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P1254156884CuLaj

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Kirk Gilmore. Layton Hale. Paul O'Connor. John Oliver. Veljko Radeka. Chris Stubbs. Tim Thurston ... Multiple (e.g. 9) CCD modules on local stiff raft structures ... – PowerPoint PPT presentation

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Title: P1254156884CuLaj


1
Focal Plane Array - Integration update -
Focal plane working group Bill Althouse John
Geary Kirk Gilmore Layton Hale Paul OConnor John
Oliver Veljko Radeka Chris Stubbs Tim Thurston
2
Focal Plane Array
  • Based on Raft structures
  • Multiple (e.g. 9) CCD modules on local stiff
    raft structures
  • Each CCD module kinematically mounted to raft
  • CCD modules adjusted by vendor (preferred) for
  • Parallel
  • Height
  • Raft features
  • Optically flat (lt 1u)
  • Kinematically mounted to FPA Structure
  • Raft mount adjustability
  • Manual (vernier screws, )
  • Actuated (Piezo, )

3
Focal Plane Array - Integration -
4
Focal Plane Array - Integration -
5
CCD Module/Raft assembly
CCD
Wire bonds
Aluminum nitride carrier/pwb
High density interconnects
Invar frame
Assembly tool holes
6
CCD Module/Raft assembly
CCD
Aluminum nitride carrier/pwb
Kinematic mounts
Invar frame
7
(No Transcript)
8
CCD Module
-Tim Thurston-
9
Raft assy detail
-Tim Thurston-
10
Assembly detail guide pins
-Tim Thurston-
11
Focal plane power (CCD only) (For 2 sec readout
on 12 sec cadence)
Energy Instantaneous power Average power 220 sensor total ave power Location
Radiation 726 mW 726 mW 160 W On chip
Parallel clocks 16 mJ 8 mW 1.3 mW 0.3 W Off chip
Serial clocks 256 mJ 128 mW 21.3 mW 4.7 W Off chip
Source followers 80 mW 80 mW 17.6 Off chip
Source followers 80 mW 80 mW 17.6 On chip
12
Raft conceptual design - Thermal modeling -
-Tim Thurston-
  • Thermal modeling in progress
  • Detailed CCD module model with heat sources
  • Heat removal through kinematic mounting studs
    (MIT-LL)
  • Heat removal through direct strap to CCD module

13
FPA Temperature profile
Raft Boundary
CCD
Temperature Drop from CCD to Cold Sink
Raft
Center Raft
Edge Raft
HX Straps
.5 C
.5 C
15 C
Raft Cage
10 C
Structural Strong Back
3 C
3 C
Cold Plate
16 C
11 C
Cold Sink
14
FPA Structure design/FEA - Layton Hale-
  • Modeling
  • Deflections, gravity
  • Normal modes
  • Thermal
  • x-y motions

15
4 FOV ? 74 cm ?
WFS
8/5/04 workshop CCDs 3x3
3.5 FOV ? 64 cm ?
X
X
X
X
X
X
X
X
X
X
X
  • 4096x4096 pixels
  • 10 µm pixels
  • 1678 mm2 active
  • 41.7 mm x 41.7 mm Si
  • 42 mm pitch (0.3 mm gaps)
  • 95 fill factor
  • 25 x 3x3 225 chips
  • If allow dummies outside 64cm, then?21 rafts
    with 9 live4 corners with 3 live ea
  • 201 live chips total

X
X
X
X
X
X
X
X
X
X
X
X
X
  • wea 8/6/04

16
Important outstanding issues
  • Wavefront sensors
  • How many?
  • How big? ? footprint
  • Special locations or sacrifice imager
    locations?
  • Fill factor budget for WFSs
  • Bandwidth, read rate?
  • Who specifies?
  • WFS Group?
  • FP Group
  • Other?
  • Guide sensors
  • Same questions
  • Calibration sensors
  • Ditto
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