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EE5342

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Estimating LAMBDA. L30 May 6. 4. SPICE mosfet Model. Instance CARM ... id = id,sat/(1-LAMBDA*vds) where id,sat = id,ohmic(vds,sat) L30 May 6. 21. Level 2 Static ... – PowerPoint PPT presentation

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Title: EE5342


1
EE5342 Semiconductor Device Modeling and
CharacterizationLecture 30 - Spring 2004
  • Professor Ronald L. Carter
  • ronc_at_uta.edu
  • http//www.uta.edu/ronc/

2
MOSFET circuitparameters
3
Estimating LAMBDA
4
SPICE mosfet Model Instance CARM, Ch. 4, p. 290
  • L Ch. L. m
  • W Ch. W. m
  • AD Drain A m2
  • AS Source Am2
  • NRD, NRS D and
  • S diff in squares
  • M device multiplier

5
SPICE mosfet model levels
  • Level 1 is the Schichman-Hodges model
  • Level 2 is a geometry-based, analytical model
  • Level 3 is a semi-empirical, short-channel model
  • Level 4 is the BSIM1 model
  • Level 5 is the BSIM2 model, etc.

6
SPICE ParametersLevel 1 - 3 (Static)
7
SPICE ParametersLevel 1 - 3 (Static)
  • 0 aluminum gate, 1 silicon gate opposite
    substrate type, 2 silicon gate same as
    substrate.

8
SPICE ParametersLevel 1 - 3 (Q N)
9
Level 1 Static Const.For Device Equations
  • Vfb -TPGEG/2 -Vtln(NSUB/ni) -
    qNSSTOX/eOx
  • VTO as given, or
  • Vfb PHI GAMMAsqrt(PHI)
  • KP as given, or
  • UOeOx/TOX
  • CAPS are spice pars., technological constants are
    lower case

10
Level 1 Static Const.For Device Equations
  • b KPW/(L-2LD) 2K, K not spice
  • GAMMA as given, or
  • TOXsqrt(2eSiqNSUB)/eOx
  • 2phiP PHI as given, or
  • 2Vtln(NSUB/ni)
  • ISD as given, or JSAD
  • ISS as given, or JSAS

11
Level 1 Static Device Equations
  • vgs lt VTH, ids 0
  • VTH lt vds VTH lt vgs,
  • id KPW/(L-2LD)vgs-VTH-vds/2
  • vds(1 LAMBDAvds)
  • VTH lt vgs lt vds VTH,
  • id KP/2W/(L-2LD)(vgs - VTH)2
  • (1 LAMBDAvds)

12
n-channel enhancementMOSFET in ohmic region
0lt VTlt VG
e- channel ele implant ion
Channel
VS 0
0lt VDlt VDS,sat
EOx,xgt 0
n
n
e-e- e- e- e-

Depl Reg
p-substrate
Acceptors
VB lt 0
13
Subthreshold conduction
  • Below O.S.I., when the total band-bending lt
    2fp, the weakly inverted channel conducts by
    diffusion like a BJT.
  • Since VGSgtVDS, and below OSI, then NagtnS gtnD, and
    electr diffuse S --gt D

Electron concentration at Source
Concentration gradient driving diffusion
14
Subthreshold current data
Figure 10.1
Figure 11.4
15
Mobility variationdue to Edepl
Figures 11.7,8,9
16
Velocity saturationeffects
Figure 11.10
17
SPICE ParametersLevel 2
18
SPICE ParametersLevel 2 3
19
Level 2 StaticDevice Equations
  • Accounts for variation of channel potential for 0
    lt y lt L
  • For vds lt vds,sat vgs - Vfb - PHI
  • g21-sqrt(12(vgs-Vfb-vbs)/g2
  • id,ohmic b/(1-LAMBDAvds)
  • vgs - Vfb - PHI - vds/2vds
  • -2gvdsPHI-vbs)1.5-(PHI-vbs)1.5/3

20
Level 2 StaticDevice Eqs. (cont.)
  • For vds gt vds,sat
  • id id,sat/(1-LAMBDAvds)
  • where id,sat id,ohmic(vds,sat)

21
Level 2 StaticDevice Eqs. (cont.)
  • Mobility variation
  • KP
  • KP(esi/eox)UCRITTOX
  • /(vgs-VTH-UTRAvds)UEXP
  • This replaces KP in all other formulae.

