VELO Overview

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VELO Overview

• T. Bowcock
• University of Liverpool

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Post-TDR

• Hardware
• Software
• Critical Issues
• Summary

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Hardware

• Sensors
• Hybrids
• Thermo-Mechanical Module
• Testbeam
• Production Facilities

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Hardware Sensors (1)

• Two types of sensors produced
• Hamamatsu (nn)- 1998
• Micron (pn) 2000
• In fabrication (mask design at Lpool)
• Micron (nn) 2001

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Hardware Sensors (2)

• Laboratory
• High precision tests with 1060nm lasers for both
  sets of detectors (LHCb note)
• Testbeam at CERN
• Under preparation for 2001

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Hardware Sensors (3)

• Additional test equipment
• Cosmic ray facility now commissioned
• Shorter wavelength laser (900nm)
• Ordered
• Automated Scanning x-y stage

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Hardware Sensors (4)

• Simulation complete
• First principle analysis of leakage currents and
  charge collection as a function voltage
• Agreement with data
• Note low voltage phenomena lt20V Q/I amplifiers.

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Hardware Sensors (5)

• Identify manufactures for Production
• Hamamatsu (withdrawn nn option)
• Micron (nn, pn)
• CSEM, Eurysis, SEIKO, SINTEF, ST
• Technical discussions ? Price Enquiry

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Hardware Hybrids(1)

• Hybrid DesignProduction to IDE
• Delivered
• Bonded and mounted with chips
• Fan-ins produced
• Under test
• 4 chips r/o (26/6)

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Hardware Hybrids(2)

• Kapton version to be ordered early 7/01
• SCT-VELO design (Liverpool)
• improved cable connections
• Viable pre-production prototype
• Beetle design

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Hardware Module(1)

• Thermal models for TDR
• Cooling system
• Safety issues addressed

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Calibration Model
Delta(T) (from nominal)
Power
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glue
Chip
kapton
sensor
ceramic
TPG
glue
Chip
kapton
CF(UD)
sensor
CF weave
TPG
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Hardware Module (2)

• Prototype and testing of adjustment
• Re-engineering
• Carbon fibre base
• O CTE materials including adjustment screws

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(slew)
(pitch)
(roll)
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Hardware Module (3)

• Curvature of the sensors measured
• We may need to survey (cold?) the modules

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Hardware Module (4)
Measurement points
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Hardware Testbeam

• Module for October 2001
• See also software

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Hardware Production Facilities

• Clean rooms
• Bonding equipment
• Jigs and Assembly
• Vacuum compatible glue dispensing

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Production Facilities
RD
LHCb
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Software

• TDR analysis and optimisation
• Monte Carlo simulations of VELO
• VELO core software (meeting 5/6 July)
• Alignment
• Testbeam

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Software Optimisation

• We generated and analysed over 10m bb events
  generated and analysed for different
  configurations Physics Section
• Optimisation paper (for TDR) huge effort
  impossible without substantial effort

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Software Silicon

• Other (non GEANT software) for optimisation of
  operating conditions

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Software Alignment(1)

• Alignment Underway
• From HERA code used by H1
• Fast determination of global parameters
• Reduced to linear problem

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Software Alignment(2)

• Curvature of detectors

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Residuals
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Software Other

• LHCb production
• LHCb Grid
• Testbeam as testbed

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Critical Issues

• Electronics
• Electronics
• Electronics
• Manufacturers for Silicon
• Grid

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Summary

• Sensors
• Hybrid
• Module
• Software