Title: Ion Beam Lithography Using Membrane Masks
1 Ion Beam Lithography
Using Membrane Masks
- Y.S. Kim, W. Hong, H.J.Woo,
- H.W.Choi, G.D. Kim, J.H. Lee
- Ion Beam Laboratory
- Korea Institute of Geoscience and Mineral
Resources - Gajeongdong 30, Yuseonggu, Daejeon 305-350, Korea
- S. Lee
- Department of Chemistry Daejeon University
- Daejeon 300-716, Korea
2Motivation
- Ion Beam Lithography (IBL) using membrane masks
has been forgotten for more than 10 years. - The reason seems to be that the angular spread of
the incident ion beam in the membrane is
difficult to overcome even when channeling masks
are used. - Membrane mask has, however, many advantages such
as rigidity, easy fabrication, durability, etc
and deserves to be studied further. - The angular beam spread of channeling masks
(about 0.5o) is enough for obtaining sub 100nm
pattern as will be shown
What has been done
- Feasibility of the IBL using membrane masks has
been studied both by simulation and experiment - A full procedure of membrane mask fabrication has
been developed - IBL was performed using a 2 mm Si3N4 mask and a
4.5 mm Si channeling with 400 - 500 keV proton
beam
3Advantage and Disadvantage of IBL
Advantage Good sensitivity for 0.1 mm pattern
X-ray 375 mJ/cm2 e-beam 100 mC/cm2 IBL 4.5
mC/cm2 (720mJ) Good intrinsic resolution 10 nm
limitation not from the wavelength but from PR
Disadvantage In vacuum treatment 11 mask
lateral straggling non familiar method - no
extensive study
Ref. P.H. Rose, NIM B37/38, p26
4Effect of angular spread at the membrane on
lateral resolution - TRIM simulation
- Meaning Resolution depends rather on the
resist contrast
5Effect of Angular Spread at the Membrane to the
PR pattern
TRIM simulation
- Effect of Angular Spread Contradiction of
replicated pattern for small patterns - Can be solved by the pattern size control at the
mask
6Angular Spread Measurement
Angular Distribution of protons passing through a
4.5 mm 100 Si membrane
- Angular spread is insensitive to the incident
energy - Other words, insensitive to the membrane
thickness
7Angular Spread and Residual Energy of channeled
and non channeled protons
- For protons passing through 4.5 mm Si
- Width of angular distribution
Residual energy
8Preparation of Membrane Masks
- Two kinds of masks fabricated
- non-channeling mask
- 2mm low stress silicon nitride
- Fabrication procedure very similar to the X-ray
mask - Channeling mask
- 4.5 mm Si membrane
- Fabrication procedure as shown
9Optimization of Pattern and membrane thickness-
for channeling mask
- Pattern thickness
- For 450 keV protons, 200nm thick pattern is
enough for scattering 96 of protons incident on
the pattern - easy fabrication sub 100nm patterns
- Membrane thickness
- As thick as possible provided the residual
energy is enough for penetrating through the
object PR (about 100keV) - minimization of pattern distortion during
irradiation
10Optimization of Resist Development
- Choice of Developer
- Choose a developer which shows the best contrast
- Contrast slop in the dose vs. develop speed
curve - Best so far
- 20 morpholine
- 5 etanolamine,
- 60 diethylenglycol - monobutylether
- 15 distilled water
- Choose a temperature at which the contrast
becomes best
Optimum develop condition
11SEM Images of Mask and Replicated Pattern
Energy too large
- Electroplated mask pattern
Energy normal
Energy too small
Replicated Pattern on PMMA by non-channeling
mask Mask to wafer distance 10 mm, Angular
spread 5o to 10o
12Conclusion
- The IBL using channeling mask was studied already
about 20 years ago, but was forgotten for many
years afterwards. - We want to emphasize, however, the method
deserves to get attention, mainly because the
problem with angular spread cannot be an fatal
restriction. - Simulation and some preliminary experiment on the
angular spread shows the promising
characteristics of the method. - Provided a good channeling membrane mask is
fabricated, sub 0.1 um patterning can be done
rather simply.