Chapter 1 Figures

1
CHAPTER 1
2
Master Figure
3
Implementation
Technology
System Components
Production
SOC
Active components
Development
SIP
IC packages (including stacked packages)
Research
SOP
IC to package and to board interconnections
Power supplies System boards Passive
components Thermal structures and heat
sinks Sockets and connectors
4
Fig. 1.1
PCB fan mounting point
Heat Sink
IC
IC Package
Connectors (I/O Ports)
Discrete Passives
System Board
5
Fig. 1.2
100
SIP
System Miniaturization
30
STACKED CHIP
SOC
INTEGRATION
IC INTEGRATION
15
PAST FOCUS
PRESENT FOCUS
FUTURE FOCUS
6
Fig. 1.3
7
Fig. 1.4
8
Fig. 1.5
SOC
SIP
WAFER
IC INTEGRATION
IC PKG.
SOP
PACKAGE ENABLED INTEGRATION
Connectors
Board
SYSTEMPKG.
SYSTEM INTEGRATION
Discretes
9
Figs. 1.6 a, b
10
Fig. 1.7
11
Fig. 1.8
12
Figs. 1.9 a, b
13
Fig 1.10
14
Fig. 1.11
15
Fig. 1.12
16
Fig. 1.13
17
Figs. 14 a, b
18
Fig. 1.15
19
Fig. 1.16 (left right)
20
Fig. 1.17
21
2nd Law of Electronics by SOP
Fig. 1.18
Moores Law For ICs
10 of Systems
Moores Law for ICs
MCM, 3D ICs, SIP

90 of Systems
2nd Law of Electronics
Sources IBM, Intel
22
Fig. 1.19
Evolution of IC Packages
SIP
Courtesy Ralf Pleininger, Infineon
23
Fig. 1.20
24
Fig. 1.21
25
Electronic Miniaturization Trend
Fig. 1.22
26
Fig 1.23 a
27
Fig. 1.23b
28
Fig 1.24
29
Fig. 1.25
Integrated High Density Wiring -EIT, Asahi, IBM,
Ibiden, Matsushita, Shipley, Northrup Grumman,
Hitachi, Samsung, Materials Promerus, Shipley,
DuPont, DOW Coating SCS (Meniscus) Curing
Lambda (Microwave) Metallization ATOTECH,
Technics, Shipley
MEMS Raytheon, TI, University of Arkansas
WLP Assembly Lead Free Solders Amkor , IBM,
National Semiconductor, Fujitsu, KS , Unitive ,
Cookson
Thermal High Heat Flux- GE, HP, IBM, SUN,
Intel and Fujitsu Portable Nokia, SONY,
Motorola, Ericsson and Intel
Mixed Signal Test IBM Bromont Agilent
Embedded Opto Back Plane NTT, Siemens,
Infineon Waveguides Toray, Kyocera, DuPont,
Shipley, DOW, GE MSM Detectors - Fraunhoffer,
Kyocera
Reliability Motorola Intel IBM SONY TI
Embedded RF SOP Embedded Passives IBM,
EKC-DuPont, Sanmina, 3M, Boeing, Shipley,
Motorola, Nokia, Intel, Amkor, Lucent, IMEC,
Kyocera Antennaes- Asahi, DoD, NASA Design Tools-
Cadence
Signal and Power Integrity EMI NEC Corp.,
Toshiba Power Distribution Sun, Cadence, Intel
and AMD Signal Integrity IBM and
Ansoft Embedded Decoupling Sanmina, EIT,
DuPont Design Tools Cadence, Sun, Motorola,
HRL, Rambus
30
Fig. 1.26
31
Fig. 1.27
32
Fig. 1.28
33
Fig. 1.29 a
34
Fig 1.29 b
35
Fig. 1.30
36
Fig. 1.31
37
Fig. 1.32
38
Fig. 1.33