Fundamentals of Microsystem Packaging

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Fundamentals of Microsystem Packaging

• Presented by
• Paul Kasemir
• Ideen Taeb

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Chapter 3 Role of Packaging in Microsystems
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What is an Electronic Product?

• Examples
• Computer
• Telecommunication
• Automotive
• Medical and Consumer

4
Anatomy of a Microsystem

• Systems Packaging
• PWB/PCB
• Physical
• Analog
• Digital
• RF
• Photonic ICs
• MEMS

5
Microsystem Classification

• There are 6 categories
• Automotive
• Computer and Business
• Communications
• Consumer
• Industrial and Medical
• Military and Aerospace

• 4.8
• 38.6
• 26.1
• 11.3
• 10.6
• 8.7

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Components of a Cell Phone
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Computers and the Internet

• Computers are the backbone of the Internet
• E-business
• Server farms handle e-business information
• Streamline internal business and engineering
• Employee communications
• External relationships

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Evolution of Computers

• 1st Computer The Eniac 18K vacuum tubes
• Von Neumanns Architecture 1945
• Presents basic digital stored-program computer
• Unix in the late 1960s
• DOS in 1981
• Windows 3.1 in 1994
• Windows 95/98/NT

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Networked Computers

• Client-Server networks
• Simple low cost clients
• Potential high speed computer networks
• Remotely booted
• Example Uses
• Customer support
• Finance
• Manufacturing

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Role of Packaging in Computers

• Migrate from vacuum tubes to transistors and
  finally to integrated circuits (ICs)
• Bandwidth is the most important parameter in
  computing
• Frequency times parallel operations equals
  computing power
• More computing power means more heat produced,
  and needs packaging to cool

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How Do Computers Work?

• Microprocessor (uP) computes data
• I/O subsystem feeds instructions and data to the
  microprocessor

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Computer System Performance

• Performance is measured in MIPS (Millions of
  Instructions Per Second)
• Component of performance
• Microprocessor speed
• Instructions per cycle (MIPS/MHz)
• Microprocessor utilization
• Perf (Speed) (MIPS/MHz) (Utilization)

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Bandwidth and Performance

• Bandwidth measured in bits per second b/s
• A 64 bit wide bus at 100MHz clock (using both up
  and down edges) has 12.8 Gb/s
• Memory that uses both edges is termed
  double-data-rate DDR
• Bus Bandwidth affects cache fill rate
• Latency is also critical
• Too many requests to memory will introduce many
  wait cycles

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Packaging and Performance

• Packaging enables good bus performance
• Wide busses
• Put L2 cache on chip
• Packaging is crucial for cooling the uP
• Copper heat sinks and heat pipes

15
Packaging and Bus Design

• High via and wire densities
• High dielectric constants
• High propagation speeds
• Low capacitance
• Thin layers and many power planes
• Lower noise
• Good power distribution

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Example

• Intels IA-64 Itanium
• Multiple caches
• Efficient Heat Sink

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Role of Packaging in Telecommunications

• Communications have become much more complex
  recently
• Used to have different media for different types
  of communication
• Voice on the phone line
• Images on the TV
• Data on computers

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Multimedia

• Combination of multiple types of content into the
  same message format
• Content has different requirements
• Voice needs low delay
• Data needs perfect accuracy
• Packet switching technology guarantees quality of
  service
• Fiber optical cable provide high bandwidth for
  multimedia communications

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Mobile Phones

• Market is increasing very fast

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Wireless Communications

• Bandwidth for wireless is much smaller
• Mobile phone sizes are shrinking
• 1985 1000g
• 1990 350g

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Cell Phones

• Required components for the phone
• Radio frequency/intermediate frequency (RF/IF)
• Analog-to-digital (A/D) and digital-to-analog
  (D/A) converters
• Digital signal processing hardware
• Power and battery management

22
Transmit/Receive Chain
23
Baseband Section

• CMOS technology used in DSPs
• Can reduce the number of ICs
• Can reduce the weight and size with
  system-on-package (SOP)

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RF Section

• Uses many materials such as silicon, silicon
  germanium or gallium arsenide
• CMOS and bipolar technology
• 100s of passive components for filters and
  oscillators
• These make size reduction in the RF components
  difficult

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Battery and Weight

• Long battery life is important
• Monitor the health of battery
• Charge when plugged in
• Power digital and analog circuits of battery
• Weight is reduced by shrinking the PCB size and
  lowering the IC count
• Surface Mount Devices (SMD) lower power, weight
  and size

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Role of Packaging in Automotive Systems

• Automotive industry is as big as electronic
  industry.
• It accounts for less than 5 of total equipment
  sales.
• Growing in size every year

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Electronic Content

• In year 1998, each vehicle had 843 worth of
  electronics.
• Wires and connectors and buses plays a major role
  in Automotive electronics
• Wiring and connectors account for 49 of the
  average North American electronic today
• In ten years, it will only drop to 44

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Electronics in Automobile
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Primary Characteristic of Automotive is Harsh
Environment

• Temperature plays a big role in Automotive
  Industry
• For example, under the hood temperature can be as
  low as -40 deg C.
• And right after starting the car, it can get as
  high as 204 deg C
• This harsh temp environment is combined with
  humidity, vibration and etc.

