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Hamburg Bonding Report

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Some PA s were not glued parallel, making bonding hard ... Quality of gluing of modules is critical and has improved. Pull test results look goode ... – PowerPoint PPT presentation

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Title: Hamburg Bonding Report


1
Hamburg Bonding Report
  • Georg Steinbrück
  • Hamburg University
  • CMS Meeting June 2004
  • Report from Hamburg
  • Pull tests stats
  • Loop heights
  • ARC tests

2
Bonding in Hamburg
  • Hamburg was recently officially certified for
    bonding
  • Sent 3 modules to CERN for inspection
  • Have bonded 37 Modules in Hamburg so far
  • 8 R1N 13 R1S 16 R3
  • 20 more modules HV bonded
  • Throughput impacted by
  • Need to support sensors under HV bonds by
    inserting capton tape
  • Pull tests Basically increases bonding time x2
  • HV and Sensor Bonding in two steps

3
Experience
  • Initially had a lot of trouble with the HV bonds
    and outer sensor bonds since sensor not well
    supported in this area
  • Went through some trouble building a good
    bonding jig
  • Had glueing scheme for frame adjusted Glue
    spots carbon-capton and capton-sensor were NOT
    aligned, now aligned?Results look much better,
    but additional support still needed
  • Some PAs were not glued parallel, making
    bonding hard
  • We gave feedback to gantries, problems
    known/solved

4
Module 30200020029287
One recent example of a glueing problem
5
Pull Test Results PA test Area
R1N
R1S
R3
Based on 30 modules.
6
Pull Test Results 50th wire PA-Sensor
R1S
R1N
R3
Based on 30 modules.
7
Loop heights
PA test bonds
PA-sensor bonds
280 mus
30 deg
1mm
30 deg
Sorry, no pictures...
8
ARC tests
ARCS 7.0 with TIB one sensor cuts (except for
noise cuts For R1) Xml files with Xflag 4.2
9
ARC tests Cuts
Correct R1 cuts by difference in noise means
10
Statistics details
37 Modules bonded in HH, 30 tested
  • 22 grade A, 4 grade C
  • no new pinholes found
  • 7 faulty modules
  • 3/131 fail initial ARC fast test

32019
Sent out w/o full test
30200020032001 bent hybrid bonds, in bond center
for repair?Not fully tested 30200020032002 root
file?
11
Fault stats Ring 3
12
Fault stats Ring 1
13
IV curves R1 and R3
Module 3020002002021 already had high current
before PA-Sensor bonding. Graded AF (IMODgt5xISen)
14
Test Results on the Web
Thanks to Marko Dragicevic (Wien) for supplying
the scripts!
15
Web
16
Summary
  • Bonded and tested 37 modules 20 modules HV
    bonded
  • Bonding rates are increasing
  • Quality of gluing of modules is critical and has
    improved
  • Pull test results look goode
  • ARC tests uploading to db routine now
  • 4 grade C modules

17
Backup
18
Module 30200020032011
Bad APV
Cosmic run
Two events in a cosmic run
Difference max and min PH in ARC LED test
19
Module 30200020026938 (R1S)
38
Difference max and min PH in ARC LED test
Mean pedestal versus pipeline for bad APV
20
Module 30200020032019
Difference max and min PH in ARC LED test
Mean pedestal versus pipeline for bad APV
21
Module 30200020027058
38
22
ARC testing in Hamburg
  • 22 grade A, 4 grade C
  • no new pinholes found
  • 7 faulty modules
  • 3/131 fail initial ARC fast test

30 Modules bonded and tested
Using ARCS 7.0 and Xflag 4.2 Keeping up with
database
23
Bonding in Hamburg
R1N
R1S
R3
  • 30 Modules bonded
  • initial issues with HV bonds/glue resolved

24
Currents before and after Sensor Bonding
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