22
SPICE ParametersLevel 3
23
Project 3
  • Project 3 is posted on the web
  • See www.uta.edu/ronc/ 5342/projects/5342Proje
    ct3.pdf

24
Project 2 Parameter Values Extracted
  • RB " 1.233K"
  • IRB " 1.000u"
  • RBM " 151.8 "
  • RE " 2.560 "
  • RC " 26.00 "
  • CJE " 2.344p"
  • VJE " 762.0m"
  • MJE " 344.9m"
  • CJC " 1.234p"
  • VJC " 570.8m"
  • MJC " 347.6m"
  • CJS " 100.4f"
  • VJS " 566.0m"
  • MJS " 267.0m"
  • IS " 891.8a"
  • BF " 113.6 "
  • NF " 1.044 "
  • VAF " 83.50 "
  • IKF " 13.45m"
  • ISE " 20.40f"
  • NE " 1.772 "
  • BR " 2.270 "
  • NR " 1.013 "
  • VAR " 22.92 "
  • IKR " 2.000m"
  • ISC " 537.6f"
  • NC " 1.675 "

25
Project 2 Optimized Parameter Values
  • RB " 1.233K"
  • IRB " 986.9n"
  • RBM " 122.2 "
  • RE " 2.831 "
  • RC " 11.71 "
  • CJE " 2.344p"
  • VJE " 762.0m"
  • MJE " 344.9m"
  • CJC " 1.234p"
  • VJC " 570.8m"
  • MJC " 347.6m"
  • CJS " 100.4f"
  • VJS " 566.0m"
  • MJS " 267.0m"
  • IS " 890.9a"
  • BF " 123.7 "
  • NF " 1.043 "
  • VAF " 86.04 "
  • IKF " 14.33m"
  • ISE " 28.54f"
  • NE " 1.878 "
  • BR " 2.657 "
  • NR " 1.012 "
  • VAR " 21.25 "
  • IKR " 6.470m"
  • ISC " 537.6f"
  • NC " 1.675 "

26
Project 2 Parameter Values Used for Data
  • RB " 1.234K"
  • IRB " 987.0n"
  • RBM " 123.0 "
  • RE " 2.345 "
  • RC " 5.678 "
  • CJE " 2.345p"
  • VJE " 765.4m"
  • MJE " 345.6m"
  • CJC " 1.234p"
  • VJC " 567.8m"
  • MJC " 345.6m"
  • CJS " 100.4f"
  • VJS " 566.8m"
  • MJS " 269.6m"
  • IS " 891.0a"
  • BF " 123.0 "
  • NF " 1.043 "
  • VAF " 86.95 "
  • IKF " 14.91m"
  • ISE " 28.86f"
  • NE " 1.876 "
  • BR " 2.345 "
  • NR " 1.012 "
  • VAR " 23.45 "
  • IKR " 23.45m"
  • ISC " 1.095p"
  • NC " 1.875 "

27
References
  • CARM Circuit Analysis Reference Manual,
    MicroSim Corporation, Irvine, CA, 1995.
  • MA Semiconductor Device Modeling with SPICE,
    2nd ed., by Paolo Antognetti and Giuseppe
    Massobrio, McGraw-Hill, New York, 1993.
  • MK Device Electronics for Integrated Circuits,
    2nd ed., by Richard S. Muller and Theodore I.
    Kamins, John Wiley and Sons, New York, 1986.
  • Semiconductor Physics and Devices, by Donald A.
    Neamen, Irwin, Chicago, 1997
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