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Engine Compartment Thermal Profile
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Electronic Packaging Technologies

• Three Different Technology
• Substrate Technologies
• Assembly Technologies
• System-Level Packaging Technologies

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IC and System Substrate Technologies

• Three different substrates are used in automotive
  electronics
• Organic,
• Ceramic
• and insulated metal

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Organic Packaging Technologies(FR-4)

• Most widely used substrate
• Includes many layers
• Substrates with higher glass are emerging for
  higher temperature and communication-related
  automotive applications
• New generation with caps and resistors embedded
  in the layers thus avoiding discrete components

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Ceramic Packaging Technologies

• Alumina is most commonly used ceramic
• Laser trimmability of the thick film resistors to
  obtain precision values is an attractive feature
  of this technology.
• Other examples are HTCC, LTCC
• In those, embedded passives are also available
• Aluminum nitride used for thermal management

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Ceramic Packaging in Automotives
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Metal Packaging Technologies

• Insulated with a dielectric layer on which the
  circuitry is built.
• More advantages in thermal management, and
  geometric

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Assembly
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System-Level Packaging Technologies

• Two different methods
• Housing Techniques
• Passivation/Conformal Coating

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Housing Technique

• Includes die-cast aluminum, die-cast plastic and
  sheet metal.
• Wire-bonding and direct-solder-attach are used to
  provide interconnection from the circuit to
  substrate

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Passivation/Conformal Coating

• Can be done at substrate or at final assembly
• Materials used acrylics, epoxies, urethanes,
  silicones and parylenes

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Implantable Electromedical Devices

• Widely used today hearing aids, heart pacemakers
  
• Developing in neurological IPGs can used to
  stimulate the spinal cord or the brain directly
  to alleviate chronic pain.
• Need to be reliable!!!!
• Decreasing in size ICDs from 120cc to 30cc

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Implantable Cardiac Defibrillator
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Microsystem Play a Dominant Role in Medical
Electronics

• Simple cardiac device can function
• Sensing the hearts electrical activity
• Sensing the motions and activity level of the
  patient
• Sensing the blood flow to and from the heart and
  etc
• These functions require low-voltage
  microprocessors,AD and AD converters and more
  functioning blocks
• Packaging will put all these in small chip or
  device.

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Role of Packaging in Consumer Electronics
US Consumer Electronic Products and Volumes
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Characteristics of Consumer Products

• Production is in the millions of units per year
• Product life cycles are often short and
  production ramp ups are fast
• Designs tend to be stable during the product run
• Product categories tend to saturate their
  available market very quickly, so the industry is
  always looking for the next application
• Brutal and sustained cost reduction, favoring the
  oldest technology that will do the jobs unless
  the small factor is critical

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Role of Packaging in Micro-Electromechanical
systems(MEMS) products

• What are MEMS?
• Benefits of MEMS
• MEMS play a major role in Medical Electronics
• MEMS applications

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What are MEMS?

• Key to further development of the industrial,
  medical, and control industry.
• Combines electrical functions and the
  micromachined elements to form a
  system-on-chip(SOC) or system-on-package(SOP)
• Compromised of microprocessor circuitry and
  mechanical functions
• Can be mass produced

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Benefits of MEMS

• Can be used in nearly every industry
• Have a beneficial cost, size and reliability

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MEMS play a major role in Medical Electronics

• 20 million microscopic pressure sensors are used
  each year in blood pressure measurement
• Many different applications such as micropumps

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MEMS Applications

• Used in measurement of gravity to determine
  orientation tilt and inclination
• Measurement of velocity and position
• Measurement of vibration and shock
• Automobile industry braking systems,
  accelerometer
• MEMS market currently in excess of 5 billion

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Summary and Future Trends
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Summary and Future Trends

• Digital performance of the order of 10 GHz
  digital computer clock speed
• RF performance of the order of 100 GHz
  RF/wireless speed
• Optical performance of the order of 10 terabit
  per second

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Summary and Future Trends
IC I/Os to be packaged in Various Systems