions configuration ?Creep,
moisture uptake permeability, adhesion,
optical performance
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Flip Chip VCSEL
? Bonding of Au-bump die ?Thermocompression ?A
dhesive (dipping, printing)
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Selective Soldering
? Automatable process for soldering of butterfly
packages etc to PCB ?Solder (paste)
deposition ?Reflow process parameters ?Interme
tallic formation (embrittlement) ?Dependence on
package (Au) supplier?
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Qualification, Robustness, Reliability
? Telcordia How do we pass? What are we
missing? ?Characterize damage and failure of
model structures in specified
tests ?Develop faster (screening) tests for
process materials optimization ?Identify
realistic damage mechanisms and check if
these are properly accelerated ? Assess effects
of mechanisms not addressed.