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EE5342

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q(Vox) q(fm-cox) q(VFB) VFB= VG-VB, when Si bands are flat. Ex --Vox-- - L25 April 21. 5. Flat-band parameters. for n-channel (p-subst) L25 April 21. 6 ... – PowerPoint PPT presentation

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Title: EE5342


1
EE5342 Semiconductor Device Modeling and
CharacterizationLecture 25 - Spring 2005
  • Professor Ronald L. Carter
  • ronc_at_uta.edu
  • http//www.uta.edu/ronc/

2
Fully biased n-MOScapacitor
VG
Channel if VG gt VT
VS
VD
EOx,xgt 0
e- e- e- e- e- e-
n
n
p-substrate
VsubVB
Acceptors
Depl Reg
y
0
L
3
Fully biased MOScapacitor in inversion
VGgtVT
Channel
VSVC
VDVC
EOx,xgt 0
e- e- e- e- e- e-
n
n
p-substrate
VsubVB
Acceptors
Depl Reg
y
0
L
4
Flat band with oxidecharge (approx. scale)
Al
SiO2
p-Si
lt--Vox--gt-
q(Vox)
Ec,Ox
q(ffp-cox)
Ex
q(fm-cox)
Eg,ox8eV
Ec
EFm
EFi
EFp
q(VFB)
Ev
VFB VG-VB, when Si bands are flat
Ev
5
Flat-band parametersfor n-channel (p-subst)
6
MOS energy bands atSi surface for n-channel
Fig 8.10
7
Computing the D.R. W and Q at O.S.I.
8
Qd,max and xd,max forbiased MOS capacitor
Fig 8.11
Qd,max/q (cm-2)
xd,max (microns)
9
Fully biased n-channel VT calc
10
(No Transcript)
11
Computing thethreshold voltage
12
(No Transcript)
13
n-channel VT forVC VB 0
Fig 10.20
14
Flat-band parametersfor p-channel (n-subst)
15
Fully biased p-channel VT calc
16
p-channel VT forVC VB 0
Fig 10.21
17
Ion implantation
18
Dotted box approx
19
(No Transcript)
20
Mobilities
21
Differential chargesfor low and high freq
high freq.
From Fig 10.27
22
Ideal low-freqC-V relationship
Fig 10.25
23
Comparison of lowand high freq C-V
Fig 10.28
24
Effect of Qss onthe C-V relationship
Fig 10.29
25
n-channel enhancementMOSFET in ohmic region
0lt VTlt VG
Channel
VS 0
0lt VDlt VDS,sat
EOx,xgt 0
e-e- e- e- e-
n
n
Depl Reg
p-substrate
Acceptors
VB lt 0
26
Conductance ofinverted channel
  • Qn - COx(VGC-VT)
  • ns COx(VGC-VT)/q, ( inv elect/cm2)
  • The conductivity sn (ns/t) q mn
  • G sn(Wt/L) ns q mn (W/L) 1/R, so
  • I V/R dV/dR, dR dL/(nsqmnW)

27
Basic I-V relationfor MOS channel
28
I-V relation for n-MOS (ohmic reg)
ohmic
ID
non-physical
ID,sat
saturated
VDS
VDS,sat
29
Universal draincharacteristic
ID
VGSVT3V
9ID1
ohmic
saturated, VDSgtVGS-VT
VGSVT2V
4ID1
VGSVT1V
ID1
VDS
30
Characterizing then-ch MOSFET
VD
ID
D
G
B
S
VGS
VT
31
Low field ohmiccharacteristics
32
MOSFET DeviceStructre Fig. 4-1, MA
33
4-7a (AM)
34
Figure 4-7b (AM)
35
Figure 4-8a (AM)
36
Figure 4-8b (AM)
37
Body effect data
Fig 9.9
38
References
  • CARM Circuit Analysis Reference Manual,
    MicroSim Corporation, Irvine, CA, 1995.
  • MA Semiconductor Device Modeling with SPICE,
    2nd ed., by Paolo Antognetti and Giuseppe
    Massobrio, McGraw-Hill, New York, 1993.
  • MK Device Electronics for Integrated
    Circuits, 2nd ed., by Richard S. Muller and
    Theodore I. Kamins, John Wiley and Sons, New
    York, 1986.
  • Semiconductor Physics and Devices, by Donald A.
    Neamen, Irwin, Chicago, 1997